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公开(公告)号：US07160413B2
公开(公告)日：2007-01-09
申请号：US10754381
申请日：2004-01-09
IPC分类号： B24D11/00
CPC分类号： B24B37/22 , B24D18/00 , B32B37/0007 , B32B37/12 , B32B37/26
摘要： A device and method for laminating CMP pads includes supporting the CMP pad with a board having material compositions similar to the CMP pad. By thus supporting the CMP pad during lamination, there is less likelihood of damage to the CMP pad and better adhesion from lamination. In particular, the CMP pad materials are laminated while in contact with a first board that may have a recess to accept the CMP pad. The pad has dimensions that are equal to or greater than the pad material. In an alternative embodiment, a board is provided on the opposite side of the CMP pad for lamination.
摘要翻译： 用于层压CMP垫的装置和方法包括用具有类似于CMP垫的材料组成的板支撑CMP垫。 通过在层压期间支撑CMP焊盘，不太可能损坏CMP焊盘并且具有更好的层压附着力。 特别地，CMP垫材料与第一板接触，该第一板可以具有凹部以接受CMP垫。 垫具有等于或大于垫材料的尺寸。 在替代实施例中，在CMP垫的相对侧上设置有用于层压的板。
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公开(公告)号：US20050150594A1
公开(公告)日：2005-07-14
申请号：US10754381
申请日：2004-01-09
CPC分类号： B24B37/22 , B24D18/00 , B32B37/0007 , B32B37/12 , B32B37/26
摘要： A device and method for laminating CMP pads includes supporting the CMP pad with a board having material compositions similar to the CMP pad. By thus supporting the CMP pad during lamination, there is less likelihood of damage to the CMP pad and better adhesion from lamination. In particular, the CMP pad materials are laminated while in contact with a first board that may have a recess to accept the CMP pad. The pad has dimensions that are equal to or greater than the pad material. In an alternative embodiment, a board is provided on the opposite side of the CMP pad for lamination.
摘要翻译： 用于层压CMP垫的装置和方法包括用具有类似于CMP垫的材料组成的板支撑CMP垫。 通过在层压期间支撑CMP焊盘，不太可能损坏CMP焊盘并且具有更好的层压附着力。 特别地，CMP垫材料与第一板接触，该第一板可以具有凹部以接受CMP垫。 垫具有等于或大于垫材料的尺寸。 在替代实施例中，在CMP垫的相对侧上设置有用于层压的板。
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公开(公告)号：US20050201840A1
公开(公告)日：2005-09-15
申请号：US10798197
申请日：2004-03-10
CPC分类号： B23B27/06 , Y10T407/23 , Y10T409/502624 , Y10T409/50328
摘要： A cutting tool for simultaneously carrying out a facing operation and a grooving operation on a target surface has a facing part and a grooving part that protrudes from and may be integrally formed with the facing part. The facing part has a facing surface for carrying out the facing operation and the grooving part has a grooving surface and is for cutting a groove of a specified depth and width on the target surface simultaneously as the cutting tool is moved in a specified forward direction parallel to the target surface. The dimensions of the facing and grooving parts, the roughness of their surfaces, the angles of their cutting edges and the sloping angles of the facing and grooving surfaces with respect to the forward direction are each required to be within a specified range. Where the grooving part protrudes from the facing part, the corners at which the facing surface joins the side surfaces of the grooving part are formed such that each corner has a beveled surface portion.
