Abstract:
A programmable system-on-a-chip integrated circuit device comprises at least one of a crystal oscillator circuit, an RC oscillator circuit, and an external oscillator input. A clock conditioning circuit is selectively coupleable to one of the programmable logic block, the crystal oscillator circuit, the RC oscillator circuit, and the external oscillator input. A real-time clock is selectively coupleable to one of the programmable logic block, the crystal oscillator circuit, the RC oscillator circuit, and the external oscillator input. A programmable logic block is coupled to the clock conditioning circuit and the real-time clock.
Abstract:
A programmable system-on-a-chip integrated circuit device includes a programmable logic block, at least one user non-volatile memory block, and temperature sensing and control analog and digital circuits on a single semiconductor integrated circuit chip or a flip chip, face-to-face, or other multiple die configuration. The programmable system-on-a-chip integrated circuit with temperature measuring and control circuitry performs temperature measurement and control functions and can be used to create an on-chip temperature log.
Abstract:
A temperature detecting circuit is provided. The temperature detecting circuit includes a reference and detection voltage generator for generating a reference voltage corresponding to a first and a second reference current, and changing first to M-th (M being a natural number) detection currents based on first to M-th temperature detection codes to generate first to M-th detection voltages corresponding to the changed first to M-th detection currents and the second reference current; a temperature detection signal generator for comparing each of the first to M-th detection voltages with the reference voltage to generate first to M-th temperature detection signals; and a temperature detection controller for detecting an operation temperature of a semiconductor device while changing the first to M-th temperature detection codes in response to the first to M-th temperature detection signals from the temperature detection signal generator.
Abstract:
An embodiment of the present invention is a technique for thermal sensing. A sensing structure generates a response according to a local temperature at a first location on a die. A sensor core coupled to the sensing structure via routing lines to provide a measurement of the local temperature from the response. The sensor core is located at a second location remote to the first location and is powered by an analog supply voltage source located in a vicinity of the second location.
Abstract:
Provided is a semiconductor temperature sensor having satisfactory linearity of an output voltage with respect to temperature. In a semiconductor temperature sensor (1), even if the temperature increases and a leakage current is generated at bases of a PNP (8) and a PNP (9), a current which flows into emitters of a PNP (7) and the PNP (8) is not affected by the leakage current by virtue of a leakage current compensation current of a PNP (14), and thus, the linearity of the output voltage with respect to the temperature is improved and the accuracy of the semiconductor temperature sensor (1) with respect to the temperature is improved.
Abstract:
A programmable system-on-a-chip integrated circuit device includes a programmable logic block, at least one user non-volatile memory block, and voltage-measuring and control analog and digital circuits on a single semiconductor integrated circuit chip or a flip chip, face-to-face, or other multiple die configuration. The programmable system-on-a-chip integrated circuit with voltage-measuring, current-measuring and control circuitry performs voltage measurement and control functions and can be used to control and monitor external power supplies connected to external loads.
Abstract:
Disclosed are embodiments of an improved on-chip temperature sensing circuit, based on bolometry, which provides self calibration of the on-chip temperature sensors for ideality and an associated method of sensing temperature at a specific on-chip location. The circuit comprises a temperature sensor, an identical reference sensor with a thermally coupled heater and a comparator. The comparator is adapted to receive and compare the outputs from both the temperature and reference sensors and to drive the heater with current until the outputs match. Based on the current forced into the heater, the temperature rise of the reference sensor can be calculated, which in this state, is equal to that of the temperature sensor.
Abstract:
A computer implemented method, data processing system, and processor are provided for managing a thermal management system. A determination is made as to whether a plurality of digital thermal sensors is faulty or functional. A power savings mode of at least one unit within the integrated circuit associated with the functional digital thermal sensor is monitored in response to at least one of the plurality of digital thermal sensors being functional. A functional digital thermal sensor is disabled in response to the at least one unit being in a power savings mode.
Abstract:
A real-time PCR system for detecting gene expression levels includes plural reaction regions, a like plural number of heating portions arranged corresponding to the reaction regions and having heat sources, respectively, an optical unit capable of irradiating exciting light of a specific wavelength to all of the plural reaction regions, and a like plural number of fluorescence detecting portions arranged corresponding to the reaction regions, respectively. The heating portions are each provided with a temperature detector for detecting a temperature in a vicinity of the corresponding heat source and converting the temperature into an electrical signal and also with a controller for controlling a thermal dose from the corresponding heat source based on a correlation between electrical signals and calorific values of the heat source stored beforehand.
Abstract:
A temperature detection circuit includes a bandgap reference voltage generation circuit, a detection output circuit, and an output conversion circuit. The bandgap reference voltage generation circuit generates a first reference voltage and causes a bias current to flow through a current path to produce a thermal voltage. The current path has a first resistor. The detection output circuit has a second resistor and causes a mirror current of the bias current to flow through the second resistor. The output conversion circuit uses a second reference voltage to convert a voltage drop across the second resistor to a predetermined output form to detect a temperature. The first and second resistors are substantially identical in temperature dependence. The second reference voltage is generated from the first reference voltage.