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公开(公告)号:US20210013043A1
公开(公告)日:2021-01-14
申请号:US16696513
申请日:2019-11-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Choongho Rhee , Sungchan Kang , Hyunwook Kang , Cheheung Kim , Yongseop Yoon , Jaehyung Jang , Hyeokki Hong
IPC: H01L21/3065 , H01L21/56 , H01L21/02 , H01L21/683
Abstract: Provided is a plasma dicing method. The plasma dicing method includes: performing plasma etching on a first surface of a substrate exposed between a plurality of membrane structures; forming a passivation layer on a semiconductor wafer to cover the plurality of membrane structures and at least one trench; performing plasma etching on a second surface of the substrate such that a through hole exposing a portion of the plurality of membrane structures and a dicing lane connected to the trench and having a width less than a width of the through hole are formed at the substrate; and removing the passivation layer and singulating the semiconductor wafer into a plurality of devices including a membrane partially exposed by the through hole.
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公开(公告)号:US10356509B2
公开(公告)日:2019-07-16
申请号:US15823881
申请日:2017-11-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sangha Park , Sungchan Kang , Cheheung Kim , Yongseop Yoon , Choongho Rhee , Hyeokki Hong
IPC: H04R11/14 , H04R17/10 , H04R1/24 , H04R17/02 , H04R29/00 , H04R3/00 , H04R1/28 , H04R9/18 , G06F17/14 , H04R7/08
Abstract: A signal processing method of an audio sensing device is provided. The audio sensing device includes a plurality of resonators, at least some of the plurality of resonators having different frequency bands. The method includes setting a plurality of time frames corresponding to the plurality of resonators, and calculating a sound feature for each of the plurality of time frames, the sound feature being calculated based on an audio signal detected by each of the plurality of the resonators, wherein the plurality of time frames are set independently for each of the frequency bands, and at least some of the plurality of time frames are set to have different time intervals.
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公开(公告)号:US10178472B1
公开(公告)日:2019-01-08
申请号:US15834287
申请日:2017-12-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Choongho Rhee , Sungchan Kang , Cheheung Kim , Sangha Park , Yongseop Yoon , Hyeokki Hong
IPC: H04R1/32 , H01L41/113 , H01L41/053 , H04R1/28 , H01L41/083 , H04R17/02 , H04R7/06 , H01L41/18
Abstract: An omnidirectional acoustic sensor is provided. The omnidirectional acoustic sensor includes first, inner resonators connected to an inner circumference of a supporting frame and second, outer resonators connected to an outer circumference of the supporting frame. The first, inner resonators vibrate in a height direction of the supporting frame and the second, outer resonators vibrate in a lateral direction of the supporting frame.
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