公开(公告)号：US20130133873A1

公开(公告)日：2013-05-30

申请号：US13706568

申请日：2012-12-06

申请人： International Business Machines Corporation

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： H05K7/20281 ,  F24F3/14 ,  F24F11/30 ,  F24F2110/20 ,  F25B2600/13 ,  F25D17/02 ,  F25D31/002 ,  F25D2317/04131 ,  H05K7/20781 ,  H05K7/20836

摘要： A method is provided for dissipating heat from a rack. The method includes: disposing a coolant-cooled heat exchanger within the rack, and providing a coolant control apparatus. The coolant control apparatus includes at least one coolant recirculation conduit coupled in fluid communication between a facility coolant supply and return, wherein the facility coolant supply and return facilitate providing facility coolant to the heat exchanger. The control apparatus further includes a coolant pump(s) associated with the recirculation conduit(s) and a controller which monitors a temperature of facility coolant supplied to the heat exchanger, and redirects facility coolant, via the coolant recirculation conduit(s) and coolant pump(s), from the facility coolant return to the facility coolant supply to, at least in part, ensure that facility coolant supplied to the heat exchanger remains above a dew point temperature.

摘要翻译： 提供了用于从机架散热的方法。 该方法包括：将冷却剂冷却的热交换器设置在机架内，并提供冷却剂控制装置。 冷却剂控制装置包括在设备冷却剂供应和返回之间流体连通地联接的至少一个冷却剂再循环管道，其中设备冷却剂供应和返回便于向热交换器提供设备冷却剂。 控制装置还包括与再循环管道相关联的冷却剂泵和控制器，其控制供应给热交换器的设备冷却剂的温度，并且经由冷却剂再循环管道和冷却剂重新定向设备冷却剂 泵从设备冷却剂返回到设备冷却剂供应，至少部分地确保供应到热交换器的设备冷却剂保持高于露点温度。

公开(公告)号：US20130104399A1

公开(公告)日：2013-05-02

申请号：US13684736

申请日：2012-11-26

申请人： International Business Machines Corporation

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： H05K7/20709 ,  H05K7/20781

摘要： A method is provided which includes providing a multi-rack assembly having adjacent first and second electronics racks, each being at least partially air-cooled, and an air-to-liquid heat exchanger associated with the first rack for cooling at least a portion of air passing through the first rack. The heat exchanger, which is disposed at the air inlet or air outlet side of the first rack and is coupled in fluid communication with a coolant loop to receive coolant from the loop and exhaust coolant to the loop, transfers heat from air passing thereacross to coolant passing therethrough. The assembly also includes a cooling unit, associated with the first rack and cooling coolant in the coolant loop, and an airflow director associated with the second rack and facilitating ducting at least a portion of air passing through the second rack to also pass across the heat exchanger associated with the first rack.

摘要翻译： 提供了一种方法，其包括提供具有相邻的第一和第二电子机架的多齿条组件，每个电子机架至少部分地被空气冷却，以及与第一齿条相关联的空气与液体热交换器，用于冷却至少一部分 空气通过第一个机架。 该热交换器设置在第一齿条的空气入口或空气出口侧，并且与冷却剂回路流体连通地连接以接收来自回路的冷却剂并将冷却剂排出到回路，将来自经过其的空气的热量传递给冷却剂 通过 组件还包括与第一齿条相关联的冷却单元和冷却剂回路中的冷却冷却剂，以及与第二齿条相关联的气流引导件，并且便于管道通过第二齿条的至少一部分空气也穿过热 交换机与第一个机架相关联。

公开(公告)号：US20200178422A1

公开(公告)日：2020-06-04

申请号：US16749134

申请日：2020-01-22

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： H05K7/20 ,  G05B15/02 ,  G05D23/19

摘要： Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings.

