公开(公告)号：US07977698B2

公开(公告)日：2011-07-12

申请号：US11084517

申请日：2005-03-18

申请人： Elizabeth Fung Ching Ling ,  Chia Chee Wai ,  Ng Joh Joh ,  Koay Hui Peng

发明人： Elizabeth Fung Ching Ling ,  Chia Chee Wai ,  Ng Joh Joh ,  Koay Hui Peng

IPC分类号： H01L33/00 ,  H05K3/30 ,  H05K3/34

CPC分类号： G09F9/33 ,  H01L33/60 ,  H01L2224/48091 ,  H05K1/141 ,  H05K3/301 ,  H05K3/3421 ,  H05K2201/10128 ,  H05K2201/10325 ,  Y10S362/80 ,  H01L2924/00014

摘要： A system and method is disclosed for allowing a solid substrate, such as a printed circuit board (PCB), to act as the support structure for an electronic circuit. In one embodiment, the LEDs which form a part of a scrambler assembly are constructed on a first substrate and the electrical connections are run to the edges of the substrate and end in electrical contacts positioned thereat. The substrate is then connected to the scrambler package by a series of electrical and mechanical connections to form the LED package. The electrical contacts which are part of the LED package extend from the LED package so as to enable electrical contact with a separate controller substrate.

摘要翻译： 公开了一种用于允许诸如印刷电路板（PCB）的固体基板用作电子电路的支撑结构的系统和方法。 在一个实施例中，形成加扰器组件的一部分的LED构造在第一基板上，并且电连接运行到基板的边缘并且在位于其上的电触头中终止。 然后通过一系列电气和机械连接将衬底连接到扰流器封装以形成LED封装。 作为LED封装的一部分的电触点从LED封装延伸，以便能够与单独的控制器基板电接触。