公开(公告)号：US09768101B2

公开(公告)日：2017-09-19

申请号：US15260069

申请日：2016-09-08

Applicant: Dazhong Liang

Inventor： Dazhong Liang

IPC: H01L21/00 ,  H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/29

CPC classification number: H01L23/49541 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/293 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/4951 ,  H01L23/4952 ,  H01L23/49586 ,  H01L23/562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45639 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/37001 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01032 ,  H01L2924/01041 ,  H01L2924/0104 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention relates to the technical field of integrated circuit package, and more specifically, this invention relates to a high density integrated circuit package structure and an integrated circuit with this package structure. A high density integrated circuit package structure according to this invention comprises a sealed metal lead frame, a chip, and a cuboid plastic package structure with micron connecting wires. The length (A1) of the plastic package structure meets the relationship 1.20 mm+(B−8)×0.3 mm/2≦A1≦4.50 mm+(B−8)×1.00 mm/2, the width (A2) of the plastic package structure meets the relationship 1.20 mm≦A2≦3.50 mm, the thickness (A3) of the plastic package structure meets the relationship A3≧0.35 mm, and B is the number of the outer leads and is an integer number meeting the relationship 4≦B≦68. A package structure according to this invention may meet the demands generated when chip manufacturing technology progresses from micron scale to sub-micron scale, or even nanometer scale. It may satisfy the requirements of low power consumption, high speed, large capacity and small volume for portable products.

公开(公告)号：US20170207149A1

公开(公告)日：2017-07-20

申请号：US15260069

申请日：2016-09-08

Applicant: Dazhong LIANG

Inventor： Dazhong LIANG

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/29 ,  H01L21/48

CPC classification number: H01L23/49541 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/293 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/4951 ,  H01L23/4952 ,  H01L23/49586 ,  H01L23/562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45639 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/37001 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01032 ,  H01L2924/01041 ,  H01L2924/0104 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention relates to the technical field of integrated circuit package, and more specifically, this invention relates to a high density integrated circuit package structure and an integrated circuit with this package structure. A high density integrated circuit package structure according to this invention comprises a sealed metal lead frame, a chip, and a cuboid plastic package structure with micron connecting wires. The length (A1) of the plastic package structure meets the relationship 1.20 mm+(B−8)×0.3 mm/2≦A1≦4.50 mm+(B−8)×1.00 mm/2, the width (A2) of the plastic package structure meets the relationship 1.20 mm≦A2≦3.50 mm, the thickness (A3) of the plastic package structure meets the relationship A3≧0.35 mm, and B is the number of the outer leads and is an integer number meeting the relationship 4≦B≦68. A package structure according to this invention may meet the demands generated when chip manufacturing technology progresses from micron scale to sub-micron scale, or even nanometer scale. It may satisfy the requirements of low power consumption, high speed, large capacity and small volume for portable products.