公开(公告)号：US20150351281A1

公开(公告)日：2015-12-03

申请号：US14826421

申请日：2015-08-14

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： H05K7/20 ,  B23P15/26

CPC分类号： H05K7/20318 ,  B23P15/26 ,  B23P2700/10 ,  H05K7/203 ,  H05K7/20781 ,  H05K7/2079 ,  Y10T29/49361

摘要： Cooling apparatuses and methods of fabricating thereof are provided which facilitate pumped immersion-cooling of an electronic component(s). The cooling apparatus includes an enclosure having a compartment accommodating the electronic component(s), and dielectric fluid within the compartment at least partially immersing the electronic component(s). A liquid-cooled heat sink is associated with the enclosure to cool at least one cooling surface associated with the compartment, and facilitate heat transfer to the heat sink from the electronic component(s) via the dielectric fluid. A pump is disposed external to the compartment and in fluid communication therewith to facilitate pumped dielectric fluid flow through the compartment. The pumped dielectric fluid flow through the compartment enhances heat transfer from the electronic component(s) to the liquid-cooled heat sink via the cooling surface(s). In one implementation, the pumped dielectric fluid flow provides two-phase cooling to the electronic component(s) via flow boiling.

摘要翻译： 提供冷却装置及其制造方法，其有助于电子部件的抽吸浸没冷却。 所述冷却装置包括具有容纳所述电子部件的隔室的外壳和所述隔室内的介电流体，至少部分地浸没所述电子部件。 液体冷却散热器与外壳相关联，以冷却与隔室相关联的至少一个冷却表面，并且便于通过介电流体从电子部件传递到散热器。 泵设置在隔室的外部并与其流体连通以便于泵送的介电流体流过隔间。 泵送的电介质流体流过隔室增强了通过冷却表面从电子部件到液体冷却的散热器的热传递。 在一个实施方案中，泵送介质流体流通过沸腾流向电子部件提供两相冷却。

公开(公告)号：US20150109735A1

公开(公告)日：2015-04-23

申请号：US14058530

申请日：2013-10-21

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： H05K7/20318 ,  B23P15/26 ,  B23P2700/10 ,  H05K7/203 ,  H05K7/20781 ,  H05K7/2079 ,  Y10T29/49361

摘要： Cooling apparatuses and methods of fabricating thereof are provided which facilitate pumped immersion-cooling of an electronic component(s). The cooling apparatus includes an enclosure having a compartment accommodating the electronic component(s), and dielectric fluid within the compartment at least partially immersing the electronic component(s). A liquid-cooled heat sink is associated with the enclosure to cool at least one cooling surface associated with the compartment, and facilitate heat transfer to the heat sink from the electronic component(s) via the dielectric fluid. A pump is disposed external to the compartment and in fluid communication therewith to facilitate pumped dielectric fluid flow through the compartment. The pumped dielectric fluid flow through the compartment enhances heat transfer from the electronic component(s) to the liquid-cooled heat sink via the cooling surface(s). In one implementation, the pumped dielectric fluid flow provides two-phase cooling to the electronic component(s) via flow boiling.

公开(公告)号：US20140158339A1

公开(公告)日：2014-06-12

申请号：US13706557

申请日：2012-12-06

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, Jr. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： F28F27/02

CPC分类号： F16K31/002 ,  F28F3/12 ,  F28F27/00 ,  F28F27/02 ,  H05K7/20781 ,  H05K7/20836

摘要： Cooling apparatuses and methods are presented for facilitating dissipation of heat generated by one or more electronic components. The apparatuses include, for instance, a coolant-cooled heat sink and a thermostat-controlled valve. The heat sink includes one or more coolant-carrying channels and one or more valve wells intersecting the channels. The thermostat-controlled valve is disposed, at least partially, within a respective valve well so as to intersect a respective coolant-carrying channel, and includes a valve disk and a thermal-sensitive actuator mechanically coupled to rotate the valve disk. The valve disk is rotatable between an open position where coolant is allowed to flow through the respective coolant-carrying channel, and a closed position where coolant is blocked from flowing through the respective channel. The actuator rotates the valve disk between the open position and the closed position, dependent on heating of the thermal-sensitive actuator by the electronic component(s).

