Virtual data center environmental monitoring system

    公开(公告)号:US10228292B2

    公开(公告)日:2019-03-12

    申请号:US15583905

    申请日:2017-05-01

    Abstract: A virtual temperature monitoring system in a data center communicates with servers mounted in racks to receive internal temperature data generated by internal temperature sensors of the servers. The system derives a virtual sensor measurement of external temperatures external to the server, including a portion of a cold aisle that extends proximate to a rack in which the server is mounted, based upon a relationship between the received internal temperature sensors and the external environment. Sensor data from other sensors can be received via a building management system, and building management signals to the building management system can be generated based at least partially on the virtual sensor data. The virtual sensor data can be used to generate a graphical representation of the servers that highlights relative thermal characteristics of the servers based on the virtual external sensor measurements, including heat indices, excursions beyond thresholds, historical excursion histories, etc.

    Passive roof exhausting system
    85.
    发明授权

    公开(公告)号:US10088181B2

    公开(公告)日:2018-10-02

    申请号:US14971793

    申请日:2015-12-16

    Abstract: A system for passively exhausting air from a structure includes at least one pair of modules arranged on a roof of the structure. Each module has an exhaust face on one side and a sloped surface on the opposite side, and can receive exhaust air that flows upward from inside the structure. The modules can be arranged in pairs facing one another, with one of the sloped surfaces facing a direction of an environmental flow of air, so that the environmental air can flow up the sloped surface of one module and down the sloped surface of the other module without impinging on the exhaust faces of either module. The pairs can also be arranged side-by-side in an array, which can be expanded with additional pairs of modules to exhaust from the structure at a greater rate.

    Multi-input uninterruptible power system

    公开(公告)号:US09997955B1

    公开(公告)日:2018-06-12

    申请号:US14934056

    申请日:2015-11-05

    CPC classification number: H02J9/06

    Abstract: A multi-input uninterruptible power system (UPS) includes a primary power circuit, a secondary power circuit, and a diode circuit. The primary power circuit and the secondary power circuit include rectifiers that convert AC power into DC power. A diode circuit is electrically coupled between the secondary power circuit and an internal bus of the multi-input UPS. The diode circuit prevents backflow of power into the secondary power circuit when electrical power is received from a primary power source electrically coupled to the primary power circuit and allows electrical power from a secondary power source electrically coupled to the secondary power circuit to flow to the internal bus when electrical power is not being received from the primary power source. An outlet of the multi-input UPS electrically coupled to the internal bus is electrically coupled to a group of electrical loads of multiple groups of electrical loads in a data center.

    Modular data center row infrastructure

    公开(公告)号:US09888614B1

    公开(公告)日:2018-02-06

    申请号:US15167742

    申请日:2016-05-27

    CPC classification number: H05K7/20736 H05K7/20145 H05K7/20745

    Abstract: A data center row infrastructure module enables rapid deployment of a computing room enclosure for computer systems that provides intake air circulation to, and exhaust air removal from, the computer systems in the enclosure. The data center row infrastructure module includes free-standing exhaust plenum structures encompassing opposite sides of the enclosure and a plenum module spanning a top end of the enclosure between the free-standing exhaust plenum structures. Each free-standing exhaust plenum structure includes an internal exhaust air plenum that directs exhaust air received from the enclosure through an exhaust air outlet on a top end of the free-standing exhaust plenum structure. The plenum module establishes a bottom end of a cooling air plenum above and separate from the enclosure and between the free-standing exhaust plenum structures. Some plenum modules can direct cooling air directly to the enclosure as intake air. Some plenum modules can mix cooling air with recirculated exhaust to provide the intake air.

    MOBILE DEVICE TEST INFRASTRUCTURE
    89.
    发明申请

    公开(公告)号:US20170366991A1

    公开(公告)日:2017-12-21

    申请号:US15694827

    申请日:2017-09-03

    CPC classification number: H04W24/08 H04M1/24 H04M1/72577 H04W4/60 H04W24/06

    Abstract: A mobile device test module enables a remote client to execute client-developed mobile device applications on a mobile device, via a communication network, to test application performance on the mobile device. The module includes a host compute board which establishes a device communication link, which can include a wireless link, with a mobile device mounted in the module and generates commands to the mobile device based on signals received at the board. The module restricts the host compute board and mobile device to device communication links between each other. The module housing can restrict device communication links with devices external to the module. The module can be installed in a slot of a chassis which can provide structural, power, and communication support to the module. The chassis includes interface clusters which each can support various modules installed in the slots and can support redundant links with an installed module.

    Rack cooling system
    90.
    发明授权

    公开(公告)号:US09820409B1

    公开(公告)日:2017-11-14

    申请号:US14868280

    申请日:2015-09-28

    CPC classification number: H05K7/20736

    Abstract: A rack cooling system includes a plurality of electronic devices mounted in a rack and a plurality of shared rack-level fans arranged in an array and coupled to a rack. A fan controller receives one or more condition signals indicating thermal conditions in the electronic devices and generates a plurality of control signals for controlling the shared rack-level fans. The fan controller generates the plurality of control signals based on respective thermal conditions in respective electronic devices in respective positions in the rack and the plurality of control signals causes different respective groups of one or more shared rack-level fans in different locations in the array to induce air flow through the electronic devices, wherein separate ones of the two or more groups of one or more shared rack-level fans operate at different speeds or angles.

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