公开(公告)号：US20170340093A1

公开(公告)日：2017-11-30

申请号：US15166204

申请日：2016-05-26

Applicant: Apple Inc.

Inventor： Javier Mendez ,  Craig M. Stanley ,  Tyler S. Bushnell

IPC: A45F5/00

CPC classification number: A45F5/00 ,  A45F2005/006 ,  A45F2005/008 ,  A45F2200/0508 ,  A45F2200/0516 ,  A45F2200/055

Abstract: Disclosed herein is a securement apparatus, such as a lanyard, that has increased tensile strength and shear strength when compared with a conventional securement apparatus. The securement apparatus includes a connector extending from a connector body, a strap coupled to the connector body, and a structural component. The structural component has a tapered geometry such that a first end that is contained within the connector body has a first width and/or height and a second end that transitions from the connector body into the strap has a second width and/or height that is less than the first width and/or height.

公开(公告)号：US09682500B2

公开(公告)日：2017-06-20

申请号：US14108148

申请日：2013-12-16

Applicant: Apple Inc.

Inventor： Craig M. Stanley

IPC: B29C45/14 ,  B29C45/16 ,  B29L31/34

CPC classification number: B29C45/14065 ,  B29C45/1635 ,  B29C45/1671 ,  B29L2031/3425 ,  Y10T428/23 ,  Y10T428/239

Abstract: The embodiments described herein relate to insert molding methods. The methods involve partially or fully encasing an insert within a thermoplastic material, forming a composite part that includes the insert and the molded thermoplastic material. Methods described provide a number of improvements over traditional insert molding techniques. In specific embodiments, a two-shot molding process is used whereby a first shot is formed on a first portion of the insert and a second shot is formed on a second portion of the insert. The insert molding processes can be performed using a single mold during the first and second injection molding processes.

公开(公告)号：US09666967B2

公开(公告)日：2017-05-30

申请号：US14444424

申请日：2014-07-28

Applicant: Apple Inc.

Inventor： Nathan P. Bosscher ,  Craig M. Stanley ,  Trent K. Do ,  John J. Baker ,  Phillip M. Hobson ,  Brad G. Boozer

IPC: H01R12/73 ,  H05K3/36 ,  H01R35/04 ,  H01R12/72

CPC classification number: H01R12/732 ,  H01R12/722 ,  H01R35/04 ,  H05K1/038 ,  H05K1/14 ,  H05K1/148 ,  H05K3/36 ,  H05K2201/09027 ,  H05K2201/10189

Abstract: A mesh network of printed circuit boards (PCBs) including a first PCB coupled to a second rigid PCB by way of an interlocking connection is provided. The interlocking connection has a degree of freedom that allows the first and second PCBs to form a twist angle between each other; the interlocking connector configured to provide electrical coupling between active components disposed in each of the first and second PCBs. A method of forming a substrate fabric including a mesh network as above is also provided. Further provided is a method of activating the mesh network of printed circuit boards as above.

公开(公告)号：US09560749B2

公开(公告)日：2017-01-31

申请号：US14216916

申请日：2014-03-17

Applicant: Apple Inc.

Inventor： Craig M. Stanley ,  Phillip Qian ,  Erik L. Wang

IPC: H05K1/16 ,  H05K1/02 ,  H05K3/28 ,  H05K1/11 ,  H05K1/14 ,  H05K3/46

CPC classification number: H05K1/028 ,  H05K1/0278 ,  H05K1/11 ,  H05K1/118 ,  H05K1/14 ,  H05K1/147 ,  H05K1/148 ,  H05K3/284 ,  H05K3/4691 ,  H05K2201/10053 ,  H05K2203/1316

Abstract: An electronic device may have circuitry mounted on a printed circuit board. The circuitry may include electronic components such as integrated circuits, sensors, and switches that are sensitive to bending-induced stress in the printed circuit board. An overmolded plastic stress concentrator may be overmolded over the printed circuit board and the circuitry on the printed circuit board. A flexible plastic body may be used to enclose the stress concentrator and printed circuit board. The plastic body, stress concentrator, and printed circuit board may be elongated along a longitudinal axis. The stress concentrator may have unbent regions in which the printed circuit board is prevented from flexing and enhanced flexibility regions. Sensitive circuitry may be located in the unbent regions to prevent the sensitive circuitry from being exposed to bending stress.

