公开(公告)号：US20050271871A1

公开(公告)日：2005-12-08

申请号：US11138401

申请日：2005-05-27

Applicant: Shouji Yamazaki ,  Kazumi Yamada ,  Naoyuki Ashida

Inventor： Shouji Yamazaki ,  Kazumi Yamada ,  Naoyuki Ashida

IPC: C08J9/228 ,  B29C44/00 ,  B32B1/00 ,  B32B3/00 ,  B32B3/26

CPC classification number: C08J9/0066 ,  B29C44/18 ,  C08J9/32 ,  C08J2325/06 ,  Y10T428/249953

Abstract: The high proof bending stress structure member of the present invention includes a thin wall frame structure member, a solidified granular material comprising a first granular material each of which is charged closely inside the thin wall frame structure member, such that one of the first granular material is in contact with another first granular material adjacent thereto, and a thermoplastic resin foam which fills the gap between each of the first granular material and which is welded to the surface of the first granular material whereby connecting the first granular material to each other, and the inner wall of the thin wall frame structure member with the first granular material.

Abstract translation: 本发明的高强度弯曲应力结构件包括薄壁框架结构件，固化颗粒材料，其包括密封在薄壁框架结构件内部的第一颗粒材料，使得第一颗粒材料 与另一个与其相邻的第一颗粒材料接触，以及热塑性树脂泡沫，其填充每个第一颗粒材料之间的间隙，并且焊接到第一颗粒材料的表面，从而将第一颗粒材料彼此连接，以及 薄壁框架结构构件的内壁具有第一颗粒材料。