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公开(公告)号：US12131870B2
公开(公告)日：2024-10-29
申请号：US18332176
申请日：2023-06-09
发明人： Tomoki Sakai
CPC分类号： H01G4/30 , C04B35/468 , H01G2/065 , H01G4/008 , H01G4/012 , H01G4/1227 , C04B2235/66
摘要： A multi-layer ceramic electronic component includes: a ceramic body including internal electrodes laminated and drawn to a surface of the ceramic body; and an external electrode including: a base film disposed on the surface of the ceramic body, connected to the internal electrodes, and formed from an electrically conductive material, a first nickel film disposed on and in contact with the base film in a thickness direction of the base film, and a second nickel film disposed on the first nickel film in a thickness direction of the first nickel film.
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公开(公告)号：US12119454B2
公开(公告)日：2024-10-15
申请号：US17153493
申请日：2021-01-20
发明人： Masashi Sekiguchi , Daigo Ito
IPC分类号： H01M10/0585 , H01M10/0525 , H01M10/0562
CPC分类号： H01M10/0585 , H01M10/0525 , H01M10/0562 , H01M2300/0068
摘要： An all solid battery includes a multilayer structure in which solid electrolyte layers and internal electrodes are alternately stacked, the plurality of internal electrodes including an electrode active material and a carbon material, the multilayer structure having a rectangular parallelepiped shape, the plurality of internal electrodes being alternately exposed to two different faces of the multilayer structure, a first cover layer provided on an upper face of the multilayer structure in a stacking direction, and a second cover layer provided on a lower face of the multilayer structure in the stacking direction. Each thickness of the plurality of internal electrodes is equal to or more than each thickness of the plurality of solid electrolyte layers. Vickers hardness of the plurality of solid electrolyte layers and Vickers hardness of the first and second cover layers are larger than Vickers hardness of the plurality of internal electrodes.
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公开(公告)号：US20240331902A1
公开(公告)日：2024-10-03
申请号：US18616277
申请日：2024-03-26
发明人： Tatsuya TOMITA , Tomoya HAGIWARA
IPC分类号： H01F1/24 , H01F1/33 , H01F27/255 , H01F41/02
CPC分类号： H01F1/24 , H01F1/33 , H01F27/255 , H01F41/0246
摘要： Provided is a magnetic base body having excellent insulating properties and magnetic properties. A magnetic base body according to one embodiment includes: a plurality of soft magnetic metal particles; and a plurality of insulating films each covering a surface of corresponding one of the plurality of soft magnetic metal particles. In the magnetic base body, the plurality of soft magnetic metal particles are filled at a filling factor of 85% or higher. The KAM value of the soft magnetic metal particles is 0.6 or less. The soft magnetic metal particles contain 95 wt % or more Fe, Si, and Al. The insulating films contain an oxide of Si and an oxide of Al.
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公开(公告)号：US20240315612A1
公开(公告)日：2024-09-26
申请号：US18680223
申请日：2024-05-31
IPC分类号： A61B5/145 , A61B5/00 , A61B5/1455
CPC分类号： A61B5/14532 , A61B5/1455 , A61B5/681
摘要： A measuring device includes a first light emitting section that emits first light; a light collecting section that has a first surface, a second surface that faces the first surface and that has a larger area than the first surface, and a wall surface that connects the first surface and the second surface and that allows the first light to pass therethrough; a light receiving section that is disposed on the first surface to receive the first light irradiated onto a living body from the second surface and returned from the living body; and a calculation section that receives an output from the light receiving section to calculate numerical information regarding the living body.
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公开(公告)号：US12073996B2
公开(公告)日：2024-08-27
申请号：US17678917
申请日：2022-02-23
发明人： Kotaro Mizuno
CPC分类号： H01G4/008 , B22F1/05 , C22C19/03 , H01G4/30 , B22F2301/15 , B22F2304/05
摘要： A ceramic electronic device includes a multilayer chip in which each of a plurality of dielectric layers of which a main component is ceramic, and each of a plurality of internal electrode layers are alternately stacked. The plurality of internal electrode layers include Ni, S and Sn.
