公开(公告)号：US08348845B2

公开(公告)日：2013-01-08

申请号：US12516384

申请日：2007-11-22

Applicant: Atsushi Ninomiya ,  Yoshimi Kasai ,  Masaru Inoue

Inventor： Atsushi Ninomiya ,  Yoshimi Kasai ,  Masaru Inoue

IPC: A61B8/00

CPC classification number: A61B8/00 ,  A61B8/4405 ,  A61B8/462 ,  A61B8/467 ,  G01S7/52053 ,  G01S7/52082 ,  G01S7/52084 ,  G01S15/899

Abstract: The present invention provides an ultrasonography containing a main body housing having transfer wheels. An operation device having switches, a movable arm to connect the main body housing to the operation device which has an inclined plane inclining rearward from a front face to an upper face; and the movable arm supports the operation device through an elevating function mechanical section to move the operation device.

Abstract translation: 本发明提供一种包含具有转移轮的主体壳体的超声检查。 具有开关的操作装置，将主体外壳连接到具有从前表面向上表面向后倾斜的倾斜面的操作装置的可动臂; 并且可动臂通过升降功能机械部支撑操作装置，以移动操作装置。

公开(公告)号：US08317081B2

公开(公告)日：2012-11-27

申请号：US12907406

申请日：2010-10-19

Applicant: Shogo Ogaki ,  Takashi Ando ,  Masaru Inoue

Inventor： Shogo Ogaki ,  Takashi Ando ,  Masaru Inoue

IPC: B23K31/02

CPC classification number: B23K3/04 ,  B23K1/0016 ,  G11B5/4833

Abstract: A reflow bonding method easily bonds first and second wiring members together by reflowing solder arranged on at least one of first and second bonding parts that are defined on the first and second wiring members, respectively. The method includes positioning the first and second wiring members so that the first and second bonding parts face each other with the solder interposed between them and heating and pressing one of the first and second bonding parts from behind with a pressing face of a heater chip so that the first and second bonding parts lie one on another and so that the solder is heated and reflows to bond the first and second wiring members together.

Abstract translation: 回流焊接方法通过分别在第一和第二布线构件上限定的第一和第二接合部中的至少一个上的回流焊料容易地将第一和第二布线构件接合在一起。 该方法包括：定位第一和第二布线构件，使得第一和第二接合部分彼此面对，并且夹在它们之间的焊料并且用加热器片的按压面从后面加热和加压第一和第二接合部分中的一个，从而 第一和第二接合部分彼此位于一起并且使得焊料被加热并且回流以将第一和第二配线构件结合在一起。

公开(公告)号：US08212582B2

公开(公告)日：2012-07-03

申请号：US13021915

申请日：2011-02-07

Applicant: Masaru Inoue ,  Kunihiko Sasaki ,  Takashi Kurihara ,  Yasuhiro Kume

Inventor： Masaru Inoue ,  Kunihiko Sasaki ,  Takashi Kurihara ,  Yasuhiro Kume

IPC: G01R31/26

CPC classification number: G02F1/1309 ,  G02F2001/136254 ,  G09G3/006 ,  G09G3/3648

Abstract: There is provided a physical property measuring method for a TFT liquid crystal panel, includes an impedance setting step of setting the impedance between the source and drain of a TFT of the TFT liquid crystal panel to be less than or equal to a predetermined value, a voltage application step of applying a voltage that cyclically varies to a liquid crystal layer of the TFT liquid crystal panel. And the method further includes a physical property measuring step of measuring a transient current flowing through the liquid crystal layer to which the voltage that cyclically varies is applied in the voltage application step to measure physical properties of the liquid crystal layer.

