公开(公告)号：US20060009042A1

公开(公告)日：2006-01-12

申请号：US11216759

申请日：2005-08-31

Applicant: Brett Busch ,  Luan Tran ,  Ardavan Niroomand ,  Fred Fishburn ,  Yoshiki Hishiro ,  Ulrich Boettiger ,  Richard Holscher

Inventor： Brett Busch ,  Luan Tran ,  Ardavan Niroomand ,  Fred Fishburn ,  Yoshiki Hishiro ,  Ulrich Boettiger ,  Richard Holscher

IPC: H01L21/302 ,  H01L21/31

CPC classification number: H01L21/0332 ,  H01L21/0337 ,  H01L21/31144 ,  H01L27/10852 ,  H01L28/91 ,  Y10S438/942 ,  Y10S438/946

Abstract: A patterned mask can be formed as follows. A first patterned photoresist is formed over a masking layer and utilized during a first etch into the masking layer. The first etch extends to a depth in the masking layer that is less than entirely through the masking layer. A second patterned photoresist is subsequently formed over the masking layer and utilized during a second etch into the masking layer. The combined first and second etches form openings extending entirely through the masking layer and thus form the masking layer into the patterned mask. The patterned mask can be utilized to form a pattern in a substrate underlying the mask. The pattern formed in the substrate can correspond to an array of capacitor container openings. Capacitor structure can be formed within the openings. The capacitor structures can be incorporated within a DRAM array.

公开(公告)号：US20050041228A1

公开(公告)日：2005-02-24

申请号：US10901852

申请日：2004-07-28

Applicant: Ulrich Boettiger ,  Scott Light ,  William Rericha ,  Craig Hickman

Inventor： Ulrich Boettiger ,  Scott Light ,  William Rericha ,  Craig Hickman

IPC: G03F7/20 ,  G03F7/207 ,  G03B27/42

CPC classification number: G03F7/70333 ,  G03F7/70358

Abstract: A method and apparatus for exposing a radiation-sensitive material of a microlithographic substrate to a selected radiation. The method can include directing the radiation along a radiation path in a first direction toward a reticle, passing the radiation from the reticle and to the microlithographic substrate along the radiation path in a second direction, and moving the reticle relative to the radiation path along a reticle path generally normal to the first direction. The microlithographic substrate can move relative to the radiation path along a substrate path having a first component generally parallel to the second direction, and a second component generally perpendicular to the second direction. The microlithographic substrate can move generally parallel to and generally perpendicular to the second direction in a periodic manner while the reticle moves along the reticle path to change a relative position of a focal plane of the radiation.

Abstract translation: 一种用于将微光刻基板的辐射敏感材料暴露于所选择的辐射的方法和装置。 该方法可以包括将辐射沿第一方向沿着辐射路径引导到光罩，使辐射沿着第一方向沿着辐射路径从光罩传递到微光刻基片，并且沿着辐射路径沿着辐射路径移动标线片 标线路径通常垂直于第一方向。 微光刻基片可以沿着具有大致平行于第二方向的第一部件的基板路径相对于辐射路径移动，以及大致垂直于第二方向的第二部件。 当光栅基板沿着标线路径移动以改变辐射的焦平面的相对位置时，微平版印刷基板可以以周期性的方式大致平行于并且大致垂直于第二方向移动。

公开(公告)号：US08445831B2

公开(公告)日：2013-05-21

申请号：US13302907

申请日：2011-11-22

Applicant: Rick Lake ,  Ulrich Boettiger ,  Shashikant Hegde ,  Jacques Duparre

Inventor： Rick Lake ,  Ulrich Boettiger ,  Shashikant Hegde ,  Jacques Duparre

IPC: H01L27/00 ,  H01L23/48

CPC classification number: H01L24/16 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/16237 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/351 ,  H05K3/32 ,  H05K3/4007 ,  H05K2201/09045 ,  H01L2924/00 ,  H01L2224/0401

Abstract: Various embodiments include interconnects for semiconductor structures that can include a first conductive structure, a second conductive structure and a non-hardening liquid conductive material in contact with the first and second structure. Other embodiments include semiconductor components and imager devices using the interconnects. Further embodiments include methods of forming a semiconductor structure and focusing methods for an imager device.

