公开(公告)号：US08653380B2

公开(公告)日：2014-02-18

申请号：US12659172

申请日：2010-02-26

申请人： Hajime Nishi ,  Ken Takahashi ,  Hiromitsu Kuroda ,  Hiroshi Okikawa ,  Kuniaki Kimoto ,  Hiroyuki Akutsu ,  Yukio Ito ,  Iku Higashidani

发明人： Hajime Nishi ,  Ken Takahashi ,  Hiromitsu Kuroda ,  Hiroshi Okikawa ,  Kuniaki Kimoto ,  Hiroyuki Akutsu ,  Yukio Ito ,  Iku Higashidani

IPC分类号： H05K1/16

CPC分类号： H01L31/0508 ,  H01L2924/0002 ,  Y02E10/50 ,  H01L2924/00

摘要： A solar cell lead includes a strip plate conductive material that a surface thereof is coated with solder plating. The coated solder plating includes a concavo-convex portion on a surface thereof and a 0.2% proof stress of not more than 90 MPa by a tensile test. The coated solder plating includes a hot-dip solder plating layer formed by supplying a molten solder on the surface of the strip plate conductive material. A plating temperature is set to be not higher than a liquidus-line temperature of the used solder plus 120° C., and an oxide film on a surface of the hot-dip solder plating layer is set to be not more than 7 nm in thickness.

摘要翻译： 太阳能电池引线包括其表面涂覆有焊料电镀的带状导电材料。 涂覆的焊料镀层在其表面上包括凹凸部分，通过拉伸试验包括不大于90MPa的0.2％屈服应力。 涂覆的焊料镀层包括通过在带状导电材料的表面上提供熔融焊料而形成的热浸焊料镀层。 将电镀温度设定为不高于所使用焊料的液相线温度加上120℃，并且将热浸焊料镀层的表面上的氧化膜设定为不大于7nm 厚度。

公开(公告)号：US20100218981A1

公开(公告)日：2010-09-02

申请号：US12659172

申请日：2010-02-26

申请人： Hajime Nishi ,  Ken Takahashi ,  Hiromitsu Kuroda ,  Hiroshi Okikawa ,  Kuniaki Kimoto ,  Hiroyuki Akutsu ,  Yukio Ito ,  Iku Higashidani

发明人： Hajime Nishi ,  Ken Takahashi ,  Hiromitsu Kuroda ,  Hiroshi Okikawa ,  Kuniaki Kimoto ,  Hiroyuki Akutsu ,  Yukio Ito ,  Iku Higashidani

IPC分类号： H05K1/09 ,  B21B45/00

CPC分类号： H01L31/0508 ,  H01L2924/0002 ,  Y02E10/50 ,  H01L2924/00

摘要： A solar cell lead includes a strip plate conductive material that a surface thereof is coated with solder plating. The coated solder plating includes a concavo-convex portion on a surface thereof and a 0.2% proof stress of not more than 90 MPa by a tensile test. The coated solder plating includes a hot-dip solder plating layer formed by supplying a molten solder on the surface of the strip plate conductive material. A plating temperature is set to be not higher than a liquidus-line temperature of the used solder plus 120° C., and an oxide film on a surface of the hot-dip solder plating layer is set to be not more than 7 nm in thickness.

摘要翻译： 太阳能电池引线包括其表面涂覆有焊料电镀的带状导电材料。 涂覆的焊料镀层在其表面上包括凹凸部分，通过拉伸试验包括不大于90MPa的0.2％屈服应力。 涂覆的焊料镀层包括通过在带状导电材料的表面上提供熔融焊料而形成的热浸焊料镀层。 将电镀温度设定为不高于所使用焊料的液相线温度加上120℃，并且将热浸焊料镀层的表面上的氧化膜设定为不大于7nm 厚度。