公开(公告)号：US11131722B2

公开(公告)日：2021-09-28

申请号：US16718787

申请日：2019-12-18

申请人： TDK—Micronas GmbH

发明人： Oliver Kawaletz ,  Martin Cornils

IPC分类号： G01R33/31 ,  G01R33/00

摘要： An apparatus (10) for checking a component (30) is disclosed. The apparatus (10) comprises a sample holder (20) with a module (28) for receiving at least one component (30), at least one magnetic field generator (60a, 60b, 60c) for generating a magnetic field around the module (28), an inlet (40) for feeding a tempered medium into the module (25), and an outlet (45) for discharging a tempered medium from the module (28).

公开(公告)号：US11114501B2

公开(公告)日：2021-09-07

申请号：US16691082

申请日：2019-11-21

申请人： TDK-MICRONAS GMBH

发明人： Christian Sander ,  Martin Cornils

IPC分类号： H01L27/22 ,  H01L27/12 ,  H01L43/04 ,  H01L43/06 ,  H01L21/762

摘要： An SOI semiconductor structure, including a substrate layer formed on a back side and a semiconductor layer of a second conductivity type formed on a front side, an insulating layer being disposed between the substrate layer and the semiconductor layer, a three-dimensional Hall sensor structure having a sensor region made up of a monolithic semiconductor body being formed in the semiconductor layer, and the semiconductor body extending from an underside up to the front side, at least three first metallic terminal contacts being formed on the upper side, and at least three second metallic terminal contacts being formed on the underside, the first terminal contacts being offset with respect to the second terminal contacts in a projection perpendicular to the front side, each first terminal contact and each second terminal contact being formed in each case on a highly doped semiconductor contact region of a second conductivity type.

公开(公告)号：US10605625B2

公开(公告)日：2020-03-31

申请号：US15664691

申请日：2017-07-31

申请人： TDK—Micronas GmbH

发明人： Joerg Franke ,  Timo Kaufmann

IPC分类号： G01D5/14

摘要： A measuring system for determining the position of a transducer along a z-direction, having a semiconductor body having a surface, a back surface, at least one connection contact and at least one magnetic field sensor which is sensitive in the z-direction, a carrier having a front side, rear side and electrically conductive regions, a magnet for producing a magnetic field, having a first magnetic pole formed along a first surface and an axis of symmetry extending perpendicular to the first surface, wherein between at least one connection contact of the semiconductor body and at least one conductor track of the carrier, there is an electrical operative connection, the first surface of the magnet being arranged parallel to the z-direction and the axis of symmetry of the magnet being arranged perpendicular to the z-direction, the transducer having an end face facing the magnetic field sensor.

公开(公告)号：US10564003B2

公开(公告)日：2020-02-18

申请号：US15941825

申请日：2018-03-30

申请人： TDK-Micronas GmbH

发明人： Yan Bondar

IPC分类号： G01D5/14 ,  G01B7/30

摘要： A measuring system for determining an angle of rotation of a shaft, which is rotatable about an axis of rotation, having a magnetically conductive encoder, which is spaced from the axis of rotation and fixedly connected to the shaft, a magnet unit with a permanent magnet, and an intermediate sensor unit having two magnetic field sensors. The permanent magnet has a magnetization extending parallel to the axis of rotation, and a circular-cylindrical recess having a bottom, an axis of symmetry extending perpendicular to the bottom, and a diameter, the sensor unit being completely arranged within the recess and stationary with respect to the permanent magnet. The first distance of the encoder from the axis of rotation being less than half the diameter of the recess, the encoder being arranged in a direction parallel to the axis of rotation at a second distance from the sensor unit.

公开(公告)号：US10429209B2

公开(公告)日：2019-10-01

申请号：US15449650

申请日：2017-03-03

申请人： TDK—Micronas GmbH

发明人： Joerg Franke ,  Klaus Heberle

IPC分类号： G01D5/14 ,  G01D5/251

摘要： A position determining unit is provided that has a number of sensor units arranged at positions along a path, and a transducer. Each sensor unit has a carrier, a first and second supply voltage connection, a switching output, a measuring unit and a bias magnet comprising two poles. The measuring unit is arranged on the carrier and has at least one magnetic field sensor, wherein the switching output is switched into an On or Off-state as a function of a threshold value exceeding or falling short of a sensor signal. The first supply voltage connection of each sensor unit is connected to a supply voltage, wherein a first sensor unit is arranged at a beginning of the path and a last sensor unit is arranged at the end of the path. The second supply voltage connection of the first sensor unit is connected to a reference potential.

