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    Electrical connector with ground plates
    2.
    发明授权
    Electrical connector with ground plates 有权
    带接地板的电气连接器

    公开(公告)号：US08734187B2

    公开(公告)日：2014-05-27

    申请号：US13166081

    申请日：2011-06-22

    Applicant: Jan De Geest ,  Stefaan Hendrik Jozef Sercu ,  Stephen B. Smith ,  Douglas M. Johnescu ,  Jonathan E. Buck

    Inventor： Jan De Geest ,  Stefaan Hendrik Jozef Sercu ,  Stephen B. Smith ,  Douglas M. Johnescu ,  Jonathan E. Buck

    IPC: H01R24/00

    CPC classification number: H01R13/6587 ,  H01R13/2457

    Abstract: An electrical connector and leadframe assemblies for use therein are provided. Each leadframe assembly can be constructed with at least one electric contact having a ground plate. A first type of leadframe assembly includes an uppermost electrical contact defining a ground plate. A second type of leadframe assembly includes a lowermost electrical contact defining a ground plate. The ground plates can reduce the level of crosstalk exhibited by the electrical connector.

    Abstract translation: 提供了一种用于其中的电连接器和引线框架组件。 每个引线框架组件可以构造成具有至少一个具有接地板的电触点。 引线框组件的第一种类型包括限定接地板的最上面的电触点。 第二类引线框架组件包括限定接地板的最下面的电触头。 接地板可以降低电连接器所呈现的串扰水平。

    Signal transmission for high speed interconnections
    3.
    发明授权
    Signal transmission for high speed interconnections 有权
    用于高速互连的信号传输

    公开(公告)号：US08361896B2

    公开(公告)日：2013-01-29

    申请号：US13166155

    申请日：2011-06-22

    Applicant: Jan De Geest

    Inventor： Jan De Geest

    IPC: H01R13/648

    CPC classification number: H05K1/0231 ,  H01R13/6477 ,  H01R13/6587 ,  H05K3/306 ,  H05K2201/09145 ,  H05K2201/10189 ,  H05K2201/10446

    Abstract: A connector assembly includes a substrate and a connector. The substrate includes a ground layer and a trace layer. The substrate defines a substrate edge, and the ground layer defines a ground edge. The connector is mounted on the substrate such that a portion of the connector overhangs the substrate edge of the substrate. The connector includes a first signal contact that defines a mating portion, a mounting portion, a first transition portion connected to the mating portion, and a second transition portion connected to the first transition portion and the mounting portion. The first transition portion of the signal contact at least partially crosses the ground edge such that a gap is defined between the ground edge and the first transition portion and a substantial portion of the second transition portion extends over the gap when the electrical connector is mounted on the substrate.

    Abstract translation: 连接器组件包括基板和连接器。 衬底包括接地层和迹线层。 衬底限定衬底边缘，并且接地层限定接地边缘。 连接器安装在基板上，使得连接器的一部分悬垂在基板的基板边缘上。 连接器包括限定配合部分的第一信号触点，安装部分，连接到配合部分的第一过渡部分和连接到第一过渡部分和安装部分的第二过渡部分。 信号触头的第一过渡部分至少部分地穿过接地边缘，使得在接地边缘和第一过渡部分之间限定间隙，并且当电连接器安装在第一过渡部分上时，第二过渡部分的大部分在间隙上延伸 底物。

    Broadside-coupled signal pair configurations for electrical connectors
    4.
    发明授权
    Broadside-coupled signal pair configurations for electrical connectors 有权
    用于电连接器的宽边耦合信号对配置

    公开(公告)号：US07713088B2

    公开(公告)日：2010-05-11

    申请号：US11866061

    申请日：2007-10-02

    Applicant: Stefaan Hendrik Jozef Sercu ,  Jan De Geest

    Inventor： Stefaan Hendrik Jozef Sercu ,  Jan De Geest

    IPC: H01R13/648

    CPC classification number: H01R13/6586 ,  H01R12/7082 ,  H01R13/6471 ,  H01R13/6477

    Abstract: An electrical connector having a first electrical contact and a second electrical contact adjacent to the first electrical contact. The first electrical contact may define a first broadside and a second broadside opposite the first broadside. The second electrical contact may define a third broadside and a fourth broadside opposite the third broadside. The electrical connector may further include a non-air dielectric and a commoned ground plate. The non-air dielectric may be disposed between the second broadside of the first electrical contact and the fourth broadside of the second electrical contact. The commoned ground plate and the first electrical contact may be adjacent to one another and may be separated by an air dielectric.