Abstract translation: 提供一种用于TFT液晶面板的物理性质测量方法，包括将TFT液晶面板的TFT的源极与漏极之间的阻抗设定为小于或等于预定值的阻抗设定步骤， 施加周期性变化的电压到TFT液晶面板的液晶层的电压施加步骤。 该方法还包括物理性能测量步骤，用于测量在电压施加步骤中施加循环变化的电压的流过液晶层的瞬态电流，以测量液晶层的物理性质。

公开(公告)号：USD656262S1

公开(公告)日：2012-03-20

申请号：US29353544

申请日：2010-01-11

Applicant: Masayuki Yoshinobu ,  Keiichi Shimizu ,  Sumio Hashimoto ,  Masaru Inoue

Designer： Masayuki Yoshinobu ,  Keiichi Shimizu ,  Sumio Hashimoto ,  Masaru Inoue

公开(公告)号：US08042973B2

公开(公告)日：2011-10-25

申请号：US12757623

申请日：2010-04-09

Applicant: Masaru Inoue ,  Keiichi Shimizu ,  Sumio Hashimoto ,  Hirokazu Otake ,  Mitsuhiko Nishiie ,  Takuro Hiramatsu ,  Masatoshi Kumagai

Inventor： Masaru Inoue ,  Keiichi Shimizu ,  Sumio Hashimoto ,  Hirokazu Otake ,  Mitsuhiko Nishiie ,  Takuro Hiramatsu ,  Masatoshi Kumagai

IPC: F21V3/00 ,  F21V5/00

CPC classification number: F21S8/026 ,  F21V7/0083 ,  F21V17/12 ,  F21V23/02 ,  F21V29/763 ,  F21Y2115/10

Abstract: A lighting apparatus comprises a housing and a first reflector. The first reflector is mounted beneath the light source and includes a plurality of segmented reflectors, each having at its top, a installation hole and at its bottom, an opening wider than the installation hole. A second reflector is positioned beneath the first reflector. The height of the second reflector causes a first light shielding angle defined by a straight line passing through the installation hole and the bottom edge of the corresponding segmented reflector to be larger than a second light shielding angle defined by a straight line passing through the bottom edge of the segmented reflector and the bottom edge of the second reflector.

公开(公告)号：US20110121854A1

公开(公告)日：2011-05-26

申请号：US13021915

申请日：2011-02-07

Applicant: Masaru Inoue ,  Kunihiko Sasaki ,  Takashi Kurihara ,  Yasuhiro Kume

Inventor： Masaru Inoue ,  Kunihiko Sasaki ,  Takashi Kurihara ,  Yasuhiro Kume

IPC: G01R31/26

CPC classification number: G02F1/1309 ,  G02F2001/136254 ,  G09G3/006 ,  G09G3/3648

Abstract: There is provided a physical property measuring method for a TFT liquid crystal panel, includes an impedance setting step of setting the impedance between the source and drain of a TFT of the TFT liquid crystal panel to be less than or equal to a predetermined value, a voltage application step of applying a voltage that cyclically varies to a liquid crystal layer of the TFT liquid crystal panel. And the method further includes a physical property measuring step of measuring a transient current flowing through the liquid crystal layer to which the voltage that cyclically varies is applied in the voltage application step to measure physical properties of the liquid crystal layer.

Abstract translation: 提供一种用于TFT液晶面板的物理性质测量方法，包括将TFT液晶面板的TFT的源极与漏极之间的阻抗设定为小于或等于预定值的阻抗设定步骤， 施加周期性变化的电压到TFT液晶面板的液晶层的电压施加步骤。 该方法还包括物理性能测量步骤，用于测量在电压施加步骤中施加循环变化的电压的流过液晶层的瞬态电流，以测量液晶层的物理性质。

公开(公告)号：US20110101076A1

公开(公告)日：2011-05-05

申请号：US12907406

申请日：2010-10-19

Applicant: Shogo OGAKI ,  Takashi Ando ,  Masaru Inoue

Inventor： Shogo OGAKI ,  Takashi Ando ,  Masaru Inoue

IPC: B23K31/02

CPC classification number: B23K3/04 ,  B23K1/0016 ,  G11B5/4833

Abstract: A reflow bonding method easily bonds first and second wiring members together by reflowing solder arranged on at least one of first and second bonding parts that are defined on the first and second wiring members, respectively. The method includes positioning the first and second wiring members so that the first and second bonding parts face each other with the solder interposed between them and heating and pressing one of the first and second bonding parts from behind with a pressing face of a heater chip so that the first and second bonding parts lie one on another and so that the solder is heated and reflows to bond the first and second wiring members together

