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公开(公告)号：US20120313293A1
公开(公告)日：2012-12-13
申请号：US13490547
申请日：2012-06-07
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00
摘要： A method of performing an imprint process on each of a plurality of shot regions of a substrate, wherein each shot region includes at least one of at least one valid chip area and at least one invalid chip area, the invalid chip area including an inhibited area in which resin coating is inhibited, the imprint process for a shot region including both the invalid chip area and the valid chip area includes coating the valid chip area of the shot region with the resin, bringing a pattern surface of a mold into contact with the resin, and curing the resin, and in the step of coating, at least the inhibited area of the invalid chip area is not coated with the resin.
摘要翻译： 一种对基板的多个拍摄区域中的每一个进行压印处理的方法，其中每个拍摄区域包括至少一个有效芯片区域和至少一个无效芯片区域中的至少一个，所述无效芯片区域包括禁止区域 在其中树脂涂层被抑制的情况下，包括无效芯片面积和有效芯片面积的射击区域的压印处理包括用树脂涂覆射出区域的有效芯片面积，使得模具的图案表面与 树脂，并固化树脂，并且在涂布步骤中，至少无效芯片区域的禁止区域未被树脂涂覆。
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公开(公告)号：US09880463B2
公开(公告)日：2018-01-30
申请号：US13490547
申请日：2012-06-07
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00
摘要： A method of performing an imprint process on each of a plurality of shot regions of a substrate, wherein each shot region includes at least one of at least one valid chip area and at least one invalid chip area, the invalid chip area including an inhibited area in which resin coating is inhibited, the imprint process for a shot region including both the invalid chip area and the valid chip area includes coating the valid chip area of the shot region with the resin, bringing a pattern surface of a mold into contact with the resin, and curing the resin, and in the step of coating, at least the inhibited area of the invalid chip area is not coated with the resin.
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公开(公告)号：US20120228789A1
公开(公告)日：2012-09-13
申请号：US13413913
申请日：2012-03-07
申请人： Kohei WAKABAYASHI
发明人： Kohei WAKABAYASHI
CPC分类号： B29C59/02 , B29C37/0096 , B29C59/026 , B29C2037/90 , B29C2059/023 , Y10S977/887
摘要： An imprint apparatus which brings a resin on a substrate into contact with a pattern surface of a mold and cures the resin, includes a substrate holder which holds the substrate, a mold holder which holds the mold with a mold holding surface, a driving mechanism which moves the substrate holder relative to the mold holder, and a controller which controls the driving mechanism such that the substrate holder moves relative to the mold holder while the substrate holder holds a cleaning member instead of the substrate, and the cleaning member is in contact with the mold holding surface, thereby cleaning the mold holding surface.
摘要翻译： 使树脂在基板上与模具的图案表面接触并固化树脂的压印装置包括保持基板的基板保持件，保持模具的模具保持器，模具保持表面，驱动机构， 使基板保持件相对于模具保持器移动;以及控制器，其控制驱动机构，使得基板保持件相对于模具保持器移动，同时基板保持件保持清洁构件而不是基板，并且清洁构件与 模具保持表面，从而清洁模具保持表面。
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公开(公告)号：US08992206B2
公开(公告)日：2015-03-31
申请号：US13413913
申请日：2012-03-07
申请人： Kohei Wakabayashi
发明人： Kohei Wakabayashi
CPC分类号： B29C59/02 , B29C37/0096 , B29C59/026 , B29C2037/90 , B29C2059/023 , Y10S977/887
摘要： An imprint apparatus which brings a resin on a substrate into contact with a pattern surface of a mold and cures the resin, includes a substrate holder which holds the substrate, a mold holder which holds the mold with a mold holding surface, a driving mechanism which moves the substrate holder relative to the mold holder, and a controller which controls the driving mechanism such that the substrate holder moves relative to the mold holder while the substrate holder holds a cleaning member instead of the substrate, and the cleaning member is in contact with the mold holding surface, thereby cleaning the mold holding surface.
摘要翻译： 使树脂在基板上与模具的图案表面接触并固化树脂的压印装置包括保持基板的基板保持件，保持模具的模具保持器，模具保持表面，驱动机构， 使基板保持件相对于模具保持器移动;以及控制器，其控制驱动机构，使得基板保持件相对于模具保持器移动，同时基板保持件保持清洁构件而不是基板，并且清洁构件与 模具保持表面，从而清洁模具保持表面。
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