Charging assembly for wireless power transfer

    公开(公告)号:US10424962B2

    公开(公告)日:2019-09-24

    申请号:US14871890

    申请日:2015-09-30

    Applicant: APPLE INC.

    Abstract: A charging assembly for wireless power transfer. In embodiments, the charging assembly comprises a housing, a cap structure, a ferrimagnetic sleeve, an inductive coil, a magnet, a printed circuit board assembly (PCBA), and a four-pin connector extending from a bottom surface of the PCBA. A ridge of the cap structure can be coupled to a lip of the housing. The housing can include a bottom housing surface having an aperture, and a sidewall extending between the bottom housing surface and the lip that extends outward from the sidewall along a perimeter of the housing parallel to the bottom housing surface. The four-pin connector can extend through the aperture of the housing. Some embodiments are directed to a charging device that incorporates the charging assembly.

    Inductive charging between electronic devices

    公开(公告)号:US10404089B2

    公开(公告)日:2019-09-03

    申请号:US14731280

    申请日:2015-06-04

    Applicant: Apple Inc.

    Abstract: An electronic device and methods for inductively charging an electronic device using another external electronic device. The electronic device may include an enclosure, a battery positioned within the enclosure, and an inductive coil coupled to the battery. The inductive coil may have two or more operational modes, including a power receiving operational mode for wirelessly receiving power and a power transmitting operational mode for wirelessly transmitting power. The electronic device may also have a controller coupled to the inductive coil for selecting one of the operational modes.

    SENSOR MODULES FOR WIRELESS CHARGING MATS
    48.
    发明申请

    公开(公告)号:US20190081517A1

    公开(公告)日:2019-03-14

    申请号:US16127118

    申请日:2018-09-10

    Applicant: Apple Inc.

    Abstract: Embodiments describe a sensor module for a wireless charging device. The sensor module includes a substrate and a plurality of thermal sensor sub-modules formed in and on the substrate, Each thermal sensor sub-module includes a first thermistor and a second thermistor, the first thermistor configured to measure a top surface of the substrate, and the second thermistor configured to measure a bottom surface of the substrate, a first sensor pad and a second sensor pad coupled to respective first and second thermistors, each sensor pad including a first portion and a second portion coupled to a respective thermistor and including a plurality of fins arranged in a fin pattern, and a first through-via and a second through-via, each through-via coupled to a respective terminal of the first thermistor.

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