PHOTORESIST COMPOSITION AND METHOD FOR FORMING A METAL PATTERN
    31.
    发明申请
    PHOTORESIST COMPOSITION AND METHOD FOR FORMING A METAL PATTERN 有权
    光刻胶组合物和形成金属图案的方法

    公开(公告)号:US20140183162A1

    公开(公告)日:2014-07-03

    申请号:US13911984

    申请日:2013-06-06

    Abstract: A method of forming a metal pattern is disclosed. In the method, a metal layer is formed on a base substrate. A photoresist composition is coated on the metal layer to form a coating layer. The photoresist composition includes a binder resin, a photo-sensitizer and a mixed solvent including a first solvent, a second solvent having a higher volatility than the first solvent, and a third solvent having a higher volatility than the second solvent. The coating layer is exposed to light. The coating layer is partially removed to form a photoresist pattern. The metal layer is patterned by using the photoresist pattern as a mask.

    Abstract translation: 公开了一种形成金属图案的方法。 在该方法中,在基底基板上形成金属层。 将光致抗蚀剂组合物涂覆在金属层上以形成涂层。 光致抗蚀剂组合物包括粘合剂树脂,光敏剂和包含第一溶剂,挥发性高于第一溶剂的第二溶剂和比第二溶剂挥发性高的第三溶剂的混合溶剂。 将涂层曝光。 部分去除涂层以形成光致抗蚀剂图案。 通过使用光致抗蚀剂图案作为掩模来对金属层进行构图。

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