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公开(公告)号:US07905273B2
公开(公告)日:2011-03-15
申请号:US11899217
申请日:2007-09-05
IPC分类号: B22C9/04
摘要: An unfired ceramic base core having a first coefficient of thermal expansion is provided. A core element having a second coefficient of thermal expansion is positioned in an opening formed in the unfired ceramic base core. The opening in the unfired ceramic base core is filled with a filler material having a third coefficient of thermal expansion. The third coefficient of thermal expansion is greater than the first coefficient of thermal expansion and less than the second coefficient of thermal expansion. The ceramic base core is fired without cracking the base core and without cracking the filler material. The ceramic base core contains silica and zircon and has a silica content of 70% or less and a zircon content of 30% or more. The core element may be formed of a ceramic material or a refractory metal.
摘要翻译: 提供具有第一热膨胀系数的未焙烧陶瓷基底芯。 具有第二热膨胀系数的芯元件位于未烧结的陶瓷基底芯中形成的开口中。 在未焙烧的陶瓷基底芯中的开口填充有具有第三热膨胀系数的填充材料。 第三热膨胀系数大于第一热膨胀系数,小于第二热膨胀系数。 烧制陶瓷基芯不会使基体芯破裂,也不会使填料破裂。 陶瓷基核含有二氧化硅和锆石,二氧化硅含量为70%以下,锆石含量为30%以上。 芯元件可以由陶瓷材料或难熔金属形成。
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公开(公告)号:US20090056902A1
公开(公告)日:2009-03-05
申请号:US11899217
申请日:2007-09-05
IPC分类号: B22C9/00
摘要: An unfired ceramic base core having a first coefficient of thermal expansion is provided. A core element having a second coefficient of thermal expansion is positioned in an opening formed in the unfired ceramic base core. The opening in the unfired ceramic base core is filled with a filler material having a third coefficient of thermal expansion. The third coefficient of thermal expansion is greater than the first coefficient of thermal expansion and less than the second coefficient of thermal expansion. The ceramic base core is fired without cracking the base core and without cracking the filler material. The ceramic base core contains silica and zircon and has a silica content of 70% or less and a zircon content of 30% or more. The core element may be formed of a ceramic material or a refractory metal.
摘要翻译: 提供具有第一热膨胀系数的未焙烧陶瓷基底芯。 具有第二热膨胀系数的芯元件位于未烧结的陶瓷基底芯中形成的开口中。 在未焙烧的陶瓷基底芯中的开口填充有具有第三热膨胀系数的填充材料。 第三热膨胀系数大于第一热膨胀系数,小于第二热膨胀系数。 烧制陶瓷基芯不会使基体芯破裂,也不会使填料破裂。 陶瓷基核包含二氧化硅和锆石,二氧化硅含量为70%以下,锆石含量为30%以上。 芯元件可以由陶瓷材料或难熔金属形成。
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