Abstract translation: 回流焊接方法通过分别在第一和第二布线构件上限定的第一和第二接合部中的至少一个上的回流焊料容易地将第一和第二布线构件接合在一起。 该方法包括：定位第一和第二布线构件，使得第一和第二接合部分彼此面对，并且夹在它们之间的焊料并且用加热器片的按压面从后面加热和加压第一和第二接合部分中的一个，从而 第一和第二接合部分彼此位于一起并且使得焊料被加热并且回流以将第一和第二配线构件结合在一起

公开(公告)号：US07894163B2

公开(公告)日：2011-02-22

申请号：US12318947

申请日：2009-01-13

Applicant: Masaru Inoue ,  Hiroshi Kawamata ,  Hironori Tanaka

Inventor： Masaru Inoue ,  Hiroshi Kawamata ,  Hironori Tanaka

IPC: G11B5/48

CPC classification number: B23K26/0738 ,  B21D11/20 ,  Y10T29/49041

Abstract: Laser beam irradiation areas are provided in a load curve portion and an angle adjustment portion of a suspension. The laser beam irradiation areas are oriented in a direction in which the suspension is to be bent. A laser beam having a predetermined length and a predetermined shape is irradiated onto each laser beam irradiation area.

公开(公告)号：US07722213B2

公开(公告)日：2010-05-25

申请号：US12205460

申请日：2008-09-05

Applicant: Masaru Inoue ,  Keiichi Shimizu ,  Sumio Hashimoto ,  Hirokazu Otake ,  Mitsuhiko Nishiie ,  Takuro Hiramatsu ,  Masatoshi Kumagai

Inventor： Masaru Inoue ,  Keiichi Shimizu ,  Sumio Hashimoto ,  Hirokazu Otake ,  Mitsuhiko Nishiie ,  Takuro Hiramatsu ,  Masatoshi Kumagai

IPC: F21V7/00

CPC classification number: F21S8/026 ,  F21V7/0083 ,  F21V17/12 ,  F21V23/02 ,  F21V29/763 ,  F21Y2115/10

Abstract: A lighting apparatus comprises a housing and a first reflector. The first reflector is mounted beneath the light source and includes a plurality of segmented reflectors, each having at its top, a installation hole and at its bottom, an opening wider than the installation hole. A second reflector is positioned beneath the first reflector. The height of the second reflector causes a first light shielding angle defined by a straight line passing through the installation hole and the bottom edge of the corresponding segmented reflector to be larger than a second light shielding angle defined by a straight line passing through the bottom edge of the segmented reflector and the bottom edge of the second reflector.

Abstract translation: 照明装置包括壳体和第一反射器。 第一反射器安装在光源下方，并且包括多个分段反射器，每个反射器在其顶部具有安装孔，并且在其底部具有比安装孔更宽的开口。 第二反射器位于第一反射器的下方。 第二反射器的高度导致由穿过安装孔和相应的分段反射器的底部边缘的直线限定的第一遮光角度大于由穿过底部边缘的直线限定的第二遮光角度 的分段反射器和第二反射器的底部边缘。

公开(公告)号：US20090236150A1

公开(公告)日：2009-09-24

申请号：US12299577

申请日：2007-04-12

Applicant: Masami Kono ,  Masaru Inoue ,  Koichi Kataoka

Inventor： Masami Kono ,  Masaru Inoue ,  Koichi Kataoka

IPC: G01G19/32 ,  G01G13/16

CPC classification number: G01G19/384 ,  B07C5/30

Abstract: A weighing device includes a weighing unit, a conveying unit, a plurality of discharge parts, a discharging unit and a controlling part. The controlling part is configured to set an order of priority for the discharge parts, to sort the objects weighed by the weighing unit into a plurality of predetermined weight ranks, to select a combination of a plurality of the objects in the same weight rank so that the combination has a total weight equal to a final target weight, and to control the discharging unit to discharge the objects selected for the combination into one of the discharge parts having the highest priority among the discharge parts that are not being used.

Abstract translation: 称重装置包括称重单元，输送单元，多个排出部件，排放单元和控制部件。 控制部被配置为设定排出部的优先顺序，将由称重单元称重的物体分类为多个规定的重量等级，以选择同一重量等级的多个物体的组合，使得 该组合具有等于最终目标重量的总重量，并且控制排出单元将选择的用于组合的物体排放到未被使用的排出部分中具有最高优先权的排放部件中的一个。