摘要:
A pattern matching method which is capable of selecting a suitable measurement object pattern, even on a sample containing a periodic structure, and a computer program for making a computer execute the pattern matching. In a pattern matching method which executes matching between the design data-based first image of an object sample, and a second image, whether or not a periodic structure is included in a region to execute the matching is determined, so as to select a pattern, based on distance between an original point which is set in said image, and the pattern configuring said periodic structure, in the case where the periodic structure is included in said region, and to select a pattern based on coincidence of the pattern in said image, in the case where the periodic structure is not included in said region, and a computer program product.
摘要:
It is an object of the invention to provide a suitable method for identifying depression/protrusion information in a design data; and a program and an apparatus for the same; for example, even in the case that similar portions are arranged, to provide a method for enabling a pattern matching with high precision between the design data and an image obtained by an image formation apparatus or the like; and a program and an apparatus for the same. To attain the above object, a pattern matching method, wherein, using information concerning a depression and/or a protrusion of the pattern on the design data, or a pattern portion and/or a non-pattern portion on the design data, pattern matching is executed between the pattern on the design data and the pattern on said image; and a program for the same are provided.
摘要:
A pattern inspection apparatus can be provided, for example, in a scanning electron microscope system. When patterns of a plurality of layers are included in a SEM image, the apparatus separates the patterns according to each layer by using design data of the plurality of layers corresponding to the patterns. Consequently, the apparatus can realize inspection with use of only the pattern of a target layer to be inspected, pattern inspection differently for different layers, or detection of a positional offset between the layers.