摘要翻译： 用于在目标表面上同时进行面对操作和切槽操作的切削工具具有面向部分和从相对部分突出并与之形成一体的切槽部分。 面对部分具有用于执行面对操作的面对表面，并且切槽部分具有切槽表面，并且当切削工具沿着指定的正向平行移动时同时在目标表面上切割指定深度和宽度的凹槽 到目标表面。 面向和切槽部分的尺寸，其表面的粗糙度，其切削刃的角度以及相对于向前方向的面对和切槽表面的倾斜角度均需要在特定范围内。 在切槽部从面对部突出的情况下，形成面对面与切槽部的侧面接合的角部，使得各角部具有倾斜面部。
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公开(公告)号：US20070023560A1
公开(公告)日：2007-02-01
申请号：US11190669
申请日：2005-07-26
申请人： Ichiro Kodaka , Vuong Bang , Alvin Timbang
发明人： Ichiro Kodaka , Vuong Bang , Alvin Timbang
CPC分类号： B24D11/008 , B08B1/008 , B26D1/245 , B65H18/106 , B65H35/02 , B65H2301/5115
摘要： Buff tapes for smoothing the surface of a magnetic disk substrate are produced by using a slitting device to receive a mother tape having a backing film with a polishing layer formed on its surface and slitting it longitudinally. A guide roller is provided for guiding these buff tapes from the slitting device to take-up rollers for individually winding up the buff tapes and a compression roller serves to compress the buff tapes onto this guide roller with a wiping tape in between to contact the buff tapes from the side of the backing film. The wiping tape is advanced while contacting the buff tapes at a specified depending on the feed speed of the mother tape and the compressive pressure between the guide roller and the compression roller such that 50% to 80% of loose particles of 0.3 μm-5 μm in size can be removed.
摘要翻译： 通过使用切割装置来接收具有背衬膜的母带，其表面上形成有抛光层并纵向切割，来制造用于平滑磁盘基板表面的防粘带。 引导辊用于将这些缓冲带从分切装置引导到用于单独卷绕缓冲带的卷取辊，并且压缩辊用于将擦拭带压缩到该导辊上，其间具有擦拭带以接触缓冲 胶带从背胶膜的一侧。 根据母带的进给速度和导向辊与压缩辊之间的压缩压力，使擦拭带前进，同时接触缓冲带，使得50％至80％的0.3mum-5mum的松散颗粒 大小可以去掉。
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公开(公告)号：US07044697B2
公开(公告)日：2006-05-16
申请号：US10798197
申请日：2004-03-10
IPC分类号： B23D13/00
CPC分类号： B23B27/06 , Y10T407/23 , Y10T409/502624 , Y10T409/50328
摘要： A cutting tool for simultaneously carrying out a facing operation and a grooving operation on a target surface has a facing part and a grooving part that protrudes from and may be integrally formed with the facing part. The facing part has a facing surface for carrying out the facing operation and the grooving part has a grooving surface and is for cutting a groove of a specified depth and width on the target surface simultaneously as the cutting tool is moved in a specified forward direction parallel to the target surface. The dimensions of the facing and grooving parts, the roughness of their surfaces, the angles of their cutting edges and the sloping angles of the facing and grooving surfaces with respect to the forward direction are each required to be within a specified range. Where the grooving part protrudes from the facing part, the corners at which the facing surface joins the side surfaces of the grooving part are formed such that each corner has a beveled surface portion.
摘要翻译： 用于在目标表面上同时进行面对操作和切槽操作的切削工具具有面向部分和从相对部分突出并与之形成一体的切槽部分。 面对部分具有用于执行面对操作的面对表面，并且切槽部分具有切槽表面，并且当切削工具沿着指定的正向平行移动时同时在目标表面上切割指定深度和宽度的凹槽 到目标表面。 面向和切槽部分的尺寸，其表面的粗糙度，其切削刃的角度以及相对于向前方向的面对和切槽表面的倾斜角度均需要在特定范围内。 在切槽部从面对部突出的情况下，形成面对面与切槽部的侧面接合的角部，使得各角部具有倾斜面部。
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6.发明授权
公开(公告)号：US5346654A
公开(公告)日：1994-09-13
申请号：US923033
申请日：1992-07-31
申请人： Ichiro Kodaka , Shoji Ishida , Charles Plumer
发明人： Ichiro Kodaka , Shoji Ishida , Charles Plumer
CPC分类号： B29C33/3857 , B29C45/372 , G11B7/24 , G11B7/26 , B29L2017/005
摘要： A new compact disk ("CD") is formed providing a bright, metallic presentation of indicia such as trademarks, promotion and advertising copy and other alphanumeric information around the circumference of the disk with recorded digital data in the disk's central portion. Such a CD may be a 120 mm CD including a central portion recorded in the 80 mm format of a single CD, with the desired indicia formed by a bright metal indicia-bearing substrate in the 20 mm, radially-extending, circumferential portion of the CD that surrounds the recorded digital data.Such CD's are manufactured by recording the digital data in the central 80 mm of a 120 mm master, leaving the remaining unrecorded circumferential portion of the master with a smooth surface and applying the desired indicia onto the unrecorded outer peripheral portion of a disk used to form production stampers.