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公开(公告)号：US20240242885A1
公开(公告)日：2024-07-18
申请号：US18397341
申请日：2023-12-27
发明人： Koichiro MORITA
IPC分类号： H01G4/12 , C04B35/468 , H01G4/30
CPC分类号： H01G4/1227 , C04B35/4682 , H01G4/30 , C04B2235/3224 , C04B2235/3236 , C04B2235/3262 , C04B2235/365 , C04B2235/442
摘要： A multilayer ceramic electronic device includes internal electrodes, dielectric layers each of which includes a main component, a first subcomponent, a second subcomponent, and a third sub component. The main component includes titanium and includes at least one of barium or calcium. A molar ratio of a sum of barium and calcium to titanium is 1.045 or more and 1.100 or less. The first sub component includes 3 mol or more and 6 mol or less of a rare earth element, with respect to 100 mol of titanium in the dielectric layers. The second sub component includes 3 mol or more and 7 mol or less of manganese, with respect to 100 mol of titanium in the dielectric layers. The third sub component includes 0.6 weight % or more and 2.4 weight % or less of borosilicate glass with respect to each of the plurality of dielectric layers.
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公开(公告)号：US12033798B2
公开(公告)日：2024-07-09
申请号：US17584994
申请日：2022-01-26
摘要： A ceramic electronic device includes a multilayer structure in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked. A main component of the plurality of dielectric layers is a ceramic having a perovskite structure of which an A site includes at least Ba and of which an A/B ratio is 0.980 or less. The plurality of internal electrode layers include a co-material. A total amount of Ti, Zr and Hf is 90 mol % or more in metal elements included in the co-material and an amount of Ba is 10 mol % or less in the metal elements.
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公开(公告)号：US12014877B2
公开(公告)日：2024-06-18
申请号：US16915979
申请日：2020-06-29
发明人： Katsuya Taniguchi
IPC分类号： H01G4/30 , C04B35/468 , H01G4/008 , H01G4/012 , H01G4/12
CPC分类号： H01G4/30 , C04B35/4682 , H01G4/008 , H01G4/012 , H01G4/1218 , C04B2235/6583 , C04B2235/783
摘要： A ceramic electronic device includes: a multilayer structure; and a cover layer, wherein a concentration of Mn of the cover layer with respect to a main component ceramic is larger than a concentration of Mn of the dielectric layers with respect to a main component ceramic in a capacity section, wherein an average crystal grain diameter of a first dielectric layer is smaller than that of a second dielectric layer, and a concentration of Mn of the first dielectric layer with respect to the main component ceramic is larger than a concentration of Mn of the second dielectric layer with respect to the main component ceramic, in the capacity section.
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公开(公告)号：US12002630B2
公开(公告)日：2024-06-04
申请号：US17939851
申请日：2022-09-07
发明人： Kotaro Mizuno
CPC分类号： H01G4/30 , C04B35/4682 , C04B35/64 , H01G4/008 , H01G4/012 , H01G4/1227
摘要： A ceramic electronic device includes a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers including Ni as a main phase are alternately stacked. At least one of the plurality of dielectric layers includes a secondary phase including Si, at an interface between the at least one of the plurality of dielectric layers and one of the plurality of internal electrode layers next to the at least one of the plurality of dielectric layers. The one of the plurality of internal electrode layers includes a layer including an additive element including one or more of Au, Pt, Cu, Fe, Cr, Zn, and In, at a region contacting the secondary phase at the interface.
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10.发明授权公开(公告)号：US11996241B2
公开(公告)日：2024-05-28
申请号：US17684555
申请日：2022-03-02
发明人： Shigeto Takei
CPC分类号： H01G4/30 , H01G2/065 , H01G4/012 , H01G4/1218 , H01G4/224
摘要： A ceramic electronic component includes an element body, two external electrodes, and an oxide layer. The element body includes a dielectric and internal electrodes. The external electrodes are respectively formed to cover, at least partially, two end faces of the element body. Each external electrode includes a base layer and a plating layer. The base layer has a lower part formed on a bottom face of the element body and an end part formed on a corresponding one of the end faces of the element body. The plating layer is formed on at least the lower part of the corresponding base layer. The oxide layer is formed on a predetermined area of a top face of the element body. The oxide layer has a thinner portion in an area on the top face of the element body that is spaced from the end faces of the element body.
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