公开(公告)号：US20120217166A1

公开(公告)日：2012-08-30

申请号：US13395204

申请日：2010-08-12

申请人： Franz Gassner ,  Frank Straubinger ,  Klaus Reissmueller ,  Guenter Wirth ,  Silvia Neuhaus

发明人： Franz Gassner ,  Frank Straubinger ,  Klaus Reissmueller ,  Guenter Wirth ,  Silvia Neuhaus

IPC分类号： C25D5/10

CPC分类号： C25D5/10 ,  C25D3/38 ,  C25D5/50

摘要： In the electroplating of zinc diecastings with a copper layer, the electrolyte penetrates into the pores of the zinc diecasting. When the temperature is increased later, this leads to vaporization of the electrolyte liquid in the pores and to blistering or flaking of the copper layer. It is proposed that plating be carried out in two steps. In the first step, only a thin copper layer of less than 1 μm is applied and the plated parts are then treated at a temperature which leads to vaporization of the electrolyte liquid. The thin copper layer is still sufficiently porous for the vapour to be able to escape. Only the solid constituents of the electrolyte remain. The copper layer is then thickened to a final thickness of from about 20 to 30 μm. In this plating step, electrolyte liquid no longer penetrates into the pores of the zinc diecasting. The parts which are coated in this way display no blistering or flaking of the copper layer after storage at a temperature of 150° C.

摘要翻译： 在带有铜层的锌压铸电镀中，电解质渗透到锌压铸的孔中。 当温度稍后升高时，导致孔中的电解质液体蒸发，铜层起泡或剥落。 建议电镀分两步进行。 在第一步骤中，仅施加小于1μm的薄铜层，然后在导致电解质液体蒸发的温度下处理镀覆部件。 薄铜层仍然足够多孔以使蒸气能够逸出。 只有电解质的固体成分残留。 然后将铜层加厚至约20至30μm的最终厚度。 在该电镀步骤中，电解液不再渗透到锌压铸孔中。 以这种方式涂覆的部件在150℃的温度下储存后不会显示出铜层的起泡或剥落。

公开(公告)号：US5534129A

公开(公告)日：1996-07-09

申请号：US277631

申请日：1994-07-20

申请人： Gerd Hoffacker ,  Hasso Kaiser ,  Klaus Reissmueller ,  Guenter Wirth

发明人： Gerd Hoffacker ,  Hasso Kaiser ,  Klaus Reissmueller ,  Guenter Wirth

IPC分类号： C25D3/58 ,  C25D3/60

CPC分类号： C25D3/60 ,  C25D3/58

摘要： In order to produce bright to brilliant, leveled copper-tin alloy coatings, galvanic baths are used which contain 1 to 60 g/l copper in the form of copper(I) cyanide, 1 to 50 g/l tin in the form of alkali stannate, 0 to 10 g/l zinc in the form of zinc cyanide, 1 to 200 g/l of one or several complex binders (e.g., oligosaccharides and/or polysaccharides), 1 to 100 g/l free alkali metal cyanide, 1 to 50 g/l free alkali metal hydroxide, 0 to 50 g/l alkali metal carbonate 0.01 to 5 g/l brightener (e.g., alkene sulfonate, alkyne sulfonate, pyridine compounds or sulfur-containing propane sulfonates) and 0 to 100 mg/l lead as lead(II) acetate or lead(II) sulfonate.

摘要翻译： 为了生产光亮至辉煌的平整的铜锡合金涂层，使用电镀浴，其中含有氰化铜（I）形式的1至60g / l铜，碱金属形式的1至50g / l锡 锡酸盐，以氰化锌的形式为0至10g / l的锌，1至200g / l的一种或多种复合粘合剂（例如寡糖和/或多糖），1至100g / l游离碱金属氰化物，1 至50g / l游离碱金属氢氧化物，0至50g / l碱金属碳酸盐0.01至5g / l增白剂（例如烯烃磺酸盐，炔烃磺酸盐，吡啶化合物或含硫丙烷磺酸盐）和0至100mg / l作为乙酸铅（II）或铅（II）磺酸铅。