公开(公告)号：US4873350A

公开(公告)日：1989-10-10

申请号：US253955

申请日：1988-10-03

Applicant: Andre Welter ,  Harmut Fischer ,  Leon Christiaens ,  Albrecht Wendel ,  Eugen Etschenberg ,  Norbert Dereu ,  Peter Kuhl ,  Eric Graf

Inventor： Andre Welter ,  Harmut Fischer ,  Leon Christiaens ,  Albrecht Wendel ,  Eugen Etschenberg ,  Norbert Dereu ,  Peter Kuhl ,  Eric Graf

IPC: A61K31/165 ,  A61K31/19 ,  A61K31/27 ,  A61K31/275 ,  A61K31/357 ,  A61K31/36 ,  A61K31/445 ,  A61P1/16 ,  A61P9/08 ,  A61P9/10 ,  A61P29/00 ,  A61P43/00 ,  C07C67/00 ,  C07C325/00 ,  C07C391/02 ,  C07D295/18 ,  C07D317/68

CPC classification number: A61K31/165 ,  C07C391/02

Abstract: The present invention relates to new diselenobis-benzoic acid amides of primary and secondary amines of the general formula (I): ##STR1## and processes for the treatment of diseases in humans caused by a cell injury.

Abstract translation: 本发明涉及通式（I）的伯胺和仲胺的新的二硒代苯甲酰胺和由细胞损伤引起的人类疾病的治疗方法。

公开(公告)号：US08481862B2

公开(公告)日：2013-07-09

申请号：US11350276

申请日：2006-02-09

Applicant: Deepak K. Pai ,  Melvin Eric Graf

Inventor： Deepak K. Pai ,  Melvin Eric Graf

IPC: H05K1/16

CPC classification number: H05K3/3426 ,  H01L23/49811 ,  H01L24/72 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/351 ,  H05K2201/0373 ,  H05K2201/10727 ,  H05K2201/10818 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00

Abstract: The present invention relates to a connector system for resiliently attaching and electrically connecting an integrated circuit chip to a circuit board using a plurality of leads. Each of the plurality of leads are sized and arranged to form a curved body having a first leg and a second leg with a curved portion between the first leg and the second leg. The curved body of the leads may be C-shaped in accordance with the present invention. The plurality of leads may be formed from strips of copper foil or copper mesh folded to form the curved body. The plurality of leads may also be sized and arranged to support the integrated circuit chip in a generally flat arrangement relative to the circuit board with a maximum separation of about 0.016 inches or less between the integrated circuit chip and the circuit board.

Abstract translation: 连接器系统技术领域本发明涉及一种使用多根引线将集成电路芯片弹性连接并电连接到电路板的连接器系统。 多个引线中的每一个的尺寸和布置成形成具有第一腿部和第二腿部的弯曲主体，第一腿部和第二腿部之间具有在第一腿部和第二腿部之间的弯曲部分。 根据本发明，引线的弯曲体可以是C形。 多个引线可以由折叠的铜箔或铜网的条形成，以形成弯曲体。 多个引线还可以被设计和布置成将集成电路芯片相对于电路板以大致平坦的布置支撑，在集成电路芯片和电路板之间具有大约0.016英寸或更小的最大间隔。