公开(公告)号：US4914259A

公开(公告)日：1990-04-03

申请号：US311838

申请日：1989-02-16

Applicant: Kenzo Kobayashi ,  Hirokazu Shiroishi

Inventor： Kenzo Kobayashi ,  Hirokazu Shiroishi

IPC: H05K1/00 ,  H05K3/00 ,  H05K3/28 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K3/0058 ,  H05K3/306 ,  H05K3/3415 ,  H05K1/0393 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10575 ,  H05K2201/10636 ,  H05K2201/10863 ,  H05K2201/10977 ,  H05K2201/2036 ,  H05K2203/1327 ,  H05K2203/1572 ,  H05K3/28 ,  H05K3/3447 ,  Y02P70/611 ,  Y02P70/613

Abstract: A molded circuit board formed by molding a resin substrate to one side of a circuit film made by forming a desired circuit pattern to an insulating film in a manner to form an integral body. In the circuit film, there are provided soldering pad regions for mounting surface-mounting parts in a surface of the circuit film opposite the other surface in contact with resin substrate and through-holes at locations of the circuit film where insert-mounting parts are mounted. In the resin substrate, holes for receiving insert-mounting parts are formed in the molding process at the locations corresponding to the through-holes of the circuit film.

公开(公告)号：US4709302A

公开(公告)日：1987-11-24

申请号：US942097

申请日：1986-12-16

Applicant: William D. Jordan ,  Donald L. Clemens

Inventor： William D. Jordan ,  Donald L. Clemens

IPC: H01L23/32 ,  H05K1/18 ,  H05K3/30 ,  H05K7/12 ,  H05K7/20

CPC classification number: H05K3/306 ,  H01R12/7005 ,  H05K7/12 ,  H05K2201/10424 ,  H05K2201/10704 ,  H05K2201/10863 ,  H05K3/301

Abstract: Disclosed is apparatus for mounting electronic device packages and heat sinks on printed circuit boards with the pin connectors of the electronic device package held in alignment with preformed locations on the printed circuit boards. The alignment apparatus includes means for securing the electronic device package in intimate thermal contact with the heat sink for rapid dissipation of heat therefrom.

Abstract translation: 公开了用于将电子设备封装和散热器安装在印刷电路板上的装置，其中电子器件封装的引脚连接器与印刷电路板上的预先形成的位置保持一致。 对准装置包括用于固定电子装置包装件与散热器紧密热接触的装置，用于从其快速散发热量。

公开(公告)号：US3718876A

公开(公告)日：1973-02-27

申请号：US3718876D

申请日：1972-03-15

Applicant: BELL TELEPHONE LABOR INC

Inventor： FLETCHER R

IPC: H01H67/24 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34 ,  H05K3/36 ,  H01H67/30

CPC classification number: H01H67/24 ,  H05K1/0271 ,  H05K1/116 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K3/3447 ,  H05K3/363 ,  H05K2201/049 ,  H05K2201/09063 ,  H05K2201/10863

Abstract: A flexible membrane is disclosed which extends over an aperture in a support plate in an electromagnetic sealed contact matrix or ferreed type switch. The ferreed switch includes at least one circuit path element and the flexible membrane joins the circuit path element to the support plate and extends the circuit path element over the aperture to a point of rigid contact with a conductor lead projecting from an associated sealed contact switch.

Abstract translation: 公开了一种柔性膜，其在电磁密封接触矩阵或惯性型开关中的支撑板上的孔上延伸。 铁路开关包括至少一个电路路径元件，并且柔性膜将电路路径元件连接到支撑板，并且将电路路径元件延伸到孔上方到与从相关联的密封触点开关突出的导体引线刚性接触的点。

公开(公告)号：US3524108A

公开(公告)日：1970-08-11

申请号：US3524108D

申请日：1967-12-26

Applicant: CTS CORP

Inventor： ENGLISH JACK A

IPC: H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K7/06 ,  H05K7/12

CPC classification number: H05K3/306 ,  H05K3/308 ,  H05K3/32 ,  H05K3/3447 ,  H05K2201/09827 ,  H05K2201/10454 ,  H05K2201/10484 ,  H05K2201/10568 ,  H05K2201/10696 ,  H05K2201/10757 ,  H05K2201/10863 ,  H05K2201/10878 ,  H05K2201/2036