公开(公告)号：US20080093057A1

公开(公告)日：2008-04-24

申请号：US11841679

申请日：2007-08-20

Applicant: Dong-Hyun CHOI ,  Yong-Wook KIM ,  Cheol-Won JANG ,  Yong-Ho CHOI

Inventor： Dong-Hyun CHOI ,  Yong-Wook KIM ,  Cheol-Won JANG ,  Yong-Ho CHOI

IPC: F28D15/00

CPC classification number: H01L21/67109 ,  F28D15/00

Abstract: A cooling apparatus having an auxiliary chiller is provided. The apparatus can include a wafer chuck on which a wafer is mounted and in which a cooling cavity is formed. A main chiller having a main coolant reservoir can be spaced apart from the wafer chuck. The cooling cavity and the main coolant reservoir can be arranged in communication with each other through coolant passages. The coolant passages can include an auxiliary chiller detachably installed thereon, respectively. A method of cooling a wafer chuck or process chamber during a semiconductor device fabrication process is also provided. Using the method and apparatuses of this invention, fine temperature adjustments of the wafer chuck are possible.

Abstract translation: 提供具有辅助冷却器的冷却装置。 该装置可以包括其上安装有晶片的晶片卡盘，并且其中形成有冷却腔。 具有主冷却剂储存器的主冷却器可以与晶片卡盘间隔开。 冷却腔和主冷却剂储存器可以通过冷却剂通道相互连通。 冷却剂通道可以分别包括可拆卸地安装在其上的辅助冷却器。 还提供了在半导体器件制造工艺期间冷却晶片卡盘或处理室的方法。 使用本发明的方法和装置，晶片卡盘的精细温度调节是可能的。