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公开(公告)号:US20220209494A1
公开(公告)日:2022-06-30
申请号:US17301332
申请日:2021-03-31
Applicant: Lumentum Operations LLC
Inventor: Hao HUANG , Mikhail DOLGANOV , Huanlin ZHU , Lijun ZHU
IPC: H01S5/026 , H01S5/02345 , H01S5/042 , H01S5/183 , H01S5/068
Abstract: A driver circuit may include a source, a first circuit path, and a second circuit path. The a first circuit path may be connected to the source and include a first anode pad, a first set of connecting elements to connect the first anode pad to an anode of an optical load, a second anode pad that is separate from the first anode pad, a second set of connecting elements to connect the anode of the optical load to the second anode pad, and a switch. The switch being in a closed state causes current to charge the first set of connecting elements and the second set of connecting elements through the first circuit path. The switch transitioning from the closed state to the open state causes the first set of connecting elements to discharge current through the second circuit path to provide an electrical pulse to the optical load.
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42.
公开(公告)号:US20220166187A1
公开(公告)日:2022-05-26
申请号:US17301261
申请日:2021-03-30
Applicant: Lumentum Operations LLC
Inventor: Wei SHI , Siu Kwan CHEUNG , Lijun ZHU , Raman SRINIVASAN , Huanlin ZHU
Abstract: An optical device may include a substrate including a conductive core, a first layer stack on a first surface of the conductive core, a conductor-filled trench extending through the first layer stack to the conductive core such that the conductor-filled trench is on the first surface of the conductive core, and a second layer stack on a second surface of the conductive core. The optical device may include a vertical-cavity surface-emitting laser (VCSEL) chip above the conductor-filled trench. The VCSEL chip may include an array of VCSELs. A size of the conductor-filled trench may match a size of the VCSEL chip, match a size of an emission region of the array of VCSELs, or be greater than the size of the emission region of the array of VCSELs and less than the size of the VCSEL chip.
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