    Abstract translation: 一种电连接器，具有与第一电触点相邻的第一电接触和第二电接触。 第一电触头可以限定与第一宽边相对的第一宽边和第二宽边。 第二电触点可以限定与第三宽边相对的第三宽边和第四宽边。 电连接器还可以包括非空气电介质和公共接地板。 非空气电介质可以设置在第一电触点的第二宽侧和第二电接触的第四宽边之间。 公共接地板和第一电接触件可以彼此相邻并且可以由空气电介质分离。

    Structured circuit board and method
    6.
    发明授权
    Structured circuit board and method 有权
    结构电路板和方法

    公开(公告)号：US09084353B2

    公开(公告)日：2015-07-14

    申请号：US13807325

    申请日：2011-06-28

    Applicant: Jan De Geest ,  Stefaan Hendrik Jozef Sercu

    Inventor： Jan De Geest ,  Stefaan Hendrik Jozef Sercu

    IPC: H05K1/02 ,  H05K1/11

    CPC classification number: H05K1/0251 ,  H05K1/024 ,  H05K1/0245 ,  H05K1/115 ,  H05K3/429 ,  H05K2201/0187 ,  H05K2201/09063 ,  H05K2201/09618 ,  H05K2201/09636 ,  H05K2201/09718 ,  H05K2201/10189

    Abstract: A circuit board (1) is provided comprising a plurality of insulating layers, at least one ground layer and at least one layer comprising signal traces. The circuit board comprises at least a first conductive via (17) and a second conductive via (17). The first conductive via and the second conductive via penetrate through at least a first insulating layer of the plurality of insulating layers and are connected to a signal trace. The first conductive via and the second conductive via are arranged adjacent each other. At least in the first insulating layer the first conductive via and the second conductive via are separated in a first direction of separation (R) by a first adjustment portion comprising a dielectric material property different from the first insulating layer.

    Abstract translation: 提供电路板（1），其包括多个绝缘层，至少一个接地层和至少一个包含信号迹线的层。 电路板包括至少第一导电通孔（17）和第二导电通孔（17）。 第一导电通孔和第二导电通孔穿透多个绝缘层中的至少第一绝缘层，并连接到信号迹线。 第一导电通孔和第二导电通孔彼此相邻布置。 至少在第一绝缘层中，通过包括不同于第一绝缘层的介电材料性质的第一调节部分，第一导电通孔和第二导电通孔在第一分离方向（R）分离。

    STRUCTURED CIRCUIT BOARD AND METHOD
    9.
    发明申请
    STRUCTURED CIRCUIT BOARD AND METHOD 有权
    结构电路板和方法

    公开(公告)号：US20130199834A1

    公开(公告)日：2013-08-08

    申请号：US13807325

    申请日：2011-06-28

    Applicant: Jan De Geest ,  Stefaan Hendrik Jozef Sercu

    Inventor： Jan De Geest ,  Stefaan Hendrik Jozef Sercu

    IPC: H05K1/11

    CPC classification number: H05K1/0251 ,  H05K1/024 ,  H05K1/0245 ,  H05K1/115 ,  H05K3/429 ,  H05K2201/0187 ,  H05K2201/09063 ,  H05K2201/09618 ,  H05K2201/09636 ,  H05K2201/09718 ,  H05K2201/10189

    Abstract: A circuit board (1) is provided comprising a plurality of insulating layers, at least one ground layer and at least one layer comprising signal traces. The circuit board comprises at least a first conductive via (17) and a second conductive via (17). The first conductive via and the second conductive via penetrate through at least a first insulating layer of the plurality of insulating layers and are connected to a signal trace. The first conductive via and the second conductive via are arranged adjacent each other. At least in the first insulating layer the first conductive via and the second conductive via are separated in a first direction of separation (R) by a first adjustment portion comprising a dielectric material property different from the first insulating layer.

    Abstract translation: 提供电路板（1），其包括多个绝缘层，至少一个接地层和至少一个包含信号迹线的层。 电路板包括至少第一导电通孔（17）和第二导电通孔（17）。 第一导电通孔和第二导电通孔穿透多个绝缘层中的至少第一绝缘层，并连接到信号迹线。 第一导电通孔和第二导电通孔彼此相邻布置。 至少在第一绝缘层中，通过包括不同于第一绝缘层的介电材料性质的第一调节部分，第一导电通孔和第二导电通孔在第一分离方向（R）分离。

    ELECTRICAL CONNECTOR WITH GROUND PLATES
    10.
    发明申请
    ELECTRICAL CONNECTOR WITH GROUND PLATES 有权
    带接地板的电气连接器

    公开(公告)号：US20110318945A1

    公开(公告)日：2011-12-29

    申请号：US13166081

    申请日：2011-06-22

    Applicant: Jan De Geest ,  Stefaan Hendrik Jozef Sercu ,  Stephen B. Smith ,  Douglas M. Johnescu ,  Jonathan E. Buck

    Inventor： Jan De Geest ,  Stefaan Hendrik Jozef Sercu ,  Stephen B. Smith ,  Douglas M. Johnescu ,  Jonathan E. Buck

    IPC: H01R13/648

    CPC classification number: H01R13/6587 ,  H01R13/2457

    Abstract: An electrical connector and leadframe assemblies for use therein are provided. Each leadframe assembly can be constructed with at least one electric contact having a ground plate. A first type of leadframe assembly includes an uppermost electrical contact defining a ground plate. A second type of leadframe assembly includes a lowermost electrical contact defining a ground plate. The ground plates can reduce the level of crosstalk exhibited by the electrical connector.

    Abstract translation: 提供了一种用于其中的电连接器和引线框架组件。 每个引线框架组件可以构造成具有至少一个具有接地板的电触点。 引线框组件的第一种类型包括限定接地板的最上面的电触点。 第二类引线框架组件包括限定接地板的最下面的电触头。 接地板可以降低电连接器所呈现的串扰水平。

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