COMMUNICATION SYSTEMS HAVING CO-PACKAGED OPTICAL MODULES

    公开(公告)号:US20230161109A1

    公开(公告)日:2023-05-25

    申请号:US17946938

    申请日:2022-09-16

    IPC分类号: G02B6/36 G06F1/16 G02B6/12

    摘要: A system includes a housing that has a front panel; a substrate that is positioned at a distance from the front panel, in which a data processor is mounted on the substrate; and a pluggable module. The pluggable module includes a co-packaged optical module, at least one first optical connector, a first fiber optic cable that is optically coupled between the co-packaged optical module and the first optical connector, and a fiber guide that is positioned between the co-packaged optical module and the first optical connector and provides mechanical support for the co-packaged optical module and the first optical connector. The co-packaged optical module is configured to receive optical signals from the first optical connector, generate electrical signals based on the received optical signals, and transmit the electrical signals to the data processor. The pluggable module has a shape that enables the pluggable module to pass through an opening in the front panel to enable the co-packaged optical module to be coupled to the substrate.

    POLARIZATION-DIVERSITY OPTICAL POWER SUPPLY

    公开(公告)号:US20230083467A1

    公开(公告)日:2023-03-16

    申请号:US17946985

    申请日:2022-09-16

    摘要: An apparatus includes an optical power supply including: a power supply light source configured to generate power supply light; at least one optical input/output port; at least one photodetector; and a coupling module. The coupling module is configured to receive the power supply light from the power supply light source and output the power supply light through the optical input/output port, receive reflected light through the optical input/output port, and transmit the reflected light to the photodetector. The photodetector is configured to detect the reflected light and generate a signal representing a level of the reflected light. The optical power supply includes a controller that is configured to compare the level of the detected reflected light with a threshold value, and upon determining that the level of the detected reflected light is less than the threshold value, reduce or turn off the power supply light that is provided to the optical input/output port.

    Optical fiber-to-chip interconnection

    公开(公告)号:US11567273B2

    公开(公告)日:2023-01-31

    申请号:US17705775

    申请日:2022-03-28

    IPC分类号: G02B6/42

    摘要: Provided is a connector assembly for optically connecting one or more optical fibers and an array of vertical coupling elements of a photonic integrated circuit (PIC). In various embodiments, the connector assembly is constructed to independently optically scale some feature sizes, such as, for example, the transverse mode size, the array size, the array geometry, and/or various incidence angles, the optical scaling being performed, e.g., from a fiber end face plane to a connector-mating plane and further to a PIC coupling plane. In some embodiments, the connector assembly may support a polarization (de)multiplexing functionality.

    COMMUNICATION SYSTEM EMPLOYING OPTICAL FRAME TEMPLATES

    公开(公告)号:US20220337322A1

    公开(公告)日:2022-10-20

    申请号:US17720111

    申请日:2022-04-13

    摘要: An apparatus includes baseband processing circuitry configured to generate a baseband signal that is transmitted to a first network element and a second network element, and an optical power supply configured to generate a first optical signal and a second optical signal, transmit the first optical signal to the first network element, and transmit the second optical signal to the second network element. The first optical signal and the second optical signal include information that enables synchronization of the first and second network elements.

    Optical fiber-to-chip interconnection

    公开(公告)号:US11287585B2

    公开(公告)日:2022-03-29

    申请号:US16816171

    申请日:2020-03-11

    IPC分类号: G02B6/42

    摘要: Provided is a connector assembly for optically connecting one or more optical fibers and an array of vertical coupling elements of a photonic integrated circuit (PIC). In various embodiments, the connector assembly is constructed to independently optically scale some feature sizes, such as, for example, the transverse mode size, the array size, the array geometry, and/or various incidence angles, the optical scaling being performed, e.g., from a fiber end face plane to a connector-mating plane and further to a PIC coupling plane. In some embodiments, the connector assembly may support a polarization (de)multiplexing functionality.