公开(公告)号：US20190207144A1

公开(公告)日：2019-07-04

申请号：US15976490

申请日：2018-05-10

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Chengyuan LUO

IPC: H01L51/52 ,  H01L51/56

Abstract: The present disclosure relates to an OLED display device and a method of packaging the OLED display device. An OLED display device, comprising: a substrate; a cover plate provided opposite to the substrate; a light emitting region located on a surface of the substrate facing the cover plate, wherein the light emitting region has an OLED display structure; a dam around the light emitting region; and a packaging adhesive layer disposed on the light emitting region and used to cover the OLED display structure, wherein the cover plate is provided with a groove at a position corresponding to the dam, an end of the dam away from the substrate being disposed in the groove.

公开(公告)号：US20190115558A1

公开(公告)日：2019-04-18

申请号：US16111512

申请日：2018-08-24

Applicant: BOE Technology Group Co., Ltd.

Inventor： Chengyuan LUO

IPC: H01L51/52 ,  H01L51/00 ,  H01L51/56

Abstract: The present disclosure provides a packaging cover plate, a method for manufacturing the same and a light emitting diode display, the packaging cover plate includes a cover plate body and a groove structure disposed on a first surface of the cover plate body, wherein the cover plate body comprises a flexible ceramic material, and the groove structure is filled with an adhesive material and a thermally conductive material. The packaging cover plate provided by the present disclosure has a bending property while having a barrier to water and oxygen, and does not undergo a shape change due to thermal expansion and contraction under a change of the ambient temperature. In addition, the present disclosure can improve the adhesion between the package cover plate and the packaging adhesive and improve the heat dissipation effect.

公开(公告)号：US20190058153A1

公开(公告)日：2019-02-21

申请号：US15974903

申请日：2018-05-09

Applicant: BOE TECHNOLOGY GROUP CO., LTD

Inventor： Chengyuan LUO

IPC: H01L51/52 ,  H01L27/32 ,  H01L51/56

Abstract: A package substrate, a manufacturing method thereof, an organic light-emitting diode (OLED) display panel and a manufacturing method thereof are provided. The package substrate includes a transparent substrate; a plurality of spacers disposed on the transparent substrate; and auxiliary electrodes provided on the spacers and in a non-light-emitting region. Orthographic projections of the spacers on an array substrate fall within orthographic areas of a pixel define layer (PDL) on the array substrate.