公开(公告)号：US4358175A

公开(公告)日：1982-11-09

申请号：US202918

申请日：1980-11-03

申请人： Gilbert R. Reid

发明人： Gilbert R. Reid

IPC分类号： H01R12/50 ,  H01R12/82 ,  H01R13/24 ,  H05K7/10 ,  H01R23/72

CPC分类号： H05K7/1007 ,  H01R12/82 ,  H01R13/24

摘要： The present disclosure describes a low insertion force connector for use with integrated circuit (IC) packages of the LSI/VLSI type. The connector is characterized by simplicity of design and economy of manufacture. The well known friction-type contact comprised of members which enclose and bear against the pin surface is replaced by a pin-receiving cup loosely fitted in a cavity in the connector body and supported by one extremity of a light spring member. The opposite extremity of the latter may include an integral tail section or a separate solder or wire wrap tail may be affixed thereto. The force required to seat the IC package in the connector is a function of the spring compressive forces and may be made quite low. Removal force for the package is virtually zero. Additionally, a ramp section in the connector is adapted to receive a wedge-like member which bears against the outer surface of the IC package and causes the gradual collapse of the contact springs as the package is seated.

摘要翻译： 本公开描述了一种用于LSI / VLSI类型的集成电路（IC）封装的低插入力连接器。 连接器的特点是设计简单，制造经济。 众所周知的摩擦式接触件，其包围并承受销表面的构件由松动地装配在连接器主体中的空腔中并由轻弹簧构件的一个末端支撑的销接收杯代替。 后者的相对末端可以包括整体尾部，或者可以将单独的焊料或线缠绕尾部固定到其上。 将IC封装安装在连接器中所需的力是弹簧压缩力的函数，并且可以变得相当低。 包装的去除力几乎为零。 此外，连接器中的斜坡部分适于容纳楔形构件，该楔形构件承载在IC封装的外表面上，并且当封装就位时导致接触弹簧的逐渐崩溃。

公开(公告)号：US4348071A

公开(公告)日：1982-09-07

申请号：US158502

申请日：1980-06-11

申请人： Shao-Chung Hsieh

发明人： Shao-Chung Hsieh

IPC分类号： H01R12/50 ,  H01R12/62 ,  H01R12/71 ,  H01R12/79 ,  H01R12/82 ,  H05K3/36 ,  H01R13/62

CPC分类号： H01R12/62 ,  H01R12/79 ,  H01R12/82 ,  H01R12/714 ,  H05K3/365

摘要： A connector (10) for mating a flexible printed circuit (48) to a printed circuit board (50) comprises a housing (12) and a spring (14) which is translatably disposed in a cavity (16) of the housing. The cavity (16) has an outer entrance portion (18) in which the spring (14) is temporarily retained while it receives the flexible printed circuit (48) and the printed circuit board (50). The spring (14), the flexible printed circuit (48) and the printed circuit board (50) are then moved into a reduced inner portion (20) of the cavity (16) to increase the spring forces acting on the flexible printed circuit (48) and the printed circuit board (50).

摘要翻译： 用于将柔性印刷电路（48）配合到印刷电路板（50）的连接器（10）包括壳体（12）和可平移地设置在壳体的空腔（16）中的弹簧（14）。 空腔（16）具有外部入口部分（18），弹簧（14）在容纳柔性印刷电路（48）和印刷电路板（50）的同时临时保持在其中。 弹簧（14），柔性印刷电路（48）和印刷电路板（50）然后被移动到空腔（16）的减小的内部部分（20）中，以增加作用在柔性印刷电路 48）和印刷电路板（50）。

公开(公告)号：US4298237A

公开(公告)日：1981-11-03

申请号：US105501

申请日：1979-12-20

申请人： Gary L. Griffith ,  Charles J. Sherman

发明人： Gary L. Griffith ,  Charles J. Sherman

IPC分类号： H01R12/82 ,  H01R13/44 ,  H01R24/58 ,  H05K1/11 ,  H01R13/64

CPC分类号： H01R12/82 ,  H05K1/117 ,  H01R13/44 ,  H01R2107/00 ,  H01R24/58 ,  H05K2201/09409 ,  H05K2201/2027 ,  H05K2203/0594

摘要： Interconnection apparatus for electrically connecting the contact areas (22) of a printed wiring board (20) and the contact springs (e.g., 33, 34) of a backplane (10) for increasing the board terminations without increasing the width of the board leading edge (21). A coordinate array of contact areas (22) is provided at least on one side of the leading portion of the board (20) which corresponds to an array of contacting surfaces of the springs (e.g., 33, 34) extending from a backplane (10). A mask (e.g., 23) having an array of apertures (24) corresponding to the contact area array overlies the leading portion (21) of the board (20). The mask apertures (e.g., 24) are individually dimensioned and formed within the array rows to accept therethrough only correspondingly formed individual contact springs (e.g., 33, 34) of the spring rows. Accordingly, as the board (20) is inserted in opposition to the contact springs, individual ones of the latter can only make electrical contact with their corresponding board (20) contact areas (22) when the board is fully inserted, the spring and contact area mating then occurring simultaneously.

