摘要:
Examples of a computer system packaged in a three-dimensional stack of dies are described. The package includes an electrical die and an optical die coupled to and stacked with the electrical die. The electrical die includes circuitry to process and communicate electrical signals, and the optical die includes structures to transport optical signals. The electrical die has a smaller area than the optical die so that the optical die includes an exposed mezzanine which is configured with optical input/output ports. Additionally, the packaging can be configured to provide structural support against insertion forces for external optical connections.
摘要:
Illustrated is a computer system and method that includes a Processing Element (PE) to generate a data packet that is routed along a shortest path that includes a plurality of routers in a multiple dimension network. The system and method further include a router, of the plurality of routers, to de-route the data packet from the shortest path to an additional path, the de-route to occur where the shortest path is congested and the additional path links the router and an additional router in a dimension of the multiple dimension network.
摘要:
Illustrated is a computer system and method that includes a Processing Element (PE) to generate a data packet that is routed along a shortest path that includes a plurality of routers in a multiple dimension network. The system and method further include a router, of the plurality of routers, to de-route the data packet from the shortest path to an additional path, the de-route to occur where the shortest path is congested and the additional path links the router and an additional router in a dimension of the multiple dimension network.
摘要:
Examples of a computer system packaged in a three-dimensional stack of dies are described. The package includes an electrical die and an optical die coupled to and stacked with the electrical die. The electrical die includes circuitry to process and communicate electrical signals, and the optical die includes structures to transport optical signals. The electrical die has a smaller area than the optical die so that the optical die includes an exposed mezzanine which is configured with optical input/output ports. Additionally, the packaging can be configured to provide structural support against insertion forces for external optical connections.
摘要:
Various embodiments of the present invention are directed to optical-based barrier methods and systems for synchronizing processing of two or more threads. In one method embodiment of a barrier method, each thread can be processed by a different processing element. The method comprises transmitting a lightwave along a waveguide that is optically coupled to each of the processing elements. Each processing element that processes a thread turns on diverter capable of diverting substantially all of the lightwave from the waveguide. Each processing element that completes processing of a thread turns off a corresponding diverter. A barrier is reached when all of the processing elements have turned off the corresponding diverters and discontinued diverting a portion of the lightwave from the waveguide.