公开(公告)号：US20230244031A1

公开(公告)日：2023-08-03

申请号：US18297373

申请日：2023-04-07

申请人： Cisco Technology, Inc.

发明人： Roman BRUCK ,  Thierry J. PINGUET ,  Attila MEKIS

IPC分类号： G02B6/122 ,  G02B6/13

CPC分类号： G02B6/122 ,  G02B6/13

摘要： End-face coupling structures within an electrical backend are provided via photonic integrated circuit (PIC), comprising: a first plurality of spacer layers; a second plurality of etch-stop layers, wherein each etch-stop layer of the second plurality of etch-stop layers is located between two spacer layers of the first plurality of spacer layers; and an optical coupler comprising a plurality of waveguides arranged as a waveguide array configured to receive an optical signal in a direction of travel, wherein each waveguide of the plurality of waveguides is located at a layer interface defined between an etch-stop layer and a spacer layer. Portions of the PIC can be formed by depositing layers of spacer and etch-stop materials in which cavities are formed to define the waveguides when the waveguide material is deposited or interconnects when a metal is deposited therein.

公开(公告)号：US11703643B2

公开(公告)日：2023-07-18

申请号：US16717737

申请日：2019-12-17

申请人： The Research Foundation for the State University of New York

发明人： Douglas Coolbaugh ,  Thomas Adam ,  Gerald L. Leake

IPC分类号： G02B6/13 ,  H01L27/146 ,  H01L31/028 ,  H01L21/02 ,  H01L21/203 ,  H01L21/205 ,  H01L31/0232 ,  H01L31/105 ,  H01L31/0224 ,  H01L31/18 ,  G02B6/12 ,  G02B6/43 ,  G02B6/132 ,  G02B6/134 ,  G02B6/136

CPC分类号： G02B6/13 ,  G02B6/12002 ,  H01L21/0245 ,  H01L21/0262 ,  H01L21/02381 ,  H01L21/02505 ,  H01L21/02532 ,  H01L21/02573 ,  H01L21/02639 ,  H01L21/2033 ,  H01L21/2053 ,  H01L27/14625 ,  H01L31/028 ,  H01L31/0232 ,  H01L31/02327 ,  H01L31/022408 ,  H01L31/105 ,  H01L31/1808 ,  G02B6/132 ,  G02B6/136 ,  G02B6/1347 ,  G02B6/43 ,  G02B2006/121 ,  G02B2006/12061 ,  G02B2006/12104 ,  G02B2006/12123 ,  G02B2006/12169 ,  H01L27/14629 ,  Y02E10/52 ,  Y02E10/547

摘要： A photonic structure can include in one aspect one or more waveguides formed by patterning of waveguiding material adapted to propagate light energy. Such waveguiding material may include one or more of silicon (single-, poly-, or non-crystalline) and silicon nitride.

公开(公告)号：US11703641B2

公开(公告)日：2023-07-18

申请号：US17510910

申请日：2021-10-26

申请人： GLOBALFOUNDRIES U.S. Inc.

发明人： Yusheng Bian ,  Francis Afzal

IPC分类号： G02B6/12 ,  G02B6/122 ,  G02B6/13 ,  G02B6/293

CPC分类号： G02B6/12007 ,  G02B6/1228 ,  G02B6/13 ,  G02B6/2938

摘要： Structures for a wavelength division multiplexing filter and methods of fabricating a structure for a wavelength division multiplexing filter. The structure includes a first waveguide core having a first section and a second section. The first section and the second section have a first notched sidewall and a second notched sidewall opposite to the first notched sidewall. The structure further includes a second waveguide core positioned with a first offset in a first direction relative to the first section and the second section of the first waveguide core and with a second offset in a second direction relative to the first section and the second section of the first waveguide core. The second direction is transverse to the first direction.

公开(公告)号：US20230194778A1

公开(公告)日：2023-06-22

申请号：US17559858

申请日：2021-12-22

申请人： Intel Corporation

发明人： Dowon KIM ,  Suohai MEI ,  Jason M. GAMBA ,  Sanka GANESAN

IPC分类号： G02B6/12 ,  G02B6/13

CPC分类号： G02B6/12004 ,  G02B6/13

摘要： Embodiments herein relate to systems, apparatuses, or processes for creating an integrated photonics package that includes a photonics IC, an electronic IC, and an optical coupling connector that are molded within a single package. In embodiments, caps may be used to protect optical components during manufacture. Other embodiments may be described and/or claimed.

公开(公告)号：US20230049310A1

公开(公告)日：2023-02-16

申请号：US17796811

申请日：2020-02-10

申请人： Nippon Telegraph and Telephone Corporation

发明人： Yohei Saito ,  Kota Shikama ,  Norio Sato

IPC分类号： G02B6/122 ,  G02B6/13

摘要： An embodiment is an optical connection element including a first waveguide core and a second waveguide core on a substrate, the first waveguide core and the second waveguide core configured to propagate a signal light and a resin-curing light, and a mode field conversion portion provided at one end of the first waveguide core, wherein the second waveguide core covers at least the mode field conversion portion on the substrate, and a refractive index of the first waveguide core is higher than a refractive index of the second waveguide core.