摘要翻译： 用于电连接印刷电路板（20）的接触区域（22）和背板（10）的接触弹簧（例如，33,34）的互连装置，用于增加电路板端接而不增加电路板前缘的宽度 （21）。 接触区域（22）的坐标阵列设置在板（20）的引导部分的至少一侧，其对应于从底板（10）延伸的弹簧（例如，33,34）的接触表面的阵列 ）。 具有对应于接触区域阵列的孔阵列（24）的掩模（例如23）覆盖在板（20）的引导部分（21）上。 掩模孔（例如，24）分别尺寸设计并形成在阵列行内，从而仅通过弹簧列的对应形成的单独的接触弹簧（例如，33,34）来接纳。 因此，当板（20）相对于接触弹簧插入时，后者中的各个仅当板完全插入时才能与其对应的板（20）接触区域（22）电接触，弹簧和触点 区域交配然后同时发生。

公开(公告)号：US3407379A

公开(公告)日：1968-10-22

申请号：US59082666

申请日：1966-10-31

申请人： TAIYO YUDEN KABUSHIKIKAISHA

发明人： MORIMITSU NAKAZAWA ,  TOKUSHIGE SATO

IPC分类号： H01R12/82

CPC分类号： H01R12/82

公开(公告)号：US3336434A

公开(公告)日：1967-08-15

申请号：US34202164

申请日：1964-02-03

申请人： THOMAS & BETTS CORP

发明人： CRIMMINS DAVID J

IPC分类号： H01R12/61 ,  H01R12/82 ,  H02B1/00 ,  H05K3/32

CPC分类号： H01R12/61 ,  H01R12/616 ,  H01R12/82

公开(公告)号：US20230014898A1

公开(公告)日：2023-01-19

申请号：US17955210

申请日：2022-09-28

申请人： Intel Corporation

发明人： Phil Geng ,  Jordan Johnson ,  Mengqi Liu ,  Ralph Miele ,  Min Pei

IPC分类号： H01R12/70 ,  H01R12/82 ,  H01R43/26 ,  H05K7/14

摘要： Methods, apparatus, systems, and articles of manufacture to improve pin contact are disclosed. An apparatus disclosed herein includes a back plate, a circuit board disposed between the back plate and a socket, and a spring sheet disposed between the back plate and the circuit board.

公开(公告)号：US20220328994A1

公开(公告)日：2022-10-13

申请号：US17666626

申请日：2022-02-08

申请人： JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED

发明人： Tetsuya KOMOTO ,  Akira KIMURA ,  Keisuke NAKAMURA

IPC分类号： H01R12/82 ,  H01R12/71 ,  H01R13/20

摘要： A connector is mateable with a mating connector. The connector comprises a housing and a terminal. The terminal has an arm, a contact portion and a held portion held by a holding portion of the housing. The arm couples the held portion and the contact portion to each other and supports the contact portion so that the contact portion is movable. The contact portion has a bottom portion, a first support portion, a second support portion, a first contact point and a second contact point. Each of the first support portion and the second support portion extends upward from the bottom portion. The first contact point is supported by the first support portion. The second contact point is supported by the second support portion. Under a mated state, a mating terminal of the mating connector is sandwiched and held between the first contact point and the second contact point.

公开(公告)号：US11109477B2

公开(公告)日：2021-08-31

申请号：US16900094

申请日：2020-06-12

申请人： FUDING PRECISION COMPONENTS (SHENZHEN) CO., LTD. ,  FOXCONN INTERCONNECT TECHNOLOGY LIMITED

发明人： Heng-Kang Wu ,  Gong-Cheng Liu ,  Fu-Jin Peng

IPC分类号： H05K1/02 ,  H05K1/18 ,  H01R12/82

摘要： A fastening mechanism for retaining a heat sink upon the CPU includes a fastening seat surrounding the connector, and a pair of fastening clips. The fastening seat includes four alignment posts at four corners, and the pair of fastening clips are attached at two corresponding diagonal corners. Each fastening clip includes a mounting section secured to the corresponding post, a latching section for temporarily holding the heat sink, and a resilient arm for upwardly urging the heat sink. Each alignment post is equipped with a screw nut and a coil spring so as to reinforce the downward pressing forces against the heat sink for assuring reliable connection between the CPU and the contacts of the electrical connector for better electrical transmission and intimate contact between the CPU and the heat sink for efficient heat dissipation.

公开(公告)号：US20200313322A1

公开(公告)日：2020-10-01

申请号：US16901789

申请日：2020-06-15

申请人： Johnstech International Corporation

发明人： Jeffrey Sherry ,  Michael Andres

IPC分类号： H01R12/70 ,  H01R12/82 ,  G01R1/04 ,  G01R31/28 ,  H01R13/24

摘要： A test socket (14) for a testing an integrated circuit (12) with controlled impedance while maintaining the structural integrity of the test pins (20). The pin (20) can have a sidewall with a thick portion 32 and a thinner portion (30) along the length of the pin. The pin can have projections (42) which provide a standoff from the slot (40). The sidewalls themselves can have projections or lands (60, 61) which extend into the slot and provide stability for the pin (20).

公开(公告)号：US20190173209A1

公开(公告)日：2019-06-06

申请号：US16210966

申请日：2018-12-05

申请人： Amphenol East Asia Ltd.

发明人： Lo-Wen Lu ,  Jong-Shiun Jiang ,  Chia-Te Huang

IPC分类号： H01R12/71 ,  H01R12/70 ,  H01R12/50 ,  H01R12/82

CPC分类号： H01R12/716 ,  H01R12/00 ,  H01R12/7005 ,  H01R12/73 ,  H01R12/82 ,  H01R13/405 ,  H01R13/6599

摘要： A compact, high performance electrical connector with a smooth insertion loss profile over a broad range of operating frequencies. The electrical connector has a mating interface with a slot that may receive a mating component, such as a paddle card of a plug connector. Rows of terminals line opposing sides of the slots. Terminals in each of the rows may be held together by an insulative seat body shaped to receive on side of a lossy member. The lossy member may have extension parts extending towards selected ones of the terminals in the rows that act as ground terminals, such that the lossy member is electrically coupled to the ground terminals and electrically isolated from the signal terminals. The connector, even though compact, may be easily assembly by first forming terminal subassemblies comprising two rows of terminals and lossy member, and then inserting the terminal subassemblies into an insulative body.