公开(公告)号：US20080285305A1

公开(公告)日：2008-11-20

申请号：US12021554

申请日：2008-01-29

Applicant: Kouzou Fujino ,  Makoto Ikeda ,  Tomihisa Saitou

Inventor： Kouzou Fujino ,  Makoto Ikeda ,  Tomihisa Saitou

IPC: F21V8/00 ,  F21V11/00

CPC classification number: G02B6/0088 ,  G02B6/0043 ,  G02B6/0073 ,  H04N1/02815 ,  H04N1/02835 ,  H04N1/0289 ,  H04N2201/02462 ,  H04N2201/02479

Abstract: An LED module is mounted on a case frame by fitting three pins formed at a concave portion of the case frame, into holes in the LED module corresponding to the pins. A light-guide plate is fitted into the case frame formed integrally with a bottom cover in a descending direction. The light-guide plate is fixed by a hook provided for the case frame. A space between the light-guide plate and the LED module is prevented by pressing the light-guide plate to the LED module with a pressing spring. Since the light-guide plate is fitted into the case frame in the descending direction and a light scattering sheet is adhered to an outer end surface of the case frame in the descending direction, it is not necessary to reverse the worked product and so the number and time of working processes can be saved.

Abstract translation: LED模块通过将形成在壳体框架的凹部处的三个销嵌入对应于销的LED模块中的孔中而安装在壳体框架上。 导光板装配在与底盖一体地沿下降方向形成的壳体框架中。 导光板通过设置在壳体框架上的钩固定。 通过按压弹簧将导光板按压到LED模块来防止导光板和LED模块之间的空间。 由于导光板沿下降方向嵌入壳体框架中，并且光散射片沿下降方向粘附到壳体框架的外端面，因此不需要使加工的产品反转，因此数量 可以节省工作流程的时间。

公开(公告)号：US20080123368A1

公开(公告)日：2008-05-29

申请号：US12023528

申请日：2008-01-31

Applicant: Kouzou Fujino ,  Makoto Ikeda ,  Tomihisa Saitou

Inventor： Kouzou Fujino ,  Makoto Ikeda ,  Tomihisa Saitou

IPC: F21V8/00

CPC classification number: G02B6/0088 ,  G02B6/0043 ,  G02B6/0073 ,  H04N1/02815 ,  H04N1/02835 ,  H04N1/0289 ,  H04N2201/02462 ,  H04N2201/02479

Abstract: An LED module is mounted on a case frame by fitting three pins formed at a concave portion of the case frame, into holes in the LED module corresponding to the pins. A light-guide plate is fitted into the case frame formed integrally with a bottom cover in a descending direction. The light-guide plate is fixed by a hook provided for the case frame. A space between the light-guide plate and the LED module is prevented by pressing the light-guide plate to the LED module with a pressing spring. Since the light-guide plate is fitted into the case frame in the descending direction and a light scattering sheet is adhered to an outer end surface of the case frame in the descending direction, it is not necessary to reverse the worked product and so the number and time of working processes can be saved.

公开(公告)号：US06894813B2

公开(公告)日：2005-05-17

申请号：US09761493

申请日：2001-01-16

Applicant: Christopher J. Spencer ,  Daniel P. White ,  David A. Bartman

Inventor： Christopher J. Spencer ,  Daniel P. White ,  David A. Bartman

IPC: G03B27/62 ,  H04N1/00 ,  H04N1/031 ,  H04N1/04 ,  H04N1/12 ,  H04N1/40

CPC classification number: H04N1/0312 ,  H04N1/0315 ,  H04N1/0318 ,  H04N1/121 ,  H04N2201/02406 ,  H04N2201/02408 ,  H04N2201/02414 ,  H04N2201/02427 ,  H04N2201/02429 ,  H04N2201/02445 ,  H04N2201/02449 ,  H04N2201/02456 ,  H04N2201/02474 ,  H04N2201/02479 ,  H04N2201/02493 ,  H04N2201/03112 ,  H04N2201/03141 ,  H04N2201/03145

Abstract: An integrated image module for a document scanner includes a one piece die cast housing having a datum element and a support element. An imaging sensor array is enclosed in the housing. An array bias element urges the imaging sensor array against the datum element to provide accurate placement of the sensor array relative to the housing. A transport mechanism is attached to the housing so that the position of the transport mechanism accurately corresponds to the position of the imaging sensor array. The lens and the lamp for illumination are also attached to the housing so that the primary components of the imaging portion of the scanner are contained in a single module.

Abstract translation: 用于文件扫描器的集成图像模块包括具有基准元件和支撑元件的一体式压铸外壳。 成像传感器阵列封装在外壳中。 阵列偏置元件将成像传感器阵列推向基准元件以提供传感器阵列相对于壳体的精确放置。 传送机构附接到壳体，使得传送机构的位置精确地对应于成像传感器阵列的位置。 透镜和用于照明的灯也附接到壳体，使得扫描仪的成像部分的主要部件被包含在单个模块中。