COMPUTER-IMPLEMENTED METHODS FOR INSPECTING AND/OR CLASSIFYING A WAFER
    1.
    发明申请
    COMPUTER-IMPLEMENTED METHODS FOR INSPECTING AND/OR CLASSIFYING A WAFER 有权
    用于检查和/或分类WAFER的计算机实现方法

    公开(公告)号:US20100060888A1

    公开(公告)日:2010-03-11

    申请号:US12179260

    申请日:2008-07-24

    CPC classification number: H01L22/12 G01N21/9501 H01L2924/0002 H01L2924/00

    Abstract: Computer-implemented methods for inspecting and/or classifying a wafer are provided. One computer-implemented includes detecting defects on a wafer using one or more defect detection parameters, which are determined based on a non-spatially localized characteristic of the wafer that is determined using output responsive to light scattered from the wafer generated by an inspection system. Another computer-implemented method includes classifying a wafer based on a combination of a non-spatially localized characteristic of the wafer determined using output responsive to light scattered from the wafer generated by an inspection system and a spatially localized characteristic of the wafer determined using the output.

    Abstract translation: 提供了用于检查和/或分类晶片的计算机实现的方法。 一种计算机实现的包括使用一个或多个缺陷检测参数来检测晶片上的缺陷,所述缺陷检测参数是基于使用响应于由检查系统产生的晶片散射的光的输出而确定的晶片的非空间局部特征确定的。 另一种计算机实现的方法包括基于使用响应于由检查系统产生的晶片散射的光的输出确定的晶片的非空间局部化特性和使用输出确定的晶片的空间局部化特性的组合来分类晶片 。

    Computer-implemented methods for inspecting and/or classifying a wafer
    2.
    发明授权
    Computer-implemented methods for inspecting and/or classifying a wafer 有权
    用于检查和/或分类晶片的计算机实现的方法

    公开(公告)号:US08269960B2

    公开(公告)日:2012-09-18

    申请号:US12179260

    申请日:2008-07-24

    CPC classification number: H01L22/12 G01N21/9501 H01L2924/0002 H01L2924/00

    Abstract: Computer-implemented methods for inspecting and/or classifying a wafer are provided. One computer-implemented includes detecting defects on a wafer using one or more defect detection parameters, which are determined based on a non-spatially localized characteristic of the wafer that is determined using output responsive to light scattered from the wafer generated by an inspection system. Another computer-implemented method includes classifying a wafer based on a combination of a non-spatially localized characteristic of the wafer determined using output responsive to light scattered from the wafer generated by an inspection system and a spatially localized characteristic of the wafer determined using the output.

    Abstract translation: 提供了用于检查和/或分类晶片的计算机实现的方法。 一种计算机实现的包括使用一个或多个缺陷检测参数来检测晶片上的缺陷,所述缺陷检测参数是基于使用响应于由检查系统产生的晶片散射的光的输出而确定的晶片的非空间局部特征确定的。 另一种计算机实现的方法包括基于使用响应于由检查系统产生的晶片散射的光的输出确定的晶片的非空间局部化特性和使用输出确定的晶片的空间局部化特性的组合来分类晶片 。

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