摘要翻译： 呈现冷却装置和方法，以便于散发由一个或多个电子部件产生的热量。 这些装置包括例如冷却剂冷却的散热器和恒温器控制的阀。 散热器包括一个或多个冷却剂承载通道和与通道相交的一个或多个阀井。 恒温控制阀至少部分地设置在相应的阀井内，以与相应的冷却剂承载通道相交，并且包括阀盘和机械耦合以旋转阀盘的热敏致动器。 阀盘可以在允许冷却剂流过相应的冷却剂输送通道的打开位置和阻止冷却剂流过相应通道的关闭位置之间旋转。 执行器根据电子部件对热敏致动器的加热，使阀盘在打开位置和关闭位置之间旋转。

公开(公告)号：US20140146467A1

公开(公告)日：2014-05-29

申请号：US13684712

申请日：2012-11-26

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： H05K7/20 ,  G06F1/20

CPC分类号： H05K7/20236 ,  G06F1/20 ,  H05K7/203 ,  H05K7/20318 ,  H05K7/20336 ,  H05K7/2079 ,  H05K7/20809

摘要： A cooled electronic system and cooling method are provided, where an electronics board having a plurality of electronic components mounted to the board is cooled by an apparatus which includes an immersion-cooled electronic component section and a conduction-cooled electronic component section. The immersion-cooled section includes an enclosure at least partially surrounding and forming a compartment about multiple electronic components of the electronic components mounted to the electronics board, and a fluid disposed within the compartment. The multiple electronic components are, at least in part, immersed within the fluid to facilitate immersion-cooling of those components. The conduction-cooled electronic component section includes at least one electronic component of the electronic components mounted to the electronics board, and the at least one electronic component is indirectly liquid-cooled, at least in part, via conduction of heat from the at least one electronic component.

摘要翻译： 提供了一种冷却的电子系统和冷却方法，其中具有安装到板上的多个电子部件的电子板通过包括浸没冷却电子部件部分和传导冷却电子部件部分的设备来冷却。 浸没冷却部分包括至少部分地围绕和形成围绕安装到电子板的电子部件的多个电子部件的隔室以及设置在隔间内的流体的外壳。 多个电子部件至少部分地浸入流体中以便于这些部件的浸入冷却。 传导冷却的电子部件部分包括安装到电子板的电子部件的至少一个电子部件，并且至少一个电子部件至少部分地通过从至少一个 电子元件

公开(公告)号：US20140133099A1

公开(公告)日：2014-05-15

申请号：US13782012

申请日：2013-03-01

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： F28F9/00 ,  H05K7/20781

摘要： A method is provided which includes providing a cooling apparatus which includes a door assembly coupled to the electronics rack at an inlet or air outlet side of the rack. The door assembly includes: an airflow opening configured to facilitate ingress or egress of airflow through the electronics rack with the door assembly mounted to the rack; an air-to-coolant heat exchanger disposed so that airflow through the airflow opening passes across the air-to-coolant heat exchanger, the air-to-coolant heat exchanger being configured to extract heat from the airflow passing thereacross; and a vapor condenser configured to facilitate condensing of dielectric fluid vapor egressing from at least one immersion-cooled electronic component section of the electronics rack. The cooling apparatus, including the door assembly, facilitates air-cooling and immersion-cooling of different electronic components of the electronics rack.