Abstract translation: 各种实施例包括用于半导体结构的互连，其可以包括与第一和第二结构接触的第一导电结构，第二导电结构和非硬化液体导电材料。 其他实施例包括使用互连的半导体部件和成像器件。 另外的实施例包括形成半导体结构的方法和用于成像器装置的聚焦方法。

公开(公告)号：US20120194719A1

公开(公告)日：2012-08-02

申请号：US13080889

申请日：2011-04-06

Applicant: Scott Churchwell ,  Ulrich Boettiger ,  Swarnal Borthakur ,  Andrew Perkins ,  Rick Lake ,  Marc Sulfridge

Inventor： Scott Churchwell ,  Ulrich Boettiger ,  Swarnal Borthakur ,  Andrew Perkins ,  Rick Lake ,  Marc Sulfridge

IPC: H04N5/335

CPC classification number: H01L27/14618 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/221 ,  H01L2224/24011 ,  H01L2224/24105 ,  H01L2224/24146 ,  H01L2224/82039 ,  H01L2224/821 ,  H01L2924/01029 ,  H01L2924/12043 ,  H01L2924/014 ,  H01L2924/00

Abstract: An image sensor unit has stacked imager and processor integrated circuits. The imager may have an image sensor pixel array on its front surface. Processor die may be mounted back-to-back with respective imagers on a wafer. A photodefinable dielectric film may cover the rear surface of the wafer. Metal traces in the photodefinable dielectric and through-silicon vias in each imager may be used to interconnect the processing circuitry on the front surface of a processor to the image sensor pixel array on the front surface of the imager. Openings may be formed in the photo definable dielectric to allow solder balls to form electrical connections with the metal traces. A cavity may be formed in a photo definable dielectric layer or an imager to accommodate the processor. The processor may also be mounted in a cavity in a separate silicon standoff structure before attaching the standoff structure to the imager.

Abstract translation: 图像传感器单元具有堆叠的成像器和处理器集成电路。 成像器在其前表面上可以具有图像传感器像素阵列。 处理器管芯可以与晶片上的相应成像器背靠背安装。 可光限定的电介质膜可以覆盖晶片的后表面。 可以使用每个成像器中的光可定义电介质和穿硅通孔中的金属迹线将处理器前表面上的处理电路与成像器前表面上的图像传感器像素阵列互连。 可以在可光电介质中形成开口以允许焊球与金属迹线形成电连接。 空腔可以形成在可光定义的介电层或成像器中以容纳处理器。 在将间隔结构附接到成像器之前，处理器还可以安装在分离的硅隔离结构中的空腔中。

公开(公告)号：US20100123209A1

公开(公告)日：2010-05-20

申请号：US12274256

申请日：2008-11-19

Applicant: Jacques Duparre ,  Rickie C. Lake ,  Ulrich Boettiger ,  Shashikant Hegde

Inventor： Jacques Duparre ,  Rickie C. Lake ,  Ulrich Boettiger ,  Shashikant Hegde

IPC: H01L27/00 ,  H01L21/00

CPC classification number: H01L27/14625 ,  B29D11/00009 ,  G02B7/021 ,  G02B7/023 ,  G02B26/0875 ,  H01L27/14618 ,  H01L27/14685 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A lens stack having a movable lens attached to a MEMS structure and method of fabricating the same. The method comprises attaching at least one MEMS structure to a transparent substrate. The method further comprises forming a movable lens in contact with the at least one MEMS structure.

Abstract translation: 具有附接到MEMS结构的可移动透镜的透镜组及其制造方法。 该方法包括将至少一个MEMS结构附着到透明基板上。 该方法还包括形成与所述至少一个MEMS结构接触的可移动透镜。

公开(公告)号：US07560295B2

公开(公告)日：2009-07-14

申请号：US11510704

申请日：2006-08-28

Applicant: Ulrich Boettiger ,  Jin Li

Inventor： Ulrich Boettiger ,  Jin Li

IPC: H01L21/00

CPC classification number: H01L27/14627 ,  H01L27/14641

Abstract: Methods of fabricating a microlens and/or array of microlenses used to focus light on photosensors, by forming a protective coating over a microlenses precursor material, and etching the protective coating and microlens precursor material to obtain a predetermined shape.