公开(公告)号：US11579083B2

公开(公告)日：2023-02-14

申请号：US16500098

申请日：2018-03-30

申请人： Indigo Diabetes N.V.

发明人： Juan Sebastian Ordonez Orellana ,  Danaë Delbeke ,  Koenraad Van Schuylenbergh ,  Paolo Cardile ,  Ananth Subramanian

IPC分类号： G01N21/552 ,  G02B6/12 ,  A61B5/145 ,  A61B5/1459 ,  G02B6/13

摘要： An implantable optical sensor (1) comprising a substrate (2) and at least one optical microstructure (3) for evanescent field sensing integrated with the substrate (2), the at least one optical microstructure (3) being positioned to form an optical interaction area (4) on a part of a surface (5) of the substrate (2), the optical assembly (1) further comprising a thin protective layer (6) covering at least the optical interaction area (4), the thin protective layer (6) being in a predetermined material with corrosion-protection characteristics and having a predetermined thickness, so as not to affect the evanescent field sensing.

公开(公告)号：US20230029270A1

公开(公告)日：2023-01-26

申请号：US17460586

申请日：2021-08-30

申请人： BOARDTEK ELECTRONICS CORPORATION

发明人： CHIEN-CHENG LEE

IPC分类号： H05K1/02 ,  H05K3/46 ,  G02B6/13

摘要： A method for manufacturing a circuit board structure with a waveguide is provided. The method includes: providing a first substrate unit, a second substrate unit, a third substrate unit, and two adhesive layers, the first substrate unit including a first dielectric layer and a first conductive layer, the first conductive layer including a first shielding area and two first artificial magnetic conductor areas disposed on two sides of the first shielding area; the second substrate unit including a second dielectric layer and a second conductive layer, the second conductive layer including a second shielding area; the third substrate unit defining a first slot, and the adhesive layer defining a second slot; stacking the first substrate unit, one of the adhesive layers, the third substrate unit, another one of the adhesive layers, and the second substrate unit in that order; pressing the intermediate body.

公开(公告)号：US20230015854A1

公开(公告)日：2023-01-19

申请号：US17932623

申请日：2022-09-15

申请人： STMicroelectronics (Crolles 2) SAS

发明人： Jean-Francois CARPENTIER ,  Charles BAUDOT

IPC分类号： G02B6/43 ,  G02B6/12 ,  G02B6/13 ,  G02B6/42

摘要： A photonic system includes a first photonic circuit having a first face and a second photonic circuit having a second face. The first photonic circuit comprises first wave guides, and, for each first wave guide, a second wave guide covering the first wave guide, the second wave guides being in contact with the first face and placed between the first face and the second face, the first wave guides being located on the side of the first face opposite the second wave guides. The second photonic circuit comprises, for each second wave guide, a third wave guide covering the second wave guide. The first photonic circuit comprises first positioning devices projecting from the first face and the second photonic circuit comprises second positioning devices projecting from the second face, at least one of the first positioning devices abutting one of the second positioning devices in a first direction.

公开(公告)号：US11555963B1

公开(公告)日：2023-01-17

申请号：US17358255

申请日：2021-06-25

申请人： GLOBALFOUNDRIES U.S. Inc.

发明人： Subramanian Krishnamurthy ,  Yusheng Bian

IPC分类号： G02B6/125 ,  G02B6/13 ,  G02B6/122 ,  G02B6/12

摘要： Structures for an optical power splitter and methods of forming a structure for an optical power splitter. The structure includes a first waveguide core having a first arm, a second waveguide core including a second arm, and a third waveguide core having a third arm laterally positioned between the first arm and the second arm. The third arm has a longitudinal axis. The first arm is longitudinally offset from the third arm parallel to the longitudinal axis such that the third arm and the first arm are laterally adjacent over a first overlap distance. The second arm is longitudinally offset from the third arm parallel to the longitudinal axis such that the third arm and the second arm are laterally adjacent over a second overlap distance. The first overlap distance is greater than the second overlap distance to provide an overlap offset.

公开(公告)号：US11543587B2

公开(公告)日：2023-01-03

申请号：US17345724

申请日：2021-06-11

申请人： Psiquantum, Corp.

发明人： Koustuban Ravi ,  Mark Thompson ,  Eric Dudley

IPC分类号： G02B6/122 ,  G02B6/293 ,  G02B6/12 ,  G02B6/13

摘要： A Mach-Zehnder interferometer (MZI) filter comprising one or more passive compensation structures are described. The passive compensation structures yield MZI filters that are intrinsically tolerant to perturbations in waveguide dimensions and/or other ambient conditions. The use of n+1 waveguide widths can mitigate n different sources of perturbation to the filter. The use of at least three different waveguide widths for each Mach-Zehnder waveguide can alleviate sensitivity of filter performance to random width or temperature variations. A tolerance compensation portion is positioned between a first coupler section and a second coupler section, wherein the tolerance compensation portion includes a first compensation section having a second width, a second compensation section having a third width and a third compensation section having a fourth width, wherein the fourth width is greater than the third width and the third width is greater than the second width.