公开(公告)号：US20220112593A1

公开(公告)日：2022-04-14

申请号：US17070049

申请日：2020-10-14

申请人： Alluxa, Inc.

发明人： Michael A. Scobey ,  Shaun Frank McCaffery

IPC分类号： C23C14/35 ,  H01J37/34 ,  H01J37/32

摘要： A magnetron sputtering system includes a substrate mounted within a vacuum chamber. A plurality of cathode assemblies includes a first set of cathode assemblies and a second set of cathode assemblies, and is configured for reactive sputtering. Each cathode assembly includes a target comprising sputterable material and has an at least partially exposed planar sputtering surface. A target support is configured to support the target in the vacuum chamber and rotate the target relative to the vacuum chamber about a target axis. A magnetic field source includes a magnet array. A cathode assemblies controller assembly is operative to actuate the first set of cathode assemblies without actuating the second set of cathode assemblies, and to actuate the second set of cathode assemblies without actuating the first set of cathode assemblies.

公开(公告)号：US10801102B1

公开(公告)日：2020-10-13

申请号：US15714069

申请日：2017-09-25

申请人： Alluxa, Inc.

发明人： Michael A. Scobey ,  Shaun Frank Mccaffery

IPC分类号： C23C14/35 ,  H01J37/34 ,  C23C14/34

摘要： A cathode assembly for a magnetron sputtering system includes a target comprising sputterable material having an at least partially exposed, substantially planar sputtering or erosion surface and a target support configured to support and move the target during sputtering. In certain exemplary embodiments the cathode assembly further comprises a magnetic field source, e.g., a magnet array behind the target. The target support is configured to move the sputtering surface of the target by rotating or spinning the target in the plane of the sputtering surface, moving the target linearly back-and-forth or otherwise. The target support is configured to move the target relative to the magnetic field source, which may be stationary during sputtering, e.g., relative to the cathode assembly and vacuum chamber in which the sputtering is performed. A sputtering system including such a cathode assembly also is provided. A method of sputtering is further provided, employing such a cathode assembly.

公开(公告)号：US11479847B2

公开(公告)日：2022-10-25

申请号：US17070049

申请日：2020-10-14

申请人： Alluxa, Inc.

发明人： Michael A. Scobey ,  Shaun Frank McCaffery

IPC分类号： C23C14/35 ,  H01J37/32 ,  H01J37/34 ,  C23C14/34

摘要： A magnetron sputtering system includes a substrate mounted within a vacuum chamber. A plurality of cathode assemblies includes a first set of cathode assemblies and a second set of cathode assemblies, and is configured for reactive sputtering. Each cathode assembly includes a target comprising sputterable material and has an at least partially exposed planar sputtering surface. A target support is configured to support the target in the vacuum chamber and rotate the target relative to the vacuum chamber about a target axis. A magnetic field source includes a magnet array. A cathode assemblies controller assembly is operative to actuate the first set of cathode assemblies without actuating the second set of cathode assemblies, and to actuate the second set of cathode assemblies without actuating the first set of cathode assemblies.

公开(公告)号：US11932932B2

公开(公告)日：2024-03-19

申请号：US18048957

申请日：2022-10-24

申请人： Alluxa, Inc.

发明人： Michael A. Scobey ,  Shaun Frank McCaffery

IPC分类号： C23C14/35 ,  H01J37/32 ,  H01J37/34 ,  C23C14/34

CPC分类号： C23C14/351 ,  C23C14/34 ,  C23C14/3464 ,  C23C14/3492 ,  H01J37/32669 ,  H01J37/345 ,  H01J37/3417 ,  H01J37/3444 ,  H01J37/3464

摘要： A magnetron sputtering system includes a substrate mounted within a vacuum chamber. A plurality of cathode assemblies includes a first set of cathode assemblies and a second set of cathode assemblies, and is configured for reactive sputtering. Each cathode assembly includes a target comprising sputterable material and has an at least partially exposed planar sputtering surface. A target support is configured to support the target in the vacuum chamber and rotate the target relative to the vacuum chamber about a target axis. A magnetic field source includes a magnet array. A cathode assemblies controller assembly is operative to actuate the first set of cathode assemblies without actuating the second set of cathode assemblies, and to actuate the second set of cathode assemblies without actuating the first set of cathode assemblies.

公开(公告)号：US20230133160A1

公开(公告)日：2023-05-04

申请号：US18048957

申请日：2022-10-24

申请人： Alluxa, Inc.

发明人： Michael A. Scobey ,  Shaun Frank McCaffery

IPC分类号： C23C14/35 ,  H01J37/32 ,  H01J37/34 ,  C23C14/34

摘要： A magnetron sputtering system includes a substrate mounted within a vacuum chamber. A plurality of cathode assemblies includes a first set of cathode assemblies and a second set of cathode assemblies, and is configured for reactive sputtering. Each cathode assembly includes a target comprising sputterable material and has an at least partially exposed planar sputtering surface. A target support is configured to support the target in the vacuum chamber and rotate the target relative to the vacuum chamber about a target axis. A magnetic field source includes a magnet array. A cathode assemblies controller assembly is operative to actuate the first set of cathode assemblies without actuating the second set of cathode assemblies, and to actuate the second set of cathode assemblies without actuating the first set of cathode assemblies.