Abstract translation: 通过在微透镜前体材料上形成保护涂层，以及蚀刻保护性涂层和微透镜前体材料以获得预定形状，制造用于将光聚焦在光电传感器上的微透镜和/或微透镜阵列的方法。

公开(公告)号：US20080309900A1

公开(公告)日：2008-12-18

申请号：US11808702

申请日：2007-06-12

Applicant: Steve Oliver ,  Ulrich Boettiger

Inventor： Steve Oliver ,  Ulrich Boettiger

IPC: G03C5/16 ,  B29C65/48 ,  G03B27/42

CPC classification number: G03F7/0002 ,  B82Y10/00 ,  B82Y40/00

Abstract: A method and apparatus to fabricate a patterned structure using a template supported on a carrier. The method includes patterning a material to conform to the patterned structure. The patterned material is cured while remaining on the template. The carrier is removable during the curing process. The template is later removed from the patterned material to obtain the patterned structure. A patterning device is also provided, which is formed by a template and a carrier releasably attached to each other. The template and the carrier can be separated from each other when the patterning device is subjected to curing of the patterned structure.

Abstract translation: 使用支撑在载体上的模板来制造图案化结构的方法和装置。 该方法包括图案化材料以符合图案化结构。 图案化材料在保留在模板上时固化。 载体在固化过程中是可去除的。 随后从图案化材料中除去模板以获得图案化结构。 还提供了一种图案形成装置，其由模板和可释放地相互连接的载体形成。 当图案形成装置经受图案化结构的固化时，模板和载体可以彼此分离。

公开(公告)号：US20080165257A1

公开(公告)日：2008-07-10

申请号：US11650215

申请日：2007-01-05

Applicant: Ulrich Boettiger

Inventor： Ulrich Boettiger

IPC: H04N5/228 ,  H04N5/335

CPC classification number: H01L27/14603 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14625

Abstract: Embodiments of the present invention relate to an image sensor that may be used for digital photography. One embodiment of the present invention may include an image sensor comprising a substrate, a plurality of pixel cell arrays disposed on the substrate, a first array of the plurality of pixel cell arrays including pixels of a first size, a second array of the plurality of pixel cell arrays including pixels of a second size, the second size differing from the first size, and a plurality of photographic lenses, each of the plurality of photographic lenses arranged to focus light onto one array of the plurality of pixel cell arrays.

Abstract translation: 本发明的实施例涉及可用于数字摄影的图像传感器。 本发明的一个实施例可以包括图像传感器，其包括基板，设置在基板上的多个像素单元阵列，多个像素单元阵列中的第一阵列，包括第一尺寸的像素，多个像素单元阵列的第二阵列 像素单元阵列，其包括第二尺寸的像素，第二尺寸不同于第一尺寸，以及多个摄影透镜，所述多个摄影透镜中的每一个被布置成将光聚焦到所述多个像素单元阵列的一个阵列上。

公开(公告)号：US20080055729A1

公开(公告)日：2008-03-06

申请号：US11511039

申请日：2006-08-28

Applicant: Jiutao Li ,  Jin Li ,  Ulrich Boettiger

Inventor： Jiutao Li ,  Jin Li ,  Ulrich Boettiger

IPC: G02B27/00 ,  G02B13/14

CPC classification number: H04N5/2254

Abstract: Methods and apparatus are provided. An image sensor has an array of light sensing elements and a transparent cover overlying the array of light sensing elements. The cover has a first roughened surface facing the array of light sensing elements and a second roughened surface facing away from the light sensing elements.

Abstract translation: 提供了方法和装置。 图像传感器具有光敏元件阵列和覆盖光敏元件阵列的透明盖。 所述盖具有面对所述光感测元件阵列的第一粗糙表面和远离所述光感测元件的第二粗糙表面。

公开(公告)号：US20070158772A1

公开(公告)日：2007-07-12

申请号：US11328152

申请日：2006-01-10

Applicant: Ulrich Boettiger

Inventor： Ulrich Boettiger

IPC: H01L31/0232

CPC classification number: H01L27/14685 ,  H01L27/14621 ,  H01L27/14627

Abstract: A method and apparatus for improving the planarity of a recessed color filter array when the recessed region or trench depth exceeds the thickness of the color filter film. The method includes the steps of coating the entire wafer with an additional coating material after applying the CFA, then planarizing that resist layer using CMP and then using a dry etch to transfer that planar surface down as far as required to achieve a planar color filter with a uniform thickness.

Abstract translation: 一种用于在凹陷区域或沟槽深度超过滤色膜厚度时改善凹陷滤色器阵列的平面度的方法和装置。 该方法包括以下步骤：在施加CFA之后用附加涂层材料涂覆整个晶片，然后使用CMP对该抗蚀剂层进行平面化，然后使用干蚀刻将该平面表面向下转移以达到所需的平面滤色器，以实现具有 均匀的厚度。