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    Earphone having a controlled acoustic leak port
    41.
    发明授权
    Earphone having a controlled acoustic leak port 有权

    公开(公告)号：US11317196B2

    公开(公告)日：2022-04-26

    申请号：US16868372

    申请日：2020-05-06

    Applicant: Apple Inc.

    Inventor： Michael B. Howes ,  Yacine Azmi ,  Scott P. Porter ,  Jonathan S. Aase ,  Andrew P. Bright ,  Christopher R. Wilk

    IPC: H04R1/28 ,  H04R1/02 ,  H04R1/10

    Abstract: An earphone comprising an earphone housing having a wall comprising (1) a front side that joins (2) an end portion in which a primary sound output opening is formed, which joins (3) a face portion in which a secondary output opening is formed, which joins (4) a back side which joins the front side and encloses a driver, wherein the primary output opening is dimensioned to output sound generated by a diaphragm of the driver contained within the earphone housing into the ear and the secondary output opening is dimensioned to vent the ear to a surrounding environment, and wherein the primary output opening and the secondary output opening face different directions.

    Earphone having a controlled acoustic leak port
    45.
    发明授权
    Earphone having a controlled acoustic leak port 有权

    公开(公告)号：US10694282B2

    公开(公告)日：2020-06-23

    申请号：US16286346

    申请日：2019-02-26

    Applicant: Apple Inc.

    Inventor： Michael B. Howes ,  Yacine Azmi ,  Scott P. Porter ,  Jonathan S. Aase ,  Andrew P. Bright ,  Christopher R. Wilk

    IPC: H04R1/02 ,  H04R1/28 ,  H04R1/10

    Abstract: An earphone comprising an earphone housing having a wall comprising (1) a front side that joins (2) an end portion in which a primary sound output opening is formed, which joins (3) a face portion in which a secondary output opening is formed, which joins (4) a back side which joins the front side and encloses a driver, wherein the primary output opening is dimensioned to output sound generated by a diaphragm of the driver contained within the earphone housing into the ear and the secondary output opening is dimensioned to vent the ear to a surrounding environment, and wherein the primary output opening and the secondary output opening face different directions.

    Seamless earbud structures and methods for making the same
    46.
    发明授权
    Seamless earbud structures and methods for making the same 有权

    公开(公告)号：US10595112B2

    公开(公告)日：2020-03-17

    申请号：US15829415

    申请日：2017-12-01

    Applicant: Apple Inc.

    Inventor： Jonathan S. Aase

    IPC: H04R1/10

    Abstract: Seamless earbud structures and methods for making the same are disclosed. Seamless earbud structures can be constructed using an insert molding construction method, which overmolds a cosmetic material over two sub-enclosures that are mated together. The two sub-enclosures form a housing that can encompass a driver assembly (e.g., woofer and tweeter), a conductor bundle, and provide one or more acoustic volumes. The housing has a non-occluding member and a neck member, and has a seamless or nearly seamless construction. The cosmetic material is insert molded around the housing to provide a smooth and seamless surface disposed around the periphery of the housing.

    Earphone having a controlled acoustic leak port
    48.
    发明授权
    Earphone having a controlled acoustic leak port 有权

    公开(公告)号：US10356510B2

    公开(公告)日：2019-07-16

    申请号：US15723079

    申请日：2017-10-02

    Applicant: Apple Inc.

    Inventor： Michael B. Howes ,  Yacine Azmi ,  Scott P. Porter ,  Jonathan S. Aase ,  Andrew P. Bright ,  Christopher R. Wilk

    IPC: H04R25/00 ,  H04R1/28 ,  H04R1/10 ,  H04R1/02

    Abstract: An earphone comprising an earphone housing having a wall comprising (1) a front side that joins (2) an end portion in which a primary sound output opening is formed, which joins (3) a face portion in which a secondary output opening is formed, which joins (4) a back side which joins the front side and encloses a driver, wherein the primary output opening is dimensioned to output sound generated by a diaphragm of the driver contained within the earphone housing into the ear and the secondary output opening is dimensioned to vent the ear to a surrounding environment, and wherein the primary output opening and the secondary output opening face different directions.

    Pressure sensing earbuds and systems and methods for the use thereof
    49.
    发明授权
    Pressure sensing earbuds and systems and methods for the use thereof 有权

    公开(公告)号：US10299029B2

    公开(公告)日：2019-05-21

    申请号：US16108856

    申请日：2018-08-22

    Applicant: Apple Inc.

    Inventor： Jonathan S. Aase

    IPC: H04R1/10

    Abstract: Pressure sensing earbuds and systems are disclosed. The earbuds can include one or more pressure sensors to determine the size and shape of a user's ear. The pressure signals can be relayed back to a processor, which may use them to dynamically optimize the volume levels delivered for frequencies over the audible range for a particular user.

    MASS LOADED EARBUD WITH VENT CHAMBER
    50.
    发明申请
    MASS LOADED EARBUD WITH VENT CHAMBER 审中-公开

    公开(公告)号：US20180227660A1

    公开(公告)日：2018-08-09

    申请号：US15924049

    申请日：2018-03-16

    Applicant: Apple Inc.

    Inventor： Yacine Azmi ,  Esge B. Andersen ,  Jonathan S. Aase ,  Michael B. Howes

    IPC: H04R1/10 ,  H04R1/28

    CPC classification number: H04R1/1091 ,  H04R1/1016 ,  H04R1/2811 ,  H04R1/2823 ,  H04R1/2826 ,  H04R1/2849

    Abstract: Intra-concha earphones are disclosed. In an embodiment, an intra-concha earphone includes a housing having a rear space divided into a back volume, a bass duct, and a vent chamber between a driver and a rear wall. The vent chamber may be acoustically coupled with the back volume through both an acoustic port and the bass duct. Furthermore, the vent chamber may be acoustically coupled with a surrounding environment through a vent port, which may be a sole acoustic opening in the rear wall. Thus, sound emitted by the driver may propagate through the acoustic port and the bass duct to meet in the vent chamber before being discharged through the vent port to the surrounding environment. Other embodiments are also described and claimed.

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