摘要翻译： 提供了一种方法，其包括提供冷却装置，其包括在机架的入口或空气出口侧处联接到电子机架的门组件。 门组件包括：气流开口，其构造成便于通过安装到机架的门组件通过电子机架进入或流出气流; 空气冷却剂热交换器，其布置成使得通过气流开口的气流穿过空气 - 冷却剂热交换器，空气 - 冷却剂热交换器被配置为从通过其的气流中提取热量; 以及蒸汽冷凝器，其被配置为便于从电子机架的至少一个浸没冷却的电子部件部分出口的介电流体蒸气的冷凝。 包括门组件的冷却装置有助于电子机架的不同电子部件的空气冷却和浸没冷却。

公开(公告)号：US20140133098A1

公开(公告)日：2014-05-15

申请号：US13674217

申请日：2012-11-12

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Roger R. SCHMIDT ,  Robert E. SIMONS ,  Daniel E. ZAMBRANO

IPC分类号： H05K7/20 ,  F28F9/00

CPC分类号： F28D15/00 ,  F28F9/00 ,  H05K7/2079 ,  H05K7/20827

摘要： A cooling apparatus for an electronics rack is provided which includes a door assembly configured to couple to an air inlet side of the electronics rack. The door assembly includes: one or more airflow openings facilitating passage of airflow through the door assembly and into the electronics rack; one or more air-to-coolant heat exchangers disposed so that airflow through the airflow opening(s) passes across the heat exchanger(s), which is configured to extract heat from airflow passing thereacross; and one or more airflow redistributors disposed in a direction of airflow through the airflow opening(s) downstream of, and at least partially aligned to, the heat exchanger(s). The airflow redistributor(s) facilitates redistribution of the airflow passing across the air-to-liquid heat exchanger(s) to a desired airflow pattern at the air inlet side of the electronics rack, such as a uniform airflow distribution across the air inlet side of the rack.

摘要翻译： 提供了一种用于电子机架的冷却装置，其包括构造成联接到电子机架的空气入口侧的门组件。 门组件包括：一个或多个气流开口，便于气流通过门组件并进入电子机架; 一个或多个空气冷却剂热交换器被设置成使得通过气流开口的气流穿过热交换器，该热交换器被配置为从穿过其的气流中提取热量; 以及一个或多个气流再分布器，其布置在气流通过热交换器的下游并且至少部分对准的气流开口的方向上。 气流再分布器有助于通过空气 - 液体热交换器的气流再次分布到电子机架的空气入口侧的所需气流图案，例如穿过空气入口侧的均匀气流分布 的架子。

公开(公告)号：US20140124190A1

公开(公告)日：2014-05-08

申请号：US13782003

申请日：2013-03-01

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： H05K7/20281 ,  F28F27/02 ,  H05K7/20781 ,  H05K7/20836

摘要： A method is provided which includes providing a coolant-conditioning unit which includes a facility coolant path, having a facility coolant flow control valve, and a system coolant path accommodating a system coolant, and having a bypass line with a system coolant bypass valve. A heat exchanger is coupled to the facility and system coolant paths to facilitate transfer of heat from the system coolant to facility coolant in the facility coolant path, and the bypass line is disposed in the system coolant path in parallel with the heat exchanger. A controller automatically controls a regulation position of the coolant bypass valve and a regulation position of the facility coolant flow control valve based on a temperature of the system coolant, and automatically adjusts the regulation position of the system coolant bypass valve to facilitate maintaining the facility coolant flow control valve at or above a specified, partially open, minimum regulation position.

摘要翻译： 提供一种方法，其包括提供冷却剂调节单元，该冷却剂调节单元包括具有设备冷却剂流量控制阀的设备冷却剂通道和容纳系统冷却剂的系统冷却剂通道，并且具有与系统冷却剂旁通阀的旁路管路。 热交换器被耦合到设备和系统冷却剂路径，以便于将热量从系统冷却剂传送到设备冷却剂路径中的设备冷却剂，并且旁路管线与热交换器平行地设置在系统冷却剂路径中。 控制器基于系统冷却液的温度自动控制冷却剂旁通阀的调节位置和设备冷却剂流量控制阀的调节位置，并且自动调节系统冷却剂旁通阀的调节位置以便于维持设备冷却剂 流量控制阀处于或高于指定的，部分打开的最小调节位置。