公开(公告)号：US08552444B2

公开(公告)日：2013-10-08

申请号：US12743330

申请日：2008-11-13

申请人： Yoshiyuki Ide ,  Hidenori Kamei ,  Isamu Yonekura ,  Kunihiko Obara ,  Koichi Nakahara ,  Kouji Nakatsu ,  Yoshirou Tooya ,  Toshirou Kitazono ,  Toshihide Maeda ,  Kenichi Koya ,  Takahiro Shirahata

发明人： Yoshiyuki Ide ,  Hidenori Kamei ,  Isamu Yonekura ,  Kunihiko Obara ,  Koichi Nakahara ,  Kouji Nakatsu ,  Yoshirou Tooya ,  Toshirou Kitazono ,  Toshihide Maeda ,  Kenichi Koya ,  Takahiro Shirahata

IPC分类号： H01L29/72

CPC分类号： H01L33/60 ,  H01L24/97 ,  H01L33/54 ,  H01L2224/04042 ,  H01L2224/05111 ,  H01L2224/05155 ,  H01L2224/05169 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05666 ,  H01L2224/13 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12035 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Light from a semiconductor light-emitting element travels in all directions. Thus, light that travels in the directions other than a lighting direction cannot be used effectively. Means for forming a semiconductor light-emitting element having tilted side surfaces, and forming a reflective layer on the tilted side surfaces has been proposed. However, since the tilted surfaces are formed by an etching method or the like, it takes a long time to form the tilted surfaces, and it is difficult to control the tilted surfaces. As a solution to these problems, semiconductor light-emitting elements are placed on a submount substrate and sealed with a sealant, and then a groove is formed in a portion between adjoining ones of the semiconductor light-emitting elements. The grooves formed are filled with a reflective material, and a light-emitting surface is polished. Then, the submount substrate is divided into individual semiconductor light-emitting devices. Thus, a semiconductor light-emitting device having a reflective layer on its side surfaces can be obtained.

摘要翻译： 来自半导体发光元件的光在各个方向上行进。 因此，不能有效地利用沿着照明方向以外的方向行进的光。 已经提出了用于形成具有倾斜侧表面的半导体发光元件以及在倾斜侧表面上形成反射层的装置。 然而，由于通过蚀刻方法等形成倾斜表面，所以形成倾斜表面需要很长时间，并且难以控制倾斜表面。 作为这些问题的解决方案，将半导体发光元件放置在副安装座基板上并用密封剂密封，然后在相邻的半导体发光元件之间的部分中形成凹槽。 所形成的槽被反射材料填充，并且发光表面被抛光。 然后，将副安装座基板分割为各个半导体发光元件。 因此，可以获得在其侧表面具有反射层的半导体发光器件。

公开(公告)号：US20100258830A1

公开(公告)日：2010-10-14

申请号：US12743330

申请日：2008-11-13

申请人： Yoshiyuki Ide ,  Hidenori Kamei ,  Isamu Yonekura ,  Kunihiko Obara ,  Koichi Nakahara ,  Kouji Nakatsu ,  Yoshirou Tooya ,  Toshirou Kitazono ,  Toshihide Maeda ,  Kenichi Koya ,  Takahiro Shirahata

发明人： Yoshiyuki Ide ,  Hidenori Kamei ,  Isamu Yonekura ,  Kunihiko Obara ,  Koichi Nakahara ,  Kouji Nakatsu ,  Yoshirou Tooya ,  Toshirou Kitazono ,  Toshihide Maeda ,  Kenichi Koya ,  Takahiro Shirahata

IPC分类号： H01L33/52 ,  H01L33/60 ,  H01L21/78

CPC分类号： H01L33/60 ,  H01L24/97 ,  H01L33/54 ,  H01L2224/04042 ,  H01L2224/05111 ,  H01L2224/05155 ,  H01L2224/05169 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05666 ,  H01L2224/13 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12035 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Light from a semiconductor light-emitting element travels in all directions. Thus, light that travels in the directions other than a lighting direction cannot be used effectively. Means for forming a semiconductor light-emitting element having tilted side surfaces, and forming a reflective layer on the tilted side surfaces has been proposed. However, since the tilted surfaces are formed by an etching method or the like, it takes a long time to form the tilted surfaces, and it is difficult to control the tilted surfaces. As a solution to these problems, semiconductor light-emitting elements are placed on a submount substrate and sealed with a sealant, and then a groove is formed in a portion between adjoining ones of the semiconductor light-emitting elements. The grooves formed are filled with a reflective material, and a light-emitting surface is polished. Then, the submount substrate is divided into individual semiconductor light-emitting devices. Thus, a semiconductor light-emitting device having a reflective layer on its side surfaces can be obtained.

摘要翻译： 来自半导体发光元件的光在各个方向上行进。 因此，不能有效地利用沿着照明方向以外的方向行进的光。 已经提出了用于形成具有倾斜侧表面的半导体发光元件以及在倾斜侧表面上形成反射层的装置。 然而，由于通过蚀刻方法等形成倾斜表面，所以形成倾斜表面需要很长时间，并且难以控制倾斜表面。 作为这些问题的解决方案，将半导体发光元件放置在副安装座基板上并用密封剂密封，然后在相邻的半导体发光元件之间的部分中形成凹槽。 所形成的槽被反射材料填充，并且发光表面被抛光。 然后，将副安装座基板分割为各个半导体发光元件。 因此，可以获得在其侧表面具有反射层的半导体发光器件。