BACKLIGHT MODULE
    1.
    发明申请
    BACKLIGHT MODULE 有权
    背光模组

    公开(公告)号:US20110063875A1

    公开(公告)日:2011-03-17

    申请号:US12881189

    申请日:2010-09-14

    IPC分类号: F21V8/00 F21V29/00

    摘要: A backlight module includes at least one light emitting device capable of emitting a light beam, a light guide plate, and a thermal insulation light guide element. The light guide plate has two surfaces opposite to each other and a side surface connecting the two surfaces. The light emitting device is disposed beside the side surface. The light beam enters the light guide plate through the side surface. The thermal insulation light guide element has a light incident surface and a light emitting surface. The light incident surface having at least one first recess is located in a transmission path of the light beam and between the light emitting device and the side surface. The light emitting surface is disposed between the light incident surface and the side surface. The glass transition temperature of the thermal insulation light guide element is higher than that of the light guide plate.

    摘要翻译: 背光模块包括能够发射光束的至少一个发光器件,导光板和保温导光元件。 导光板具有彼此相对的两个表面和连接两个表面的侧表面。 发光装置设置在侧面旁边。 光束通过侧面进入导光板。 保温导光元件具有光入射面和发光面。 具有至少一个第一凹部的光入射表面位于光束的传输路径中,并位于发光器件和侧表面之间。 发光面配置在光入射面和侧面之间。 绝热导光元件的玻璃化转变温度高于导光板的玻璃化转变温度。

    Backlight module
    2.
    发明授权
    Backlight module 有权
    背光模组

    公开(公告)号:US08449163B2

    公开(公告)日:2013-05-28

    申请号:US12881189

    申请日:2010-09-14

    IPC分类号: F21V7/04

    摘要: A backlight module includes at least one light emitting device capable of emitting a light beam, a light guide plate, and a thermal insulation light guide element. The light guide plate has two surfaces opposite to each other and a side surface connecting the two surfaces. The light emitting device is disposed beside the side surface. The light beam enters the light guide plate through the side surface. The thermal insulation light guide element has a light incident surface and a light emitting surface. The light incident surface having at least one first recess is located in a transmission path of the light beam and between the light emitting device and the side surface. The light emitting surface is disposed between the light incident surface and the side surface. The glass transition temperature of the thermal insulation light guide element is higher than that of the light guide plate.

    摘要翻译: 背光模块包括能够发射光束的至少一个发光器件,导光板和保温导光元件。 导光板具有彼此相对的两个表面和连接两个表面的侧表面。 发光装置设置在侧面旁边。 光束通过侧面进入导光板。 保温导光元件具有光入射面和发光面。 具有至少一个第一凹部的光入射表面位于光束的传输路径中,并位于发光器件和侧表面之间。 发光面配置在光入射面与侧面之间。 绝热导光元件的玻璃化转变温度高于导光板的玻璃化转变温度。

    Backlight module with heat dissipation structure
    3.
    发明授权
    Backlight module with heat dissipation structure 失效
    具有散热结构的背光模组

    公开(公告)号:US08708540B2

    公开(公告)日:2014-04-29

    申请号:US13040271

    申请日:2011-03-04

    IPC分类号: F21V7/22 F21V7/00 G02F1/1335

    摘要: A backlight module includes a back plate, a light guide plate, a heat insulation layer, a heat dissipation member, and a light source device. The back plate has a first surface, a second surface opposite to the first surface, and an opening passing through the back plate. The light guide plate is disposed on the first surface, the heat insulation layer is disposed on the second surface, and the heat dissipation member is disposed on the heat insulation layer. The light source device is connected to the heat dissipation member and protrudes from the first surface to face the light guide plate through the opening.

    摘要翻译: 背光模块包括背板,导光板,隔热层,散热构件和光源装置。 背板具有第一表面,与第一表面相对的第二表面和穿过背板的开口。 导光板设置在第一表面上,绝热层设置在第二表面上,散热构件设置在绝热层上。 光源装置连接到散热构件,并且从第一表面突出并通过开口面对导光板。

    BACKLIGHT MODULE
    4.
    发明申请
    BACKLIGHT MODULE 失效
    背光模组

    公开(公告)号:US20110286235A1

    公开(公告)日:2011-11-24

    申请号:US13040271

    申请日:2011-03-04

    IPC分类号: F21V7/22

    摘要: A backlight module includes a back plate, a light guide plate, a heat insulation layer, a heat dissipation member, and a light source device. The back plate has a first surface, a second surface opposite to the first surface, and an opening passing through the back plate. The light guide plate is disposed on the first surface, the heat insulation layer is disposed on the second surface, and the heat dissipation member is disposed on the heat insulation layer. The light source device is connected to the heat dissipation member and protrudes from the first surface to face the light guide plate through the opening.

    摘要翻译: 背光模块包括背板,导光板,隔热层,散热构件和光源装置。 背板具有第一表面,与第一表面相对的第二表面和穿过背板的开口。 导光板设置在第一表面上,绝热层设置在第二表面上,散热构件设置在绝热层上。 光源装置连接到散热构件,并且从第一表面突出并通过开口面对导光板。