Abstract translation: 电子设备可以具有安装在印刷电路板上的电路。 该电路可以包括对印刷电路板中的弯曲引起的应力敏感的电子部件，例如集成电路，传感器和开关。 包覆成型的塑料应力集中器可以在印刷电路板和印刷电路板上的电路上包覆成型。 柔性塑料体可用于封闭应力集中器和印刷电路板。 塑料体，应力集中器和印刷电路板可以沿着纵向轴线伸长。 应力集中器可以具有其中防止印刷电路板弯曲和增强柔性区域的未吸附区域。 敏感电路可以位于未吸附区域中，以防止敏感电路暴露于弯曲应力。

公开(公告)号：US20150264798A1

公开(公告)日：2015-09-17

申请号：US14216916

申请日：2014-03-17

Applicant: Apple Inc.

Inventor： Craig M. Stanley ,  Phillip Qian ,  Erik L. Wang

IPC: H05K1/02

CPC classification number: H05K1/028 ,  H05K1/0278 ,  H05K1/11 ,  H05K1/118 ,  H05K1/14 ,  H05K1/147 ,  H05K1/148 ,  H05K3/284 ,  H05K3/4691 ,  H05K2201/10053 ,  H05K2203/1316

Abstract: An electronic device may have circuitry mounted on a printed circuit board. The circuitry may include electronic components such as integrated circuits, sensors, and switches that are sensitive to bending-induced stress in the printed circuit board. An overmolded plastic stress concentrator may be overmolded over the printed circuit board and the circuitry on the printed circuit board. A flexible plastic body may be used to enclose the stress concentrator and printed circuit board. The plastic body, stress concentrator, and printed circuit board may be elongated along a longitudinal axis. The stress concentrator may have unbent regions in which the printed circuit board is prevented from flexing and enhanced flexibility regions. Sensitive circuitry may be located in the unbent regions to prevent the sensitive circuitry from being exposed to bending stress.

Abstract translation: 电子设备可以具有安装在印刷电路板上的电路。 该电路可以包括对印刷电路板中的弯曲引起的应力敏感的电子部件，例如集成电路，传感器和开关。 包覆成型的塑料应力集中器可以在印刷电路板和印刷电路板上的电路上包覆成型。 柔性塑料体可用于封闭应力集中器和印刷电路板。 塑料体，应力集中器和印刷电路板可以沿着纵向轴线伸长。 应力集中器可以具有其中防止印刷电路板弯曲和增强柔性区域的未吸附区域。 敏感电路可以位于未吸收区域中，以防止敏感电路暴露于弯曲应力。

公开(公告)号：US20150078611A1

公开(公告)日：2015-03-19

申请号：US14027808

申请日：2013-09-16

Applicant: Apple Inc.

Inventor： Brad G. Boozer ,  Craig M. Stanley ,  John J. Baker ,  Nathan P. Bosscher ,  Phillip Hobson

IPC: H04R7/04 ,  H04R31/00

CPC classification number: H04R31/003 ,  H04R7/20 ,  H04R2499/11 ,  H04R2499/15 ,  Y10T29/49005

Abstract: A joint speaker surround and gasket. The speaker surround of the joint speaker surround and gasket is formed of a surround material and has an inner edge defining a speaker cone aperture shaped to match a speaker cone and an outer edge portion shaped to match a housing. The gasket of the joint speaker surround and gasket is formed of a gasket material. The gasket is integrally bonded to the outer edge portion of the speaker surround.

Abstract translation: 联合扬声器环绕和垫圈。 联合扬声器环绕的扬声器环绕和垫圈由环绕材料形成，并且具有限定扬声器锥形孔的内边缘，其形状以匹配扬声器锥体和形状匹配壳体的外边缘部分。 接头扬声器的垫圈环绕，衬垫由衬垫材料形成。 垫圈一体地结合到扬声器环绕的外边缘部分。