摘要:
A magnetic head having an electrostatic shunt structure for preventing damage to the magnetic head during manufacture. A portion of the shunt structure is removed during manufacture, however another portion remains. In order to prevent the remaining portions of the shunt structure from picking up stray magnetic and electromagnetic fields, an electromagnetic shield, is provided between the remaining portions of the shunt structure and the substrate.
摘要:
A perpendicular magnetic recording system has a write head having a main coil (the write coil) and main pole (the write pole) that directs write flux in a direction perpendicular to the recording layer in the magnetic recording medium, and an auxiliary coil and auxiliary pole that injects magnetic flux into the write pole at an angle to the primary or perpendicular axis of the write pole. The additional flux from the auxiliary pole, which is injected non-parallel to the primary magnetization of the write pole, exerts a relatively large torque on the magnetization of the write pole, thereby facilitating magnetization reversal of the write pole. Electrical circuitry is connected to the main coil and the auxiliary coil to generate the auxiliary flux simultaneous with the switching of the magnetization of the write pole.
摘要:
A method of temporarily protecting an electrically sensitive component from damage due to electrostatic discharge includes defining a shunt having first and second leads electrically connected in parallel with the component and separated by a gap. A portion of a shield layer is deposited to form the shunt between the first and second leads to span the gap therebetween and form a shunted assembly. The shunted assembly and component are lapped to form the ABS at the location of the component, a sacrificial carbon overcoat is deposited on the ABS, and additional processing is performed on the shunted assembly. A portion of the shunted assembly, the shunt, and portions of the sacrificial carbon overcoat are then removed to form an electrical open for an unshunted assembly having ABS features comprising an air bearing cavity/deep gap at a former location of the shunted assembly.
摘要:
In a tunnel magnetoresistive (TMR) device, free sublayers are separated by an intermediate spacer layer that serves to ensure a uniform circumferential magnetization in the free stack, counterbalancing orange-peel coupling by antiferromagnetic exchange coupling. Thus, a CPP MR device may have a seed stack, a pinned stack on the seed stack, and a tunnel barrier on the pinned stack. A free stack can be on the tunnel barrier, and the free stack can include structure for promoting uniform circumferential magnetization in the free stack.
摘要:
Embodiments of the invention provide methods, systems and apparatus for testing electronic components, and more specifically for testing magnetoresistive heads. A pair of top shield pads and a pair of bottom shield pads may be formed in a kerf region of a wafer on which magnetoresistive heads are formed. The top shield pads, bottom shield pads, and a magnetoresistive head may form a circuit that may be coupled with a testing circuit to exchange test signals configured to test the magnetic head. The pair of bottom shield pads may provide balanced impedance to substrate that nullifies the effects of broadband noise.
摘要:
An improved magnetic head for a hard disk drive including a lead overlaid read head in which the read width and read gap are reduced. The read width, which corresponds to the distance between the inner ends of the overlaid electrical leads, is reduced by the fabrication of a thin read width insulation member prior to the fabrication of the overlaid electrical leads. The read gap is reduced by fabricating the overlaid electrical leads from a magnetic, electrically conductive material such as NiFe, whereby the overlaid electrical leads also function as a magnetic shield. The read gap, which is the distance between the first and second magnetic shields is thus reduced as compared to the prior art by the thickness of the electrical leads and the thickness of the prior art second insulation layer formed between the electrical leads and the second magnetic shield.
摘要:
A current-perpendicular-to-the-plane (CPP) magnetoresistive (MR) read head structure has the MR read head located between first and second shields (S1, S2) on a substrate with a shunt resistor R1 connecting S1 to the substrate and a shunt resistor R2 connecting S2 to the substrate, with R1 and R2 being approximately equal. Because R1 and R2 are close enough in value there is no significant interference pickup in the low frequency region. The shunt resistors can be formed from high-resistivity metal nitrides or cermets. The spacing between the substrate and S1 may be selected to make the capacitance between S1 and the substrate approximately equal to the capacitance between S2 and the substrate to substantially reduce interference pickup in the high frequency region. Equalization conductors (EC1, EC2) may be connected to the substrate and spaced from S2 and S1, respectively, by electrically insulating material to create additional capacitances with values selected to substantially equalize the total parasitic capacitance on S2 with the total parasitic capacitance on S1.
摘要:
A thin-film magnetic head includes a substrate having first and second magnetic layers disposed above the substrate and formed as a laminated sequence of magnetic sub-layers. The first and second magnetic layers have corresponding first ends representing a pole tip region of the head, corresponding second ends representing a back gap region of the head, and corresponding intermediate portions representing an intermediate region of the head between the pole tip region and the back gap region. The first and second magnetic layers are joined together in physical contact at the back gap region and are spaced from one another at the pole tip region and at the intermediate region. A nonmagnetic gap layer is disposed between the first and second magnetic layers at the pole tip region. A magnetic coil structure is disposed between the first and second magnetic layers at the intermediate region. The second magnetic layer has a sloped region wherein the second magnetic layer slopes away from the first magnetic layer behind the pole tip region to form a space for the magnetic coil structure. The sloped region of the second magnetic layer may have less magnetic permeability than other portions of the second magnetic layer. A third magnetic layer is thus disposed on the second magnetic layer and extends from the back gap region to cover at least the sloped region of the second magnetic layer.
摘要:
A magnetic head structure including a magnetoresistive (MR) head and an inductive head for data storage devices such as tape drives. A method of fabricating a magnetic head utilizing semiconductor-type processing techniques is described that produces an inductive head gap having a substantially flat planar structure throughout in length which, in one embodiment, has a length of 150 microns and a height of one micron. The structure includes a first and second shield, and an MR layer formed therebetween that includes an MR sensor adjacent to the air bearing surface (ABS), leads connected on opposite sides of the MR sensor, and isolated segments situated between the leads and extending all the way to the ABS. A trench (i.e. gap) is formed between the leads and the segments. Preferably, the leads and the segments are deposited simultaneously, and the insulating gap is formed subsequently by photoresist and masking techniques. By isolating the segments electrically, the leads are isolated from short circuits appearing across the ABS, thereby reducing noise, enhancing reliability and providing better performance, while at the same time providing a substantially flat structure upon which to form the inductive head and thereby provide a substantially uniform inductive head gap. Embodiments include merged heads and piggyback heads.
摘要:
Embodiments of the invention provide methods, systems and apparatus for testing electronic components, and more specifically for testing magnetoresistive heads. A pair of top shield pads and a pair of bottom shield pads may be formed in a kerf region of a wafer on which magnetoresistive heads are formed. The top shield pads, bottom shield pads, and a magnetoresistive head may form a circuit that may be coupled with a testing circuit to exchange test signals configured to test the magnetic head. The pair of bottom shield pads may provide balanced impedance to substrate that nullifies the effects of broadband noise.