公开(公告)号：US20090061653A1

公开(公告)日：2009-03-05

申请号：US12231487

申请日：2008-09-03

申请人： Hiroyuki Mizushina ,  Hiroyuki Miura ,  Mitsunori Hanaka

发明人： Hiroyuki Mizushina ,  Hiroyuki Miura ,  Mitsunori Hanaka

IPC分类号： H01R12/14

CPC分类号： H01R24/52 ,  H01R24/44 ,  H01R2103/00

摘要： A connector unit comprises a case, a substrate and a connector. The case is formed with an opening. The substrate is installed within the case and is formed with a signal conductive pattern and a ground conductive pattern. The ground conductive pattern is electrically connected to the case. The connector comprises a contact, an outer conductor and a high impedance member. The outer conductor is electrically connected to the ground conductive pattern. The outer conductor is insulated from the contact but covers, at least in part, the contact. The contact is electrically connected to the signal conductive pattern. The high impedance member has high impedance in a high frequency range. The high impedance member is positioned between the outer conductor and the case within the opening of the case. For example, the high impedance member is an electric wave absorber.

摘要翻译： 连接器单元包括壳体，基板和连接器。 外壳形成一个开口。 衬底安装在壳体内并形成有信号导电图案和接地导电图案。 接地导体图案电连接到外壳。 连接器包括接触件，外部导体和高阻抗部件。 外部导体电连接到接地导体图案。 外部导体与触点绝缘，但至少部分地覆盖触点。 触点电连接到信号导电图案。 高阻抗部件在高频范围内具有高阻抗。 高阻抗构件位于壳体开口内的外导体和壳体之间。 例如，高阻抗部件是电波吸收体。