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公开(公告)号：US07355835B2
公开(公告)日：2008-04-08
申请号：US11437488
申请日：2006-05-20
IPC分类号： H01G4/30
摘要： A capacitor has stacking capacitor elements, each of which contains a conductor plate, a first band being an insulator and disposed around the plate, a second band being an insulator and disposed around the plate so as to be substantially parallel to the first band, an insulating coating covering a region sandwiched between the first and second bands, a cathode layer formed on the insulating coating, and an anode containing the plate and formed on an outer side of at least one of the first and second bands. The cathode layers are elctrically connected to each other through paths each connecting in series the facing two cathode layers of the adjacent two elements and path(s) connecting in parallel the cathode layers to each other, and the anodes are electrically connected to each other through path(s) connecting in parallel the anodes to each other.
摘要翻译： 电容器具有层叠电容器元件，每个层叠电容器元件包含导体板，第一带为绝缘体并设置在板周围，第二带为绝缘体，围绕板设置成基本上平行于第一带， 覆盖夹在第一和第二带之间的区域的绝缘涂层，形成在绝缘涂层上的阴极层和形成在第一和第二带中的至少一个的外侧的阳极。 阴极层通过各自相互连接的相邻两个元件的相对的两个阴极层的通路和与阴极层彼此并联连接的路径彼此电气连接，并且阳极彼此电连接通过 将阳极并联连接的路径彼此。
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公开(公告)号：US20060087795A1
公开(公告)日：2006-04-27
申请号：US11260831
申请日：2005-10-27
申请人： Toshihisa Nagasawa , Kenji Araki , Hitoshi Takata , Akihiro Kawai , Shinji Arai
发明人： Toshihisa Nagasawa , Kenji Araki , Hitoshi Takata , Akihiro Kawai , Shinji Arai
IPC分类号： H01G4/228
CPC分类号： H01G9/008 , H01G9/08 , Y10T29/417
摘要： A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions 11 at opposite ends thereof and a cathode portion 12 at the center, an anode terminal 18 connected to each anode lead portion 11 via a strip-like plate 14, and a cathode terminal 19 connected to the cathode portion 12. The anode and the cathode terminals 18 and 19 have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case 20 has a bottom portion filling a gap between the anode and the cathode terminals 18 and 19 and mechanically connecting the anode and the cathode terminals 18 and 19, and side walls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals 18 and 19 have upper surfaces exposed on an inner bottom surface of the mold resin case 20 to be connected to the anode lead portions 11 and the cathode portion 12.
摘要翻译： 表面贴装电容器包括层叠电容器结构，该层叠电容器结构通过层叠板状电容器元件而形成，所述电容器元件的相对端部具有阳极引线部分11和位于其中心的阴极部分12，阳极端子18经由一个阳极引线部分11经由 条状板14和连接到阴极部分12的阴极端子19。 阳极和阴极端子18和19具有扁平形状并且形成在公共平面上作为基板安装表面。 模具树脂壳体20具有填充阳极和阴极端子18和19之间的间隙的底部，并且机构地连接阳极和阴极端子18和19以及基本垂直于基板安装表面的侧壁。 阳极和阴极端子18和19具有暴露在模制树脂壳体20的内底表面上的上表面，以连接到阳极引线部分11和阴极部分12。
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公开(公告)号：US20070148900A1
公开(公告)日：2007-06-28
申请号：US11681112
申请日：2007-03-01
申请人： Toshihisa NAGASAWA , Kenji Araki , Hitoshi Takata , Akihiro Kawai , Shinji Arai
发明人： Toshihisa NAGASAWA , Kenji Araki , Hitoshi Takata , Akihiro Kawai , Shinji Arai
IPC分类号： H01L21/20
CPC分类号： H01G9/008 , H01G9/08 , Y10T29/417
摘要： A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions at opposite ends thereof and a cathode portion at the center, an anode terminal connected to each anode lead portion via a strip-like plate, and a cathode terminal connected to the cathode portion. The anode and the cathode terminals and have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case has a bottom portion filling a gap between the anode and the cathode terminals and mechanically connecting the anode and the cathode terminals and sidewalls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals have upper surfaces exposed on an inner bottom surface of the mold resin case to be connected to the anode lead portions and the cathode portion.
