Method and apparatus for thermographically and quantitatively analyzing
a structure for disbonds and/or inclusions
    1.
    发明授权
    Method and apparatus for thermographically and quantitatively analyzing a structure for disbonds and/or inclusions 失效
    热分析和定量分析脱粘和/或夹杂物结构的方法和装置

    公开(公告)号:US5562345A

    公开(公告)日:1996-10-08

    申请号:US571688

    申请日:1995-12-13

    IPC分类号: G01N25/72

    CPC分类号: G01N25/72

    摘要: A heat source such as a magnetic induction/eddy current generator remotely heats a region of a surface of a test structure to a desired depth. For example, the frequency of the heating source can be varied to heat to the desired depth. A thermal sensor senses temperature changes in the heated region as a function of time. A computer compares these sensed temperature changes with calibration standards of a similar sample having known disbond and/or inclusion geography(ies) to analyze the test structure. A plurality of sensors can be arranged linearly to sense vector heat flow.

    摘要翻译: 诸如磁感应/涡流发生器的热源将测试结构的表面的区域远程加热到期望的深度。 例如,可以改变加热源的频率以加热到期望的深度。 热传感器根据时间来检测加热区域的温度变化。 计算机将这些感测的温度变化与具有已知的解离和/或包含地理学的相似样品的校准标准进行比较,以分析测试结构。 可以将多个传感器线性布置以感测矢量热流。