Photoresist material
    1.
    发明授权
    Photoresist material 失效
    光刻胶材料

    公开(公告)号:US4504631A

    公开(公告)日:1985-03-12

    申请号:US499486

    申请日:1983-05-31

    IPC分类号: C08F2/46 C08F8/24

    CPC分类号: C08F8/24

    摘要: The photoresist material comprises a polymer having chloromethyl groups introduced therein and containing 2-isopropenylnaphthalene as one component, an average substitution degree of the chloromethyl groups based on the polymer is within a range of 0.2 to 5.The photoresist material has a high glass transition point, a high sensitivity to radiation and an excellent dry etching resistance, whereby it is suitably used for the manufacture of a semiconductor element using radiation and provides a good resolution on etching.

    摘要翻译: 光致抗蚀剂材料包括其中引入了氯甲基并含有2-异丙烯基萘作为一种组分的聚合物,基于聚合物的氯甲基的平均取代度在0.2至5的范围内。光致抗蚀剂材料具有高玻璃化转变点 ,对辐射的高灵敏度和优异的耐干蚀刻性,由此适用于制造使用辐射的半导体元件,并且在蚀刻时提供良好的分辨率。