摘要翻译： 表面贴装电容器包括层叠电容器结构，该层叠电容器结构通过层压板状电容器元件而形成，所述电容器元件的相对端具有阳极引线部分，并且在中心部分具有阴极部分，阳极端子经由条状板连接到每个阳极引线部分 以及连接到阴极部分的阴极端子。 阳极和阴极端子并且具有平坦形状并且形成在公共平面上作为基板安装表面。 模具树脂壳体具有填充阳极和阴极端子之间的间隙的底部部分，并且将阳极和阴极端子和基本上垂直于衬底安装表面的侧壁机械连接。 阳极和阴极端子具有暴露在模制树脂壳体的内底表面上的上表面，以连接到阳极引线部分和阴极部分。
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公开(公告)号：US07326261B2
公开(公告)日：2008-02-05
申请号：US11681112
申请日：2007-03-01
申请人： Toshihisa Nagasawa , Kenji Araki , Hitoshi Takata , Akihiro Kawai , Shinji Arai
发明人： Toshihisa Nagasawa , Kenji Araki , Hitoshi Takata , Akihiro Kawai , Shinji Arai
IPC分类号： H01G9/00
CPC分类号： H01G9/008 , H01G9/08 , Y10T29/417
摘要： A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions at opposite ends thereof and a cathode portion at the center, an anode terminal connected to each anode lead portion via a strip-like plate, and a cathode terminal connected to the cathode portion. The anode and the cathode terminals and have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case has a bottom portion filling a gap between the anode and the cathode terminals and mechanically connecting the anode and the cathode terminals and sidewalls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals have upper surfaces exposed on an inner bottom surface of the mold resin case to be connected to the anode lead portions and the cathode portion.
摘要翻译： 表面贴装电容器包括层叠电容器结构，该层叠电容器结构通过层压板状电容器元件而形成，所述电容器元件的相对端具有阳极引线部分，并且在中心部分具有阴极部分，阳极端子经由条状板连接到每个阳极引线部分 以及连接到阴极部分的阴极端子。 阳极和阴极端子并且具有平坦形状并且形成在公共平面上作为基板安装表面。 模具树脂壳体具有填充阳极和阴极端子之间的间隙的底部部分，并且将阳极和阴极端子和基本上垂直于衬底安装表面的侧壁机械连接。 阳极和阴极端子具有暴露在模制树脂壳体的内底表面上的上表面，以连接到阳极引线部分和阴极部分。
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公开(公告)号：US07206193B2
公开(公告)日：2007-04-17
申请号：US11260831
申请日：2005-10-27
申请人： Toshihisa Nagasawa , Kenji Araki , Hitoshi Takata , Akihiro Kawai , Shinji Arai
发明人： Toshihisa Nagasawa , Kenji Araki , Hitoshi Takata , Akihiro Kawai , Shinji Arai
CPC分类号： H01G9/008 , H01G9/08 , Y10T29/417
摘要： A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions 11 at opposite ends thereof and a cathode portion 12 at the center, an anode terminal 18 connected to each anode lead portion 11 via a strip-like plate 14, and a cathode terminal 19 connected to the cathode portion 12. The anode and the cathode terminals 18 and 19 have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case 20 has a bottom portion filling a gap between the anode and the cathode terminals 18 and 19 and mechanically connecting the anode and the cathode terminals 18 and 19, and side walls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals 18 and 19 have upper surfaces exposed on an inner bottom surface of the mold resin case 20 to be connected to the anode lead portions 11 and the cathode portion 12.
摘要翻译： 表面贴装电容器包括层叠电容器结构，该层叠电容器结构通过层叠板状电容器元件而形成，所述电容器元件的相对端部具有阳极引线部分11和位于其中心的阴极部分12，阳极端子18经由一个阳极引线部分11经由 条状板14和连接到阴极部分12的阴极端子19。 阳极和阴极端子18和19具有扁平形状并且形成在公共平面上作为基板安装表面。 模具树脂壳体20具有填充阳极和阴极端子18和19之间的间隙的底部，并且机构地连接阳极和阴极端子18和19以及基本垂直于基板安装表面的侧壁。 阳极和阴极端子18和19具有暴露在模制树脂壳体20的内底表面上的上表面，以连接到阳极引线部分11和阴极部分12。
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公开(公告)号：US20060262490A1
公开(公告)日：2006-11-23
申请号：US11437488
申请日：2006-05-20
摘要： A capacitor has stacking capacitor elements, each of which contains a conductor plate, a first band being an insulator and disposed around the plate, a second band being an insulator and disposed around the plate so as to be substantially parallel to the first band, an insulating coating covering a region sandwiched between the first and second bands, a cathode layer formed on the insulating coating, and an anode containing the plate and formed on an outer side of at least one of the first and second bands. The cathode layers are elctrically connected to each other through paths each connecting in series the facing two cathode layers of the adjacent two elements and path(s) connecting in parallel the cathode layers to each other, and the anodes are electrically connected to each other through path(s) connecting in parallel the anodes to each other.
摘要翻译： 电容器具有层叠电容器元件，每个层叠电容器元件包含导体板，第一带为绝缘体并设置在板周围，第二带为绝缘体，围绕板设置成基本上平行于第一带， 覆盖夹在第一和第二带之间的区域的绝缘涂层，形成在绝缘涂层上的阴极层和形成在第一和第二带中的至少一个的外侧的阳极。 阴极层通过各自相互连接的相邻两个元件的相对的两个阴极层的通路和与阴极层彼此并联连接的路径彼此电气连接，并且阳极彼此电连接通过 将阳极并联连接的路径彼此。
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