公开(公告)号：US06485595B1

公开(公告)日：2002-11-26

申请号：US09610739

申请日：2000-07-06

申请人： Donald M. Yenni, Jr. ,  Jose P. de Souza ,  Mark G. Baker

发明人： Donald M. Yenni, Jr. ,  Jose P. de Souza ,  Mark G. Baker

IPC分类号： B32B1508

CPC分类号： H05K9/0026 ,  H05K9/0028 ,  Y10T156/1002 ,  Y10T156/1043 ,  Y10T442/126 ,  Y10T442/131 ,  Y10T442/2475

摘要： An EMI shielding enclosure, for an electronic assembly, comprising a ground plane of a printed circuit connected to a shaped EMI shielding cover. The cover results from thermoforming a composite sheet of several layers, including a carrier for a fibrous metal mat that has fibers substantially surrounded by a fiber-coat. Connection of the cover to the ground plane, to form the EMI shielding enclosure, requires the fiber-coat to adhere to the printed circuit in the vicinity of the ground plane.

摘要翻译： 一种用于电子组件的EMI屏蔽外壳，包括连接到成形EMI屏蔽罩的印刷电路的接地平面。 该覆盖物是由热成型几层的复合片构成的，包括纤维状金属垫的载体，纤维状金属垫的纤维基本上被纤维包覆。 将盖连接到接地平面，以形成EMI屏蔽外壳，需要将纤维涂层粘附在接地平面附近的印刷电路上。

公开(公告)号：US6090728A

公开(公告)日：2000-07-18

申请号：US70994

申请日：1998-05-01

申请人： Donald M. Yenni, Jr. ,  Jose P. de Souza ,  Mark G. Baker

发明人： Donald M. Yenni, Jr. ,  Jose P. de Souza ,  Mark G. Baker

IPC分类号： H05K9/00 ,  B32B15/08 ,  B32B27/04 ,  B32B33/00

CPC分类号： H05K9/0026 ,  H05K9/0028 ,  Y10T156/1002 ,  Y10T156/1043 ,  Y10T442/126 ,  Y10T442/131 ,  Y10T442/2475

摘要： An EMI shielding enclosure, for an electronic assembly, comprising a ground plane of a printed circuit connected to a shaped EMI shielding cover. The cover results from thermoforming a composite sheet of several layers, including a carrier for a fibrous metal mat that has fibers substantially surrounded by a fiber-coat. Connection of the cover to the ground plane, to form the EMI shielding enclosure, requires the fiber-coat to adhere to the printed circuit in the vicinity of the ground plane.

公开(公告)号：US5834560A

公开(公告)日：1998-11-10

申请号：US639615

申请日：1996-04-29

申请人： Donald G. Baird ,  Christopher G. Robertson ,  Jose P. de Souza

发明人： Donald G. Baird ,  Christopher G. Robertson ,  Jose P. de Souza

IPC分类号： C08L67/02 ,  D01F6/46 ,  D01F6/90 ,  D01F6/92 ,  D01F6/96 ,  C08L23/12 ,  C08L77/00 ,  C08L81/04

CPC分类号： D01F6/96 ,  C08L67/02 ,  D01F6/46 ,  D01F6/90 ,  D01F6/92 ,  Y10T428/2927

摘要： The present invention is directed to in situ reinforced thermoplastic fibers having improved mechanical properties and a method of making same. These composites have improved tensile strength and tensile moduli that exceed that predicted by composite theory under the rule of mixtures. The in situ composites can be used in woven preforms.

摘要翻译： 本发明涉及具有改进的机械性能的原位增强热塑性纤维及其制备方法。 这些复合材料的拉伸强度和拉伸模量都提高超过混合物规则下复合理论所预测的。 原位复合材料可用于编织预制件。