公开(公告)号：US10379138B2

公开(公告)日：2019-08-13

申请号：US15403098

申请日：2017-01-10

申请人： TDK-Micronas GmbH

发明人： Stefan Albrecht ,  Christian Schladebach ,  Dominik Zimmermann

IPC分类号： G01R1/04 ,  G01R31/28 ,  G01R33/07 ,  H01L43/06 ,  H01L43/04

摘要： An adapter for receiving at least one integrated circuit with a Hall sensor in a housing. The adapter has a cavity for receiving the at least one integrated circuit in the housing, at least one opening connected with the cavity, and a magnetic-field generating apparatus for generating a magnetic field in the cavity. The adapter is used in a system for detecting the strength of a magnetic field.

公开(公告)号：US20190063953A1

公开(公告)日：2019-02-28

申请号：US16173509

申请日：2018-10-29

申请人： TDK-Micronas GmbH

发明人： Joerg FRANKE

IPC分类号： G01D5/14 ,  G01R33/06 ,  G01B7/14

摘要： A distance measuring device with two magnetic field sensors and a permanent magnet and a semiconductor body is provided. The device includes a monolithically integrated evaluation circuit, and a difference signal can be determined by means of the magnetic field sensors and provides an output signal as a result of the determination. The value of the output signal based on the neutralization of a magnetic-flux-free region is a function of a distance of a ferromagnetic sensing element from the two magnetic field sensors. The semiconductor body is arranged between U-shaped pole shanks of the magnet, which is magnetized in the X direction, wherein the first magnetic field sensor is arranged in an area located between two opposing shanks of the first pole, and the second magnetic field sensor is arranged in an area located between two opposing shanks of the second pole.

公开(公告)号：US10080288B2

公开(公告)日：2018-09-18

申请号：US14939409

申请日：2015-11-12

申请人： Micronas GmbH

发明人： Thilo Rubehn

IPC分类号： H05K1/18 ,  G01R33/00

CPC分类号： H05K1/18 ,  G01R33/0047 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/49113 ,  H01L2924/00014

摘要： A circuit package having a first semiconductor body with a first monolithic integrated circuit having a first signal output that is interconnected with a bonding surface, and a first signal input that is interconnected with a bonding surface. The circuit package also has a second semiconductor body with a second monolithic integrated circuit having a second signal output that is interconnected with a bonding surface, and a second signal input that is interconnected with a bonding surface. The circuit package further features a contact element with at least one bonding surface, and a carrier element, wherein the bonding surface of the first signal output and the bonding surface of the second signal input are interconnected with the contact element so that an electrical connection exists between the first signal output and the second signal input, and a portion of the contact element penetrates the circuit package.

公开(公告)号：US20180233658A1

公开(公告)日：2018-08-16

申请号：US15950429

申请日：2018-04-11

申请人： TDK-Micronas GmbH

发明人： Marc Baumann ,  Thilo Rubehn ,  Christian Joos ,  Jochen Stephan

IPC分类号： H01L43/06 ,  H01L43/04 ,  H01L27/22 ,  G01R33/07 ,  G01R33/00

摘要： A component is provided comprising at least one substrate, at least one magnetic field sensor and at least one trench in the at least one substrate surrounds the at least one magnetic field sensor at least partially. At least one cap covers the at least one trench and the at least one magnetic field sensor, and at least one layer element arranged between the at least one cap and the at least one substrate.

公开(公告)号：US10026684B2

公开(公告)日：2018-07-17

申请号：US15863245

申请日：2018-01-05

申请人： TDK-Micronas GmbH

发明人： Klaus Heberle ,  Joerg Franke ,  Thomas Leneke

IPC分类号： H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L23/24 ,  H01L23/495

摘要： An IC package having a semiconductor body that includes a monolithically integrated circuit and at least two metallic contact surfaces. The integrated circuit being connected to the two electrical contact surfaces via printed conductors, and being disposed on a carrier substrate and connected to the carrier substrate in a force-fitting manner. The carrier substrate including at least two terminal contacts that are connected to the two contact surfaces. The semiconductor body and the carrier substrate being covered by a casting compound forming one part of the IC package. A section of each of the two terminal contacts penetrating the IC package. The two terminal contacts being disposed on the carrier substrate, and each terminal contact and the carrier substrate disposed beneath the particular terminal contacts having a hole-like formation. The particular hole-like formation being designed as a through-connection for providing an electrical connection to another electrical component.