摘要:
Acid copper electroplating solutions containing the reaction product of(A) a compound containing a nitrogen-carbon-sulfur radical of the general structural formula ##STR1## where R.sub.1 and R.sub.2 are alkyl radicals a hydrogen atom or mixtures thereof, or ##STR2## where R.sub.3 is an aromatic, heterocyclic or alicyclic radical or their alkyl derivatives, and(B) a compound of the formulaX--R.sub.1 --(S).sub.n --R.sub.2 --Y where R.sub.1 and R.sub.2 are the same or different and are substituted or unsubstituted alkylene radicals containing 1 to 6 carbon atoms, X is a functional or non-functional moiety, n is 2, 3, 4, or 5, and Y is a water solubilizing group or a group capable of imparting water solubility to the reaction product in a sufficient amount to increase the brightness of the deposit and/or to prevent the formation of cracks during thermal shock. Optionally, an amide of the formula ##STR3## where R is a lower alkyl radical of 1 to 6 carbon atoms, a lower alkylene radical of 1 to 4 carbon atoms, an aromatic radical, or a hydrogen atom can also be reacted with (A) and (B) to produce a reaction product that provides equal or better results.
摘要:
The present invention relates to a method of etching copper with a hydrogen peroxide-sulfuric acid etchant containing an acid soluble phosphonic acid in the manufacture of electronic circuits utilizing a masked copper surface and to a method of recovering the copper from the spent etch solution by electrolysis in solid continuous form saleable as electrolytic copper.