摘要翻译： 形成了一个新的光盘（“CD”），在盘的中心部分具有记录的数字数据，在光盘周围提供明亮的金属显示标记，例如商标，促销和广告复制以及其他字母数字信息。 这样的CD可以是120mm CD，其包括以单一CD的80mm格式记录的中心部分，其中所需标记由位于20mm的径向延伸的圆周部分中的明亮的带有金属标记的衬底形成 围绕记录的数字数据的CD。 这样的CD是通过将数字数据记录在120mm主机的中心80mm中制造的，留下主机的剩余的未记录的圆周部分具有光滑的表面，并将所需的标记应用于用于形成的盘的未记录的外周部分 生产压模。
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公开(公告)号：US07238097B2
公开(公告)日：2007-07-03
申请号：US11010199
申请日：2004-12-10
申请人： Hisatomo Ohno , Toshihiro Izumi , Mitsuru Saito , Takuya Nagamine , Claughton Miller , Ichiro Kodaka
发明人： Hisatomo Ohno , Toshihiro Izumi , Mitsuru Saito , Takuya Nagamine , Claughton Miller , Ichiro Kodaka
IPC分类号： B24D11/00
CPC分类号： B24B37/205
摘要： A transparent pad having a polishing surface with an average surface roughness of 5 μm or less is used as a polishing pad. An indentation is formed on the back surface of the transparent pad such that its rate of light transmission is locally changed. The transparent pad has a rate of light transmission equal to or greater than 10% or preferably 30% for light of at least one wavelength in the range of 350 nm–900 nm.
摘要翻译： 使用具有平均表面粗糙度为5μm以下的研磨面的透明垫作为研磨垫。 在透明垫的背面上形成凹陷，使得其透光率局部地变化。 对于在350nm-900nm范围内的至少一个波长的光，透明衬垫具有等于或大于10％或优选30％的透光率。
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公开(公告)号：US20050142996A1
公开(公告)日：2005-06-30
申请号：US11010199
申请日：2004-12-10
申请人： Hisatomo Ohno , Toshihiro Izumi , Mitsuru Saito , Takuya Nagamine , Claughton Miller , Ichiro Kodaka
发明人： Hisatomo Ohno , Toshihiro Izumi , Mitsuru Saito , Takuya Nagamine , Claughton Miller , Ichiro Kodaka
IPC分类号： B24B37/00 , B24B37/04 , B24D13/14 , H01L21/304 , B24B49/00
CPC分类号： B24B37/205
摘要： A transparent pad having a polishing surface with an average surface roughness of 5 μm or less is used as a polishing pad. An indentation is formed on the back surface of the transparent pad such that its rate of light transmission is locally changed. The transparent pad has a rate of light transmission equal to or greater than 10% or preferably 30% for light of at least one wavelength in the range of 350 nm-900 nm.
摘要翻译： 使用具有平均表面粗糙度为5μm以下的研磨面的透明垫作为研磨垫。 在透明垫的背面上形成凹陷，使得其透光率局部地变化。 对于在350nm-900nm范围内的至少一个波长的光，透明衬垫具有等于或大于10％或优选30％的透光率。
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