Substrate and fabricating method thereof, and display apparatus

    公开(公告)号:US11063070B2

    公开(公告)日:2021-07-13

    申请号:US16611003

    申请日:2019-05-13

    Abstract: A method of fabricating a substrate is provided. The method of fabricating the substrate includes forming a first conductive pattern; forming a first insulating layer, and forming a first blind hole in the first insulating layer; forming a conductive film layer, and removing at least a portion of the conductive film layer in the first blind hole; thinning a portion of the first insulating layer at a bottom of the first blind hole to form a second blind hole; forming an intermediate insulating layer, and forming a second via hole in the intermediate insulating layer; removing the portion of the first insulating layer and forming a first via hole in the first insulating pattern layer; and forming a second conductive pattern. The second conductive pattern directly contacts the first conductive pattern through the first via hole and the second via hole and insulates from the intermediate conductive pattern.

    METHOD AND CONTROLLING APPARATUS FOR CONTROLLING AN APPLICATION OF AN ELECTRONIC APPARATUS

    公开(公告)号:US20180203725A1

    公开(公告)日:2018-07-19

    申请号:US15533450

    申请日:2016-12-23

    Abstract: The present application discloses a controlling apparatus for controlling an application of an electronic apparatus. The controlling apparatus includes a first determination logic configured to determine whether an audio volume level of the electronic apparatus is adjusted lower than a threshold audio volume level; and a termination logic configured to automatically terminate the application based on a determination that the audio volume level of the electronic apparatus is adjusted lower than a threshold audio volume level.

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