External cavity semiconductor laser and method for fabrication thereof
    72.
    发明申请
    External cavity semiconductor laser and method for fabrication thereof 审中-公开
    外腔半导体激光器及其制造方法

    公开(公告)号:US20080285601A1

    公开(公告)日:2008-11-20

    申请号:US11983843

    申请日:2007-11-13

    Abstract: The present invention concerns a design for an external cavity single mode laser wherein a short optical path length for the optical cavity (e.g., ˜3 to 25 mm) provides sufficient spacing of the longitudinal modes allowing a single wavelength selective element, such as a microfabricated etalon, to provide a single mode of operation, and optionally a selectable mode of operation.

    Abstract translation: 本发明涉及一种外腔单模激光器的设计,其中用于光学腔的短光程长度(例如〜3至25mm)提供纵向模式的足够间隔,允许单个波长选择元件,例如微加工 标准具,以提供单一操作模式,以及可选的可选择的操作模式。

    Micro-optical device
    73.
    发明授权
    Micro-optical device 有权
    微光器件

    公开(公告)号:US07352924B2

    公开(公告)日:2008-04-01

    申请号:US11545908

    申请日:2006-10-11

    CPC classification number: G02B6/422 G02B6/30 G02B6/421 G02B6/4225 G02B6/4246

    Abstract: The present invention provides a micro-optical device which may be used as an optical pigtailing assembly for waveguides. In an exemplary configuration the assembly includes a first chip which includes an optoelectronic component and an optical fiber. The optical fiber and optoelectronic component are coupled with an optical component, such as one or more waveguides on an integrated optic chip.

    Abstract translation: 本发明提供一种微型光学装置,其可以用作波导的光纤尾纤组件。 在示例性配置中,组件包括包括光电子部件和光纤的第一芯片。 光纤和光电子部件与诸如集成光学芯片上的一个或多个波导的光学部件耦合。

    Optical interface assembly and method of formation
    74.
    发明授权
    Optical interface assembly and method of formation 有权
    光接口装配及形成方法

    公开(公告)号:US07292756B2

    公开(公告)日:2007-11-06

    申请号:US11020520

    申请日:2004-12-22

    Abstract: Optical interface assemblies are provided. The optical interface assemblies include a first portion having a plurality of optical waveguides. The first portion is configured for mating engagement with an optical fiber connector. A second portion is mated to the first portion. The second portion is configured for mating engagement with an electronic substrate that includes an embedded waveguide assembly. The first and second portions are further configured so as to align the plurality of optical waveguides, at a first end of the first portion, with a plurality of corresponding waveguide cores of the embedded waveguide assembly. The first and second portions are further configured so as to align the plurality of optical waveguides, at a second end of the first portion, with a plurality of corresponding optical fibers in the optical fiber connector. Also provided are electronic assemblies and methods for coupling optical fibers with electronic substrate embedded waveguides.

    Abstract translation: 提供光学接口组件。 光学接口组件包括具有多个光波导的第一部分。 第一部分被配置为与光纤连接器配合接合。 第二部分与第一部分配合。 第二部分被配置为与包括嵌入式波导组件的电子基板配合接合。 第一和第二部分进一步配置成在第一部分的第一端处与多个对应的嵌入式波导组件的对应波导芯对准多个光波导。 所述第一和第二部分进一步配置成在所述第一部分的第二端与所述光纤连接器中的多个对应的光纤对准所述多个光波导。 还提供了用于将光纤与电子衬底嵌入式波导耦合的电子组件和方法。

    Optical device package
    79.
    发明授权
    Optical device package 有权
    光器件封装

    公开(公告)号:US06932519B2

    公开(公告)日:2005-08-23

    申请号:US09966973

    申请日:2001-09-28

    Abstract: An optical device package includes a substrate having a top portion with an a recess for receiving an optical semiconductor component and an elongated linear groove for receiving an optical fiber. The optical fiber is positioned within the groove in the substrate such that the tap surface of the optical fiber is substantially at or below the upper surface of the substrate and the optical fiber is operatively aligned with the optical semiconductor component for the transfer of optical signals therebetween. A frame is hermetically sealed to the upper surface of the substrate.

    Abstract translation: 光学器件封装包括具有顶部的基板,该顶部具有用于接收光学半导体部件的凹部和用于接收光纤的细长直线槽。 光纤位于衬底中的槽内,使得光纤的抽头表面基本上在衬底的上表面上或下方,并且光纤与光半导体部件可操作地对准以在其间传输光信号 。 框架被密封到基板的上表面。

    Optical switch and method for making
    80.
    发明授权
    Optical switch and method for making 失效
    光开关及制作方法

    公开(公告)号:US06870981B2

    公开(公告)日:2005-03-22

    申请号:US09828842

    申请日:2001-04-10

    CPC classification number: G02B6/3506 G02B6/25 G02B6/3552 G02B6/3863

    Abstract: A method for constructing an optical switch and the switch constructed thereby are described. An optical switch having a pair of chips is assembled with a plurality of optical fibers mounted on the chips such that endfaces of the fibers extend beyond ends of the chips. The optical fibers may be mounted by adhering them to the chips. The endfaces of the fibers and the front surfaces of the chips are then polished to provide coplanar surfaces which are good optical couplers. The chips are then etched with an etchant material which is ineffective at etching the optical fibers. The chips may include a coating which is resistant to the etchant material.

    Abstract translation: 对构成光开关的方法和由此构成的开关进行说明。 具有一对芯片的光学开关与安装在芯片上的多个光纤组装,使得光纤的端面延伸超过芯片的端部。 光纤可以通过将它们粘附到芯片来安装。 然后将纤维的端面和芯片的前表面抛光以提供共面,这是良好的光耦合器。 然后用蚀刻剂材料蚀刻芯片,这在蚀刻光纤时无效。 芯片可以包括耐腐蚀剂材料的涂层。

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