公开(公告)号：US20050000636A1

公开(公告)日：2005-01-06

申请号：US10839855

申请日：2004-05-06

申请人： Bruno Geiger ,  Stefan Furst ,  Daniel Kappes ,  Jurgen Hoppner

发明人： Bruno Geiger ,  Stefan Furst ,  Daniel Kappes ,  Jurgen Hoppner

IPC分类号： C09J5/00 ,  H01L21/68 ,  B32B31/00

CPC分类号： H01L21/6835 ,  C09J5/00 ,  C09J2205/302 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68363

摘要： The present invention relates to a method for temporarily fixing two planar workpieces, in particular a processed wafer and a carrier wafer. A thin layer is first applied to the sides of the two workpieces that have to be connected, and the coated sides of the workpieces are then connected by means of a bonding agent. Care should be taken that the thin layers can preferably be applied easily and removed without leaving any residues. The bonding agent, which actually causes the bond, needs only be selected with respect to its chemical resistance and its mechanical and adhesive properties.

摘要翻译： 本发明涉及一种临时固定两个平面工件，特别是加工晶片和载体晶片的方法。 首先将薄层施加到必须连接的两个工件的侧面上，然后通过粘合剂将工件的涂覆侧面连接。 应该注意的是，薄层可以很容易地被应用并被去除而不留下任何残留物。 实际引起粘合的粘合剂仅需要根据其耐化学性及其机械和粘合性质来选择。