公开(公告)号：US11205852B2

公开(公告)日：2021-12-21

申请号：US16829148

申请日：2020-03-25

申请人： CommScope Technologies LLC

发明人： Bo Wu ,  Martin L. Zimmerman ,  Björn Lindmark ,  Hangsheng Wen ,  PuLiang Tang ,  Jian Zhang ,  Xun Zhang ,  Ligang Wu ,  Zhigang Wang ,  Ruixin Su ,  Maosheng Liu ,  Rui An

IPC分类号： H01Q21/30 ,  H01Q9/06 ,  H01Q5/321 ,  H01Q1/40 ,  H01Q19/10

摘要： Base station antennas are provided herein. A base station antenna includes a plurality of vertical columns of low-band radiating elements configured to transmit RF signals in a first frequency band. The base station antenna also includes a plurality of vertical columns of high-band radiating elements configured to transmit RF signals in a second frequency band that is higher than the first frequency band. The vertical columns of high-band radiating elements extend in parallel with the vertical columns of low-band radiating elements in a vertical direction.

公开(公告)号：US11189966B2

公开(公告)日：2021-11-30

申请号：US16997290

申请日：2020-08-19

申请人： CommScope Technologies LLC

发明人： Zhigang Wang ,  Xun Zhang ,  Ruixin Su

IPC分类号： H01R13/625 ,  H01R13/635 ,  H01R13/627

摘要： An integral SMP connector assembly for a base station antenna comprising a base, in which at least two SMP connectors are configured to extend away from a backplate of the base station antenna from an upper surface of the base, the base including: at least one connecting portion which connects the base to the backplate so that the upper surface of the base faces the backplate; and a close looped groove located in the upper surface of the base and surrounding the at least one connecting portion and the at least two SMP connectors. The integral SMP connector assembly further comprises a seal received in the groove and configured to provide an airtight seal between the upper surface of the base and the backplate.

公开(公告)号：US11145946B2

公开(公告)日：2021-10-12

申请号：US16583499

申请日：2019-09-26

申请人： CommScope Technologies LLC

发明人： Xun Zhang ,  Xiaotuo Wang ,  Bo Wu ,  Ligang Wu

IPC分类号： H01P1/203 ,  H01P3/08 ,  H01Q15/14 ,  H01P1/20 ,  H01Q1/50

摘要： A low frequency and direct current (DC) signal blocking device includes a dielectric substrate layer; a low frequency and DC signal blocking transmission line on a first surface of the substrate layer, where the low frequency and DC signal blocking transmission line has an input end and an output end; a metal layer on a second surface of the substrate layer, where there is at least one gap on the metal layer such that the metal layer is separated into at least a first sub-region and a second sub-region, where the gap is configured to block at least one of a low frequency signal and a DC signal; the substrate layer disposed between the low frequency and DC signal blocking transmission line and the metal layer; and a metal plate, wherein a dielectric layer is disposed between the metal plate and the metal layer.