公开(公告)号：US10662102B2

公开(公告)日：2020-05-26

申请号：US16158703

申请日：2018-10-12

Applicant: Hyung Rak Lee

Inventor： Hyung Rak Lee

IPC: C02F11/12 ,  F26B25/04 ,  C02F11/13 ,  C02F11/125 ,  F26B25/02 ,  F26B3/22 ,  F26B17/20 ,  B02C19/22 ,  B01F7/08 ,  F26B3/24

Abstract: The inventive concept relates to a sludge drying apparatus, and more particularly to a sludge drying apparatus that may improve an efficiency of drying sludge that is sewage deposit residues and simplify a drying process.

公开(公告)号：US20190039933A1

公开(公告)日：2019-02-07

申请号：US16158703

申请日：2018-10-12

Applicant: Hyung Rak LEE

Inventor： Hyung Rak LEE

IPC: C02F11/12 ,  B01F7/08 ,  B02C19/22 ,  F26B25/04 ,  F26B3/24

CPC classification number: C02F11/12 ,  B01F7/086 ,  B02C19/22 ,  B02C2201/063 ,  C02F11/125 ,  C02F11/13 ,  F26B3/22 ,  F26B3/24 ,  F26B17/205 ,  F26B25/02 ,  F26B25/04 ,  F26B2200/18

Abstract: The inventive concept relates to a sludge drying apparatus, and more particularly to a sludge drying apparatus that may improve an efficiency of drying sludge that is sewage deposit residues and simplify a drying process.

公开(公告)号：US08915770B2

公开(公告)日：2014-12-23

申请号：US13004873

申请日：2011-01-11

Applicant: Hyung-Rak Lee

Inventor： Hyung-Rak Lee

IPC: B24B7/00 ,  B24B37/08 ,  B24B37/11 ,  B24D13/12

CPC classification number: B24B37/08 ,  B24B37/11 ,  B24D13/12

Abstract: A wafer polishing apparatus is provided. The wafer polishing apparatus includes a first polishing roller disposed on a wafer, the first polishing roller extending in a direction in which the wafer extends and a second polishing roller disposed under the wafer, the second polishing roller extending in the direction in which the wafer extends. The wafer polishing apparatus uses the roller to polish the wafer. Thus, the wafer polishing apparatus may easily polish a wafer having a large area.

Abstract translation: 提供了一种晶片抛光装置。 晶片抛光装置包括设置在晶片上的第一抛光辊，第一抛光辊沿晶片延伸的方向延伸，第二抛光辊设置在晶片下方，第二抛光辊沿晶片延伸的方向延伸 。 晶片抛光装置使用辊来抛光晶片。 因此，晶片抛光装置可以容易地抛光具有大面积的晶片。

公开(公告)号：US20110171886A1

公开(公告)日：2011-07-14

申请号：US13004873

申请日：2011-01-11

Applicant: Hyung-Rak Lee

Inventor： Hyung-Rak Lee

IPC: B24B7/04 ,  B24B41/06

CPC classification number: B24B37/08 ,  B24B37/11 ,  B24D13/12

Abstract: A wafer polishing apparatus is provided. The wafer polishing apparatus includes a first polishing roller disposed on a wafer, the first polishing roller extending in a direction in which the wafer extends and a second polishing roller disposed under the wafer, the second polishing roller extending in the direction in which the wafer extends. The wafer polishing apparatus uses the roller to polish the wafer. Thus, the wafer polishing apparatus may easily polish a wafer having a large area.

Abstract translation: 提供了一种晶片抛光装置。 晶片抛光装置包括设置在晶片上的第一抛光辊，第一抛光辊沿晶片延伸的方向延伸，第二抛光辊设置在晶片下方，第二抛光辊沿晶片延伸的方向延伸 。 晶片抛光装置使用辊来抛光晶片。 因此，晶片抛光装置可以容易地抛光具有大面积的晶片。