公开(公告)号：US07876564B2

公开(公告)日：2011-01-25

申请号：US12127133

申请日：2008-05-27

申请人： Mohasit Monh ,  Ryan Petersen

发明人： Mohasit Monh ,  Ryan Petersen

IPC分类号： H05K7/20 ,  H01L23/34 ,  F28F7/00

CPC分类号： H01L23/427 ,  F28D15/0266 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method and apparatus for cooling chips on a computer memory module. The apparatus includes a primary and secondary heat spreaders, at least a first heatpipe coupled to the primary heat spreader and having a remote portion spaced apart from the primary heat spreader and thermally contacting the secondary heat spreader, and a coolant within the first heatpipe and the primary heat spreader so as to absorb heat from the primary heat spreader and conduct the heat to the secondary heat spreader. The primary heat spreader has at least two panels configured to engage the memory module therebetween, with facing contact surfaces of the panels adapted for thermal contact with the module chips. The secondary heat spreader is configured to increase surface dissipation of heat from the first heatpipe into the environment. The coolant has a boiling point at or below a maximum preselected operating temperature of the module chips.

摘要翻译： 一种用于在计算机存储器模块上冷却芯片的方法和装置。 该装置包括主和二次散热器，至少第一热管与第一散热器相连，并且具有与初级散热器间隔开并与第二散热器热接触的远端部分，以及第一热管内的冷却剂和 初级散热器，以便从主散热器吸收热量并将热量传导到二次散热器。 主散热器具有至少两个配置成与其间的存储器模块接合的面板，面板的面对的接触表面适于与模块芯片热接触。 二次散热器被配置为增加热量从第一热管到环境中的表面散热。 冷却剂具有等于或低于模块芯片的最大预选工作温度的沸点。