Electrolytic copper plating solutions
    51.
    发明授权
    Electrolytic copper plating solutions 失效
    电解镀铜溶液

    公开(公告)号:US4490220A

    公开(公告)日:1984-12-25

    申请号:US604917

    申请日:1984-04-27

    申请人: John Houman

    发明人: John Houman

    IPC分类号: C25D3/38

    CPC分类号: C25D3/38

    摘要: Acid copper electroplating solutions containing the reaction product of(A) a compound containing a nitrogen-carbon-sulfur radical of the general structural formula ##STR1## where R.sub.1 and R.sub.2 are alkyl radicals a hydrogen atom or mixtures thereof, or ##STR2## where R.sub.3 is an aromatic, heterocyclic or alicyclic radical or their alkyl derivatives, and(B) a compound of the formulaX--R.sub.1 --(S).sub.n --R.sub.2 --Y where R.sub.1 and R.sub.2 are the same or different and are substituted or unsubstituted alkylene radicals containing 1 to 6 carbon atoms, X is a functional or non-functional moiety, n is 2, 3, 4, or 5, and Y is a water solubilizing group or a group capable of imparting water solubility to the reaction product in a sufficient amount to increase the brightness of the deposit and/or to prevent the formation of cracks during thermal shock. Optionally, an amide of the formula ##STR3## where R is a lower alkyl radical of 1 to 6 carbon atoms, a lower alkylene radical of 1 to 4 carbon atoms, an aromatic radical, or a hydrogen atom can also be reacted with (A) and (B) to produce a reaction product that provides equal or better results.

    摘要翻译: 含有(A)含有通式结构式为“IMAGE”的氮 - 碳 - 硫自由基的化合物的反应产物的酸性电解电镀溶液,其中R 1和R 2为烷基,氢原子或其混合物,或其中R 3 是芳族,杂环或脂环族基团或其烷基衍生物,和(B)式X-R1-(S)n-R2-Y的化合物,其中R 1和R 2相同或不同,并且是取代或未取代的亚烷基 含有1至6个碳原子,X是官能或非官能部分,n为2,3,4或5,Y为水溶性基团或能够足够赋予反应产物水溶性的基团 增加沉积物的亮度和/或防止在热冲击期间形成裂纹。 任选地,其中R是1至6个碳原子的低级烷基,1至4个碳原子的低级亚烷基,芳族基团或氢原子的式“IMAGE”的酰胺也可与(A )和(B)以产生提供相等或更好结果的反应产物。

    Method of etching circuit boards and recovering copper from the spent
etch solutions
    52.
    发明授权
    Method of etching circuit boards and recovering copper from the spent etch solutions 失效
    蚀刻电路板并从废蚀刻溶液中回收铜的方法

    公开(公告)号:US4378270A

    公开(公告)日:1983-03-29

    申请号:US316108

    申请日:1981-10-29

    申请人: William R. Brasch

    发明人: William R. Brasch

    CPC分类号: C23F1/46 C23F1/18 C25C1/12

    摘要: The present invention relates to a method of etching copper with a hydrogen peroxide-sulfuric acid etchant containing an acid soluble phosphonic acid in the manufacture of electronic circuits utilizing a masked copper surface and to a method of recovering the copper from the spent etch solution by electrolysis in solid continuous form saleable as electrolytic copper.

    摘要翻译: 本发明涉及一种使用含有酸溶性膦酸的过氧化氢 - 硫酸蚀刻剂在制造使用掩模铜表面的电子电路中蚀刻铜的方法以及通过电解从废蚀刻溶液中回收铜的方法 以固体连续形式作为电解铜销售。