VME circuit host card with triple mezzanine configuration
    6.
    发明授权
    VME circuit host card with triple mezzanine configuration 失效
    具有三重夹层配置的VME电路主机卡

    公开(公告)号:US06768642B2

    公开(公告)日:2004-07-27

    申请号:US10319524

    申请日:2002-12-16

    IPC分类号: H05H720

    摘要: A circuit card assembly includes a host card having connector assemblies and a conduction-cooling path. A first and second mezzanine card each having electronic circuitry defining a component field is mounted to the conduction-cooling path of the host card and connected to the connector assemblies. A third mezzanine card is mounted to the host card and over at least a portion of the component field of the first and second mezzanine cards. A cooling path is provided between the third mezzanine card and the host card and mechanical interference is prevented between the third mezzanine card and the component field due to the profile of the conduction-cooling path. The conduction-cooling path may also be located on the third mezzanine card or on both the host card and the third mezzanine card. The third mezzanine card is connected to the connector assemblies outside of the connector area of the other mezzanine cards.

    摘要翻译: 电路卡组件包括具有连接器组件和传导冷却路径的主机卡。 每个具有限定分量场的电子电路的第一和第二夹层卡被安装到主机卡的传导冷却路径并连接到连接器组件。 第三夹层卡被安装到主机卡和第一和第二夹层卡的分量场的至少一部分上。 在第三夹层卡和主卡之间提供冷却路径,并且由于传导冷却路径的轮廓,在第三夹层卡和部件场之间可以防止机械干扰。 传导冷却路径也可以位于第三夹层卡上或主机卡和第三夹层卡上。 第三夹层卡连接到另一个夹层卡的连接器